Patents by Inventor Tetsuya Iida

Tetsuya Iida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210009213
    Abstract: A work vehicle includes an driver's seat disposed in the rear region of a vehicle body, a left and a right fender that are disposed on the left and right laterally outward sides of the driver's seat, and a partition wall that divides, at a position behind the driver's seat, the vehicle body into a front region of the vehicle body on the front side of the partition wall and a rear region of the vehicle body on the back side thereof. Operation tools for operating working equipment provided on the vehicle body are disposed on one of the fenders, and the partition wall is provided offset toward a side where operation tools are disposed relative to the driver's seat.
    Type: Application
    Filed: March 1, 2019
    Publication date: January 14, 2021
    Applicant: YANMAR POWER TECHNOLOGY CO., LTD.
    Inventors: Toshitaka Komiya, Tetsuya Iida, Shimpachi Fushimi, Takashi Goto
  • Patent number: 10886213
    Abstract: A semiconductor device has a coil and wirings under the coil. In addition, a distance between the upper face of the wirings and the bottom face of the coil is 7 ?m or larger, and the wirings have a plurality of linear wiring parts each wiring width of which is 1 ?m or smaller. In addition, the linear wiring parts do not configure a loop wiring, and the coil and the linear wiring parts are overlapped with each other in planar view.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: January 5, 2021
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Teruhiro Kuwajima, Yasutaka Nakashiba, Akira Matsumoto, Akio Ono, Tetsuya Iida
  • Publication number: 20200409231
    Abstract: A semiconductor device has a first semiconducting layer including an optical waveguide, a dielectric layer formed on the optical waveguide, and a conductive layer formed on the dielectric layer. A refractive index of a material of the conductive layer is smaller than a refractive index of a material of the first semiconductor layer.
    Type: Application
    Filed: May 12, 2020
    Publication date: December 31, 2020
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Tetsuya IIDA, Yasutaka NAKASHIBA
  • Publication number: 20200365508
    Abstract: A semiconductor device has a coil and wirings under the coil. In addition, a distance between the upper face of the wirings and the bottom face of the coil is 7 ?m or larger, and the wirings have a plurality of linear wiring parts each wiring width of which is 1 ?m or smaller. In addition, the linear wiring parts do not configure a loop wiring, and the coil and the linear wiring parts are overlapped with each other in planar view.
    Type: Application
    Filed: August 4, 2020
    Publication date: November 19, 2020
    Inventors: Teruhiro KUWAJIMA, Yasutaka NAKASHIBA, Akira MATSUMOTO, Akio ONO, Tetsuya IIDA
  • Patent number: 10829522
    Abstract: A peptide capable of preventing pathogenic bacteria from colonizing in digestive organs comprises a first domain having an amino acid sequence capable of binding to a minor pilin of IVb fimbriae, and a second domain having an amino acid sequence capable of multimerization, the second domain connect to the first domain via a linker sequence.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: November 10, 2020
    Assignees: OSAKA UNIVERSITY, BIKENBIOMICS CO., LTD.
    Inventors: Shota Nakamura, Kazuki Kawahara, Hiroya Oki, Takuya Yoshida, Tadayasu Ohkubo, Yuji Kobayashi, Takahiro Maruno, Daisuke Motooka, Shigeaki Matsuda, Toshio Kodama, Tetsuya Iida, Yasumitsu Tsujino, Shunsuke Fukakusa
  • Patent number: 10833223
    Abstract: To provide a Group III nitride semiconductor light-emitting device exhibiting the improved light extraction efficiency as well as reducing the influence of polarization that a p-type conductivity portion and an n-type conductivity portion occur in the AlGaN layer caused by the Al composition variation, and a production method therefor. A first p-type contact layer is a p-type AlGaN layer. A second p-type contact layer is a p-type AlGaN layer. The Al composition in the first p-type contact layer is reduced with distance from a light-emitting layer. The Al composition in the second p-type contact layer is reduced with distance from the light-emitting layer. The Al composition in the second p-type contact layer is lower than that in the first p-type contact layer. The Al composition variation rate to the unit thickness in the second p-type contact layer is higher than that in the first p-type contact layer.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: November 10, 2020
    Assignees: TOYODA GOSEI CO., LTD., MEIJO UNIVERSITY
    Inventors: Tetsuya Takeuchi, Satoshi Kamiyama, Motoaki Iwaya, Isamu Akasaki, Hisanori Kojima, Toshiki Yasuda, Kazuyoshi Iida
  • Patent number: 10818591
    Abstract: A method of manufacturing a semiconductor device includes a step of: patterning a conductive film formed over an interlayer insulating film so as to form a coil and a conductive pattern in the same layer, and then forming unevennesses on a surface of the interlayer insulating film by etching a portion of the interlayer insulating film with using the coil and the conductive pattern as a mask.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: October 27, 2020
    Assignee: Renesas Electronics Corporation
    Inventors: Shinichi Uchida, Yasutaka Nakashiba, Tetsuya Iida, Shinichi Kuwabara
  • Patent number: 10818650
    Abstract: The semiconductor module includes a semiconductor chip and a semiconductor chip. The semiconductor chip includes an optical device such as an optical waveguide, an optical receiver, and a grating coupler, and a wiring formed over the optical device. The semiconductor chip includes a semiconductor element such as a MISFET formed in the semiconductor substrate, and a wiring formed over the semiconductor element. a top surface of the semiconductor chip is laminated to a top surface of the semiconductor chip such that the wirings are in direct contact with each other. In the semiconductor substrate, a through hole having a circular shape in plan view is formed, in the through hole, an insulating film is formed as a cladding layer, and the semiconductor substrate surrounded by the through hole constitutes an optical waveguide.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: October 27, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Tetsuya Iida, Yasutaka Nakashiba
  • Patent number: 10804642
    Abstract: A shield cover (1) made of metal is configured to be attached to a device and includes a cover body (10) configured to cover a shield target. Two planar attachment plates (11, 13) protrude from the cover body (10). Bolt insertion holes (11A, 13A) extend through the respective attachment plates (11, 13) in a thickness direction thereof and receive bolts (30) for attaching the shield cover (1) to the device. The attachment plates (11, 13) are configured to be attached to the device with brackets (20) sandwiched between the device and the attachment plates (11, 13). A rib (12) extends up along an edge of at least one of the attachment plates (11, 13) to reinforce a portion of the attachment plate (11, 13) that will not be sandwiched between the bolt (30) and the bracket (20).
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: October 13, 2020
    Assignees: Sumitomo Wiring Systems, Ltd., Toyota Jidosha Kabushiki Kaisha
    Inventors: Tetsuya Iida, Yosuke Kurono, Tatsuhiko Mizutani
  • Publication number: 20200295530
    Abstract: A semiconductor device includes a cladding layer and a first optical waveguide. The first optical waveguide is formed on the first cladding layer. An end surface of the first optical waveguide is inclined relative to a vertical line perpendicular to an upper surface of the cladding layer.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 17, 2020
    Inventors: Tetsuya IIDA, Yasutaka NAKASHIBA
  • Publication number: 20200269735
    Abstract: In the vehicle seat, rear suspension members are provided at two positions spaced away from each other in a lateral direction on an edge of a seat cushion near a seatback, and support the seat cushion while the seat cushion is suspended from a seat cushion support frame so that the seat cushion is movable in the lateral direction. A front suspension member is provided at one position or two positions spaced away from each other in the lateral direction on ahead of the rear suspension members, and supports the seat cushion while the seat cushion is suspended from the seat cushion support frame so that the seat cushion is movable in the lateral direction.
    Type: Application
    Filed: February 20, 2020
    Publication date: August 27, 2020
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tetsuya NAGAI, Kohshi KATOH, Takashi SUGIMOTO, Osamu ODA, Ryunosuke SEKI, Kenji IIDA, AKira TAKINAMI, Masatoshi HADA
  • Patent number: 10753271
    Abstract: In a system for controlling an internal combustion engine, first opening determination of determining whether to open an air bypass valve 22 on the basis of a compressor flow rate (target compressor flow rate QAIRCMD) passing through a compressor 17 and a compressor front-rear pressure ratio P2/P1, and second opening determination of determining whether to open the air bypass valve 22 on the basis of an opening ratio reduction amount DRTHO as a reduction amount of an opening ratio RTHO of a throttle valve 13 are performed. The air bypass valve 22 is opened when it is determined in both of the first opening determination and the second opening determination that the air bypass valve 22 should be opened.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: August 25, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Tetsuya Iida, Yujiro Tsutsumi, Ayumu Horiba
  • Patent number: 10720411
    Abstract: A semiconductor device includes a first semiconductor chip having a first inductor element and a second inductor element on a first main surface side, a second semiconductor chip having a third inductor element on a second main surface side, and a third semiconductor chip having a fourth inductor element on a third main surface side. The first and second inductor elements are arranged to be separated from each other in a first direction of the first main surface, the first and second main surfaces