Abstract: A method of attaching a boiler tube protectors having a cylindrical or semi-cylindrical shape around an outer peripheral face of a boiler tube with mortar, which boiler tube protectors, are a plurality of ceramic bodies closely arranged along their parting planes, wherein the parting planes includes means for restraining slippage of each of the ceramic bodies along the parting planes.

Abstract: A heat-resistant assembly to shield boiler tubes which does not entail a thick heat-resistant block. This structure would be interposed between the boiler tubes and the combustion gases. Such a structure would be distinguished by the fact that it comprises heat-resistant block 16, itself composed of curved portion 16a, whose inner surface at one point comes in contact with the aforesaid boiler tube 11, and connecting portions 16b, and the aforesaid boiler tube assembly 12. The interlocking attachment structure which interlockingly secures these two components together in such a way that the block can be mounted or removed comprises recess 17, 58 or 68 and tongue 18, 59 or 69.

Abstract: A pin diode is formed by a p.sup.+ collector region, an n type buffer region, an n.sup.- region and an n.sup.+ cathode region. A trench is formed from the surface of n.sup.+ cathode region through n.sup.+ cathode region to reach n.sup.- region. An insulating film is formed along an inner wall surface of trench. A gate electrode layer is formed to oppose to the sidewall of n.sup.+ cathode region with insulating film interposed. A cathode electrode is formed to be electrically connected to n.sup.+ cathode region. An anode electrode is formed to be electrically connected to p.sup.+ collector region. The n.sup.+ cathode region is formed entirely over the surface between trenches extending parallel to each other. Thus, a power semiconductor device in which gate control circuit is simplified and which has good on property can be obtained.

Abstract: An exposure apparatus for transferring a pattern on a mask (M) onto a photosensitive substrate (W) via a projection-optical system can reduce gas fluctuation even if the length of the optical path through gas is relatively long, and even if the diameter of light flux through the gas is relatively large.The projection-optical system satisfies the condition ##EQU1## where .lambda. is a wavelength of exposure light used in the apparatus, .SIGMA.i is a summary of gas sections i in an optical path from the mask to the photosensitive substrate, Li is a length of a gas section i along the optical axis, in m, and Ri is an average of a mask-side diameter and a substrate-side diameter of a light flux in each gas section, the light flux emerging from a maximum image height and advancing within meridional plane, wherein at least one gas section i is filled with helium or neon.

Abstract: A semiconductor device for conducting a in current across a cathode electrode and an anode electrode, includes a thyristor formed of an n.sup.+ floating region connected electrically to the cathode electrode, a p.sup.+ anode connected electrically to the anode electrode, a p base, and an n.sup.- layer. A p.sup.+ diverter is provided inside and outside the p base region. The semiconductor device further includes a gate oxide film and a gate electrode for forming a channel region between the p base and each p.sup.+ diverter and between the n.sup.+ floating region and the n.sup.- layer. When the thyristor is turned off, the hole-current within the p base is split into each p.sup.+ diverter. A semiconductor device superior in controllable current is obtained.

Abstract: A catadioptric optical system in which a first imaging optical system is constructed of a unidirectional optical apparatus which transmits outgoing light from a first plane in one direction only and a bidirectional optical apparatus for transmitting the light that enters and reflecting the same to form an interim image of the first plane. A light guide guides the light from the interim image to a second imaging optical system through which the interim image is reimaged on a second plane. The unidirectional optical apparatus has an optical axis and at least one lens movable along the optical axis.

Abstract: Catadioptric systems are provided, comprising a first imaging system, a plane mirror, and a second imaging system. The first imaging system comprises a single-pass optical system and a double-pass optical system that further comprises a concave mirror and a double-pass lens group. The second imaging system comprises a plane mirror and an aperture. The first imaging system forms an intermediate image of an object; the second imaging system re-images the intermediate image on a substrate. The catadioptric systems satisfy various conditions.

Abstract: A process for manufacturing an electronic component and an apparatus therefor capable of permitting die-bonding, wire-bonding and molding to be successively executed on a through-line. Die-bonding for adhesively mounting IC chips on a lead frame, wire-bonding for connecting bonding pads of the IC chips and the lead frame to each other through lead wires, and molding for forming a resin material into an outer package for covering each of the IC chips are successively executed on a through-line while transferring the lead frame by means of a conveyor.

Abstract: Electronic component packaging case comprising a substantially plate-like body having a substantially spiral passageway formed in its interior, a linear passageway formed therein as a continuation of an outermost circular portion of the sapiral passageway, an outlet formed therein as a continuation of the linear passageway to communicate with the exterior of the body, a plurality of electronic components received in a row in the spiral passageway, and a plurality of air-intakes for facilitating forwarding of the electronic components along the spiral passageway to the outlet, the air-intakes being formed in the casing body in a manner to communicate between respective circular portions of the spiral passageway and the exterior of the casing body, the case being adapted to be supported on a base of an electronic component supply mechanism with the body standing on the base when the case is used as an electronic component supply source, the outlet being formed at a portion of the casing body which is located at

Abstract: A clean transfer system having a first vacuum chamber with a first transfer port, a first shutter for opening and closing the first transfer port and a first connecting member surrounding the first transfer port. The first connecting member is provided with at least an exterior portion. A second vaccum chamber includes a second transfer port, a second shutter for opening and closing the second transfer port, and a second connecting member surrounding the second transfer port. The second connecting member has at least an exterior portion. A closed space is formed between the first and second connecting members, so that the first and second shutters are movable within the closed space.

Abstract: An electronic component feed system capable of feeding an electronic component mounting apparatus with a variety of electronic components such as chips, lead-type electronic components and the like in various forms. A plurality of feeder modules corresponding to sorts of electronic components to be mounted on printed circuit boards are stored in a storage kit and transferred through the storage kit to an electronic component feed section of the mounting apparatus on which a printed circuit board is held. Then, the electronic components are mounted on the printed circuit board by means of a mounting head.

Abstract: The joint boot having excellent cold resistance is obtained by compounding the cross-linking components (a), (b) and (c) with chlorinated polyethylene having a chlorine content of 31 to 34% by weight and molding the resulting compound under thermal conditions.(a) A mercaptotriazine compound,(b) at least one compound selected from the group consisting of amines having a boiling point of not lower than 110.degree. C., organic acid salts of the amines or addition products thereof, diarylguanidine, condensation products of aniline and aldehydes, and 2-benzothiazylsulfenamides of primary or secondary amines, and(c) a metal compound as an acid acceptor.