Abstract: A pattern forming method includes determining an amount of curable resin to be formed on a substrate, the curable resin having volatility, the amount of the curable resin being determined by a calculation considering volatile loss of the curable resin, the calculation being performed for each of a plurality of regions of the substrate, forming the curable resin having the determined amount on the substrate, the forming the curable resin being performed for each of the plurality of regions of the substrate, contacting the curable resin formed on the substrate with a template, the template including a pattern to be filled with the curable resin by the contacting, and curing the curable resin under a condition where the curable resin is in contact with the template.

Abstract: According to one embodiment, a method is disclosed for manufacturing a mold. The method can include forming a second major surface receded from a first major surface by irradiating a portion of the first major surface with a charged beam to etch a base material having the first major surface. The method can include forming a mask pattern on the first major surface and the second major surface. In addition, the method can include forming a first pattern on the first major surface and a second pattern on the second major surface by etching the base material through the mask pattern.

Abstract: According to one embodiment, an imprint method is disclosed. The method can include forming a liquid droplet of a transfer material with a volume greater than a predetermined reference volume by dropping the transfer material onto a major surface of a processing substrate. The method can include reducing the volume of the liquid droplet to be less than the reference volume by volatilizing the liquid droplet. In addition, the method can include filling the transfer material into a recess provided in a transfer surface of a template by bringing the liquid droplet having the volume reduced to be less than the reference volume into contact with the transfer surface of the template.

Abstract: An aspect of the present embodiment, there is provided a method for fabricating a pellicle, including acquiring a shape of a pellicle frame, deciding a thickness distribution of an adhesive to be coated on the pellicle frame on a basis of the acquired shape of the pellicle frame, and coating the adhesive on the pellicle frame based on the decision of the thickness distribution.

Abstract: According to one embodiment, a method for manufacturing a photo mask, includes acquiring first data on respective shapes of a plurality of mask substrates, acquiring second data on respective shapes of a plurality of pellicles, and determining a combination of the mask substrate and the pellicle based on the first data and the second data.

Abstract: According to one embodiment, a pattern formation method is disclosed. The method is configured to transfer a shape of a pattern to a plurality of shot regions of an object using a mold including a first pattern region and a second pattern region aligned with the first pattern region. The method can include transferring the shape of the pattern to each of the plurality of shot regions sequentially in a first direction from the first pattern region toward the second pattern region when the shape of the pattern is transferred using the first pattern region. The method can include transferring the shape of the pattern to each of the plurality of shot regions sequentially in a second direction from the second pattern region toward the first pattern region when the shape of the pattern is transferred using the second pattern region.

Abstract: According to one embodiment, a mold includes a base material, a pedestal portion and a pattern portion. The base material includes a first surface and a second surface. The pedestal portion protruded from the first surface of the base material and includes a side surface. The pattern portion is provided in the pedestal portion and includes an concave-convex pattern. The pedestal portion includes a first region and a second region. The first region is provided with the concave-convex pattern. The second region is provided between the first region and the side surface. The second region has maximum height equal to maximum height of the first region. The second region has a first height of the second region on the side surface side and a second height of the second region on the first region side. The first height is lower than the second height.

Abstract: In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.

Abstract: According to one embodiment, a method is disclosed for manufacturing a mold. The method can include forming a second major surface receded from a first major surface by irradiating a portion of the first major surface with a charged beam to etch a base material having the first major surface. The method can include forming a mask pattern on the first major surface and the second major surface. In addition, the method can include forming a first pattern on the first major surface and a second pattern on the second major surface by etching the base material through the mask pattern.

Abstract: According to one embodiment, a substrate holding apparatus includes a main unit and a plurality of first support units. The main unit has a major surface. The main unit has a plate configuration. The first support units are disposed on the major surface. Each of the first support units includes a suction-holding unit capable of holding a substrate by suction. The suction-holding unit is movable along a first direction perpendicular to the major surface and a second direction parallel to the major surface.

