Patents by Inventor Tetsuya Hirose

Tetsuya Hirose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5136123
    Abstract: A multilayer circuit board is provided having an inner porous fluororesin layer containing electrical circuits, a ground conductor layer located adjacent the fluororesin layer on one side thereof and a power supply conductor layer located adjacent the fluororesin layer on the other side thereof, and a reinforcing, solid plastic dielectric layer adjacent each conductor layer and being external to the inner fluororesin layer. In an alternate embodiment, the multilayer circuit board may have a plurality of inner porous fluororesin layers, at least one fluororesin layer containing electrical circuits, and may have ground conductors and power supply conductors adjacent each fluororesin layer, and reinforcing, solid plastic dielectric layers on the outermost surfaces of the circuit board assembly. The ground and power supply conductor layers extend over the entire surfaces, respectively, of the inner fluororesin layers.
    Type: Grant
    Filed: March 23, 1988
    Date of Patent: August 4, 1992
    Assignee: Junkosha Co., Ltd.
    Inventors: Satoru Kobayashi, Masahiro Suzuki, Satoshi Tanaka, Tetsuya Hirose
  • Patent number: 4858659
    Abstract: An apparatus for forming and cutting a flat type multi-core cable is disclosed, in which core conductors of a flat type multi-core cable, whose core conductors are previously exposed by exfoliating a part of a jacket therefor, are divided into a plurality of units; the core conductors are formed and cut separately for every unit; and at the same time the pitch of the core conductors is corrected. Further the number and/or the pitch of the core conductors are calculated by using information obtained by the scanning of the core conductors and cables, for which the number of the core conductors is not in agreement with predetermined one, or cables, for which errors in the pitch of the core conductors exceed a certain limit, are excluded as deficiencies.
    Type: Grant
    Filed: July 6, 1988
    Date of Patent: August 22, 1989
    Assignees: Hitachi, Ltd., Hitachi Cable, Ltd.
    Inventors: Satoru Ezaki, Kiyofumi Tanaka, Tsukasa Kasahara, Tetsuya Hirose, Tetsuro Nakagawa
  • Patent number: 4781969
    Abstract: A printed circuit board is provided wherein a composite metal layer is affixed to at least one surface of a flexible dielectric substrate, the composite metal layer comprising an inner aluminum layer and an outer copper layer. Owing to the relatively high elongation of the aluminum layer, when the printed circuit board is flexed the circuit thereon does not crack.
    Type: Grant
    Filed: September 29, 1987
    Date of Patent: November 1, 1988
    Assignee: Junkosha Co., Ltd.
    Inventors: Satoru Kobayashi, Tetsuya Hirose, Masahiro Suzuki