Abstract: An optical axis adjustment method for optical interconnection, includes: providing, on a substrate, an optical transmitter including light sources and a mark for acquiring a position of each of the light sources; providing, on the substrate, an optical waveguide including cores each allowing light emitted from the respective light sources to propagate through the core; determining a first position based on the mark as a position of each of the light sources; and forming, at a second position in the optical waveguide corresponding to the first position, first mirrors configured to reflect the light emitted from the respective light sources and make the light propagate through the respective cores.

Abstract: A circuit board disclosed herein includes: two substrates opposed to each other, where a dielectric being interposed between the two substrates; a through hole formed in each of the two substrates and filled with the dielectric; a first conductor film formed on an inner surface of the through hole; and a second conductor film covering the through hole on a main surface of each of the two substrates on an opposite side to the dielectric, the second conductor film being connected to the first conductor film on the main surface side.

Abstract: An electronic device includes a board including an electronic component, a plurality of optical interface units that include an optical element which input or output light and that are provided on the board, and a plurality of individual positioning units that position a plurality of respective optical waveguides which are separate from each other at least at tip portions on a side of the optical interface units and which are optically aligned with the optical element with respect to the optical interface units independently from each other.

Abstract: A coating composition comprising a hydrolyzable silyl-containing (meth)acrylic copolymer which is obtained from copolymerization of an alkyl (meth)acrylate with a silane compound having a long-chain alkylene linker between a hydrolyzable functional group and a radically polymerizable unsaturated group, and an organometallic catalyst is low-temperature curable and isocyanate-free. Even though the silane content is increased for coating hardness, the composition maintains alkali resistance and has good adhesion and solvent resistance when applied onto substrates.

Abstract: A method for manufacturing an optical transmission device, includes: arranging a plurality of optical waveguides including waveguide mirrors, a transmission-side optical module and a reception-side optical module on one side of a substrate; photographing, with a photographic device, at least one waveguide mirror, and the transmission-side optical module or the reception-side optical module corresponding to the waveguide mirror, from another side of the substrate via an opening formed in the substrate; detecting optical-axis centers of the transmission-side optical module or optical-axis centers of the reception-side optical module, and central positions of reflective surfaces of the waveguide mirrors corresponding to the detected optical-axis centers, from a result of the photographing; and aligning and fixing a position relationship between the optical waveguides and the transmission-side optical module or the reception-side optical module based on a result of the detecting.

Abstract: An optical coupling structure includes a light source that emits light; and an optical waveguide that has on a given end, a mirror surface that reflects the light emitted from the light source, the optical waveguide guiding the light reflected by the mirror surface to another end. In the optical coupling structure, a traveling direction of the light emitted from the light source is inclined toward the given end of the optical waveguide and is, with respect to a normal line of the mirror surface, at an angle that is greater than 45 degrees and that satisfies a condition for complete reflection of light on the mirror surface and a condition for complete reflection of light in the optical waveguide.

Abstract: The present invention relates to an organopolysiloxane compound which is either a linear or a branched, and having at least one unit of the following formula (1) as a partial structure, and according to this compound, a novel polyorganosiloxane compound having an ethynyl group, and a method for preparing a linear organopolysiloxane compound having ethynyl groups at both terminals of a molecular chain which can easily adjust a polymerization degree, and excellent in productivity can be provided.

Abstract: An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.

Abstract: A circuit board includes: a substrate; a through hole formed in the substrate; and a connection terminal provided in the through hole; wherein the connection terminal includes a pedestal portion provided within the through hole and a pin which is provided at a center of the pedestal portion and extends from the pedestal portion toward a first surface of the substrate, so that a first end portion protrudes from the first surface.

Abstract: A method for manufacturing a composite molded article including: preparing a main body member to which a through hole is formed to a peripheral wall by removing a protruding portion protruding from a face of the peripheral wall surrounding a hollow space in the main body member having the hollow space formed therein along the longitudinal direction; setting the main body member in an injection molding die; forming a cushion member molding cavity by the main body member and a molding die face formed inside the injection molding die in the longitudinal direction of the main body member and allowing the through hole to communicate with the cavity; and filling a heated and melted elastic polymer material injected from an injection gate into the cavity and the hollow space from the through hole, thereby forming a cushion member and a filling portion.

Abstract: A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.

Abstract: An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.

Abstract: An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.

Abstract: A coating composition comprising a hydrolyzable silyl-containing (meth)acrylic copolymer which is obtained from copolymerization of an alkyl (meth)acrylate with a silane compound having a long-chain alkylene linker between a hydrolyzable functional group and a radically polymerizable unsaturated group, and an organometallic catalyst is low-temperature curable and isocyanate-free. Even though the silane content is increased for coating hardness, the composition maintains alkali resistance and has good adhesion and solvent resistance when applied onto substrates.

Abstract: A coating composition comprising (A) an organosiloxane obtained from hydrosilylation reaction of an organohydrogensiloxane having at least two hydrosilyl groups with an alkenyl-containing alkoxysilane, and (B) an organometallic catalyst is fast curable at low temperature. The cured coating is crack resistant.

Abstract: A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.

Abstract: A method for manufacturing an optical transmission device, includes: arranging a plurality of optical waveguides including waveguide mirrors, a transmission-side optical module and a reception-side optical module on one side of a substrate; photographing, with a photographic device, at least one waveguide mirror, and the transmission-side optical module or the reception-side optical module corresponding to the waveguide mirror, from another side of the substrate via an opening formed in the substrate; detecting optical-axis centers of the transmission-side optical module or optical-axis centers of the reception-side optical module, and central positions of reflective surfaces of the waveguide mirrors corresponding to the detected optical-axis centers, from a result of the photographing; and aligning and fixing a position relationship between the optical waveguides and the transmission-side optical module or the reception-side optical module based on a result of the detecting.

Abstract: An electronic device includes a board including an electronic component, a plurality of optical interface units that include an optical element which input or output light and that are provided on the board, and a plurality of individual positioning units that position a plurality of respective optical waveguides which are separate from each other at least at tip portions on a side of the optical interface units and which are optically aligned with the optical element with respect to the optical interface units independently from each other.

Abstract: A light emitting member mounting method includes: causing a friction material to contact a substrate including at least an optical waveguide member mounted on a base and to contact a light emitting member that is to be mounted to the substrate and that is equipped with a light emitting component, so as to suppress relative movement between the substrate and the light emitting member using frictional force exerted on the substrate and the light emitting member, and positionally aligning the light emitting member to the substrate by employing light emitted from the light emitting component; and bonding the substrate and the light emitting member together by melting a bonding material interposed between the substrate and the light emitting member.

Abstract: A method of manufacturing a photoelectric composite substrate, includes: aligning and fixing an optical element having a solder terminal to an optical waveguide for forming a path of an optical signal on a printed circuit board; mounting the optical waveguide, to which the optical element is fixed, on the printed circuit board; and welding the solder terminal to an electrode of a package installed on the printed circuit board or an electrode of the printed circuit board.