Abstract: According to one embodiment, a method for manufacturing a photo mask, includes acquiring first data on respective shapes of a plurality of mask substrates, acquiring second data on respective shapes of a plurality of pellicles, and determining a combination of the mask substrate and the pellicle based on the first data and the second data.

Abstract: An aspect of the present embodiment, there is provided a method for fabricating a pellicle, including acquiring a shape of a pellicle frame, deciding a thickness distribution of an adhesive to be coated on the pellicle frame on a basis of the acquired shape of the pellicle frame, and coating the adhesive on the pellicle frame based on the decision of the thickness distribution.

Abstract: An imprint method includes applying a light curable resin on a substrate to be processed, the substrate including first and second regions on which the light curable resin is applied, contacting an imprint mold with the light curable resin, curing the light curable resin by irradiating the light curable resin with light passing through the imprint mold, generating gas by performing a predetermined process to the light curable resin applied on a region of the substrate, the region including at least the first region, wherein an amount of gas generated from the light curable resin applied on the first region is larger than an amount of gas generated from the light curable resin of the second region, and forming a pattern by separating the imprint mold from the light curable resin after the gas being generated.

Abstract: According to one embodiment, a pattern forming apparatus includes a stage provided under a lower surface of a substrate, a probe provided above an upper surface of the substrate, a drive unit which drives at least one of the stage and the probe, a monitor/lithography unit connected to the probe, and a control unit which controls the drive unit and the monitor/lithography unit. The control unit is configured to change a relative position between the probe and the substrate, and form a first pattern in an area direct above a second pattern after detecting the first pattern in the substrate by the probe.

Abstract: A template inspection method for performing defect inspection of a template, by bringing a pattern formation surface of a template used to form a pattern close to a first fluid coated on a flat substrate, filling the first fluid into a pattern of the template, and by performing optical observation of the template in a state that the first fluid is sandwiched between the template and the substrate, wherein a difference between an optical constant of the first fluid and an optical constant of the template is larger than a difference between an optical constant of air and the optical constant of the template.

Abstract: According to a method for forming a pattern in one embodiment, a first pattern is formed on a substrate, and an upper part of the first pattern is irradiated with ultraviolet rays, to enhance a liquid-repellent property to an inversion resin material. Furthermore, according to the method for forming the pattern, the inversion resin material is applied to the substrate after the irradiation of the ultraviolet rays, the first pattern is removed after the inversion resin material has been applied to form a second pattern containing the inversion resin material, and the substrate is processed using the second pattern as a mask.

Abstract: An imprint method includes contacting a template on a first substrate. The template includes a pattern to be transferred on the first substrate. The first substrate includes a first semiconductor substrate, and a first light curable resin coated on the first semiconductor substrate. The method further includes separating the template from the first substrate, and removing particles adhered on the template. The particle removal includes: pressing the template on an adhesive member which is distinct from the first substrate. The adhesive member includes a dummy substrate, a particle removing film formed on the dummy substrate and configured to remove the particles, and a second light curable resin coated on the particle removing film. The second light curable resin is thicker than the first light curable resin.

Abstract: A control method for a semiconductor manufacturing apparatus, comprising: generating, as log data, a history of operation states of the semiconductor manufacturing apparatus when a wafer is processed by the semiconductor manufacturing apparatus; specifying, based on the log data, processing results in which operation states of the semiconductor manufacturing apparatus are abnormal states out of processing results after the processing of the wafer processed by the semiconductor manufacturing apparatus as abnormal processing results; creating control data for the semiconductor manufacturing apparatus based on the processing results and the abnormal processing results; and controlling the processing by the semiconductor manufacturing apparatus using the control data.

Abstract: In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.

Abstract: In one embodiment, a pattern formation method is disclosed. The method can place a liquid resin material on a workpiece substrate. The method can press a template against the resin material and measuring distance between a lower surface of a projection of the template and an upper surface of the workpiece substrate. The template includes a pattern formation region and a circumferential region around the pattern formation region. A pattern for circuit pattern formation is formed in the pattern formation region and the projection is formed in the circumferential region. The method can form a resin pattern by curing the resin material in a state of pressing the template. In addition, the method can separate the template from the resin pattern.