Abstract: A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.

Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

Abstract: A light emitting member mounting method includes: causing a friction material to contact a substrate including at least an optical waveguide member mounted on a base and to contact a light emitting member that is to be mounted to the substrate and that is equipped with a light emitting component, so as to suppress relative movement between the substrate and the light emitting member using frictional force exerted on the substrate and the light emitting member, and positionally aligning the light emitting member to the substrate by employing light emitted from the light emitting component; and bonding the substrate and the light emitting member together by melting a bonding material interposed between the substrate and the light emitting member.

Abstract: An optical coupling structure includes a light source that emits light; and an optical waveguide that has on a given end, a mirror surface that reflects the light emitted from the light source, the optical waveguide guiding the light reflected by the mirror surface to another end. In the optical coupling structure, a traveling direction of the light emitted from the light source is inclined toward the given end of the optical waveguide and is, with respect to a normal line of the mirror surface, at an angle that is greater than 45 degrees and that satisfies a condition for complete reflection of light on the mirror surface and a condition for complete reflection of light in the optical waveguide.

Abstract: A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.

Abstract: A method for manufacturing a composite molded article including: preparing a main body member to which a through hole is formed to a peripheral wall by removing a protruding portion protruding from a face of the peripheral wall surrounding a hollow space in the main body member having the hollow space formed therein along the longitudinal direction; setting the main body member in an injection molding die; forming a cushion member molding cavity by the main body member and a molding die face formed inside the injection molding die in the longitudinal direction of the main body member and allowing the through hole to communicate with the cavity; and filling a heated and melted elastic polymer material injected from an injection gate into the cavity and the hollow space from the through hole, thereby forming a cushion member and a filling portion.

Abstract: A printed wiring board includes a land formed on a surface layer, at least one power supply pattern formed on a layer except the surface layer on which the land is formed, a plurality of vias which includes a first via electrically connected to the power supply pattern and a second via electrically connected to the power supply pattern and the first via and the second via are electrically connected to the land.

Abstract: A printed wiring board is disclosed that includes insulating layers, conductive layers stacked with the insulating layers alternately, a through hole penetrating the insulating layers and the conductive layers, a first plate resist part formed on a first portion of an inner wall of the through hole, the first portion being located from one end of the through hole to one of the conductive layers stacked between one pair of the insulating layers, and a plated part formed on a second portion of the inner wall of the through hole other than the first portion.

Abstract: An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.

Abstract: A wiring board unit includes a connector having a plurality of terminals; and a wiring board on which the connector is mounted. The wiring board includes a first wiring pattern provided on a first wiring layer, a second wiring pattern provided on a second wiring layer at a position shallower than the first wiring layer, a first via formed in a first recess having a first depth, the first via being in contact with the first wiring pattern, and a second via formed in a second recess having a second depth that is smaller than the first depth, the second via being in contact with the second wiring pattern.

Abstract: A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.

Abstract: A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.

Abstract: A method for manufacturing an optical waveguide in which multiple cores are embedded in a parallel-arranged fashion within a single cladding, the cores having a refractive index of light different from that of the cladding, the method includes forming the multiple cores in a state where the adjacent cores are connected by a rib, forming the cladding around the rib and the multiple cores by curing a cladding material there around, and a cutting to the rib.

Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

Abstract: A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.

Abstract: A printed wiring board includes a land formed on a surface layer, at least one power supply pattern formed on a layer except the surface layer on which the land is formed, a plurality of vias which includes a first via electrically connected to the power supply pattern and a second via electrically connected to the power supply pattern and the first via and the second via are electrically connected to the land.

Abstract: A composition for a gasket which comprises (A) 100 parts by weight of a urethane acrylate oligomer having a weight-average molecular weight of 7,000 to 40,000, (B) 40 to 260 parts by weight of a polyether monoacrylate substituted at the end and/or a polyether polyester monoacrylate substituted at the end, and (C) 0.5 to 5 parts by weight of a photopolymerization initiator and has a viscosity of 4,000 to 100,000 centipoises at 25.degree. C.; and a process for producing a gasket by discharging the above composition on a substrate by using an X-Y-Z-driving automatic coating robot and curing the discharged composition by irradiation of ultraviolet light.A gasket can be formed to an accurate shape. Operations of forming and attaching the gasket can easily be conducted, and loss of the used material can be reduced. The gasket has a large tearing strength and a small compression set and is excellent in the flexibility and the sealing property.

Abstract: A cable connector includes cables, and jacks attached to ends of the cables. The jacks have contacts connected to the cables. The contacts extend in a first direction substantially perpendicular to a second direction in which the cables extend from the jacks.

Abstract: A cylinder head construction for a multiple valve engine that permits the use of at least three intake valves while permitting a single piece head construction and offering ease of access of the hold down fasteners for the cylinder head. The intake tappets are all slidably supported within a projection of the cylinder head with the outer tappets being positioned closer to a plane containing the cylinder bore axis so that fastener receiving bores can be formed outwardly from this point without interference from the projection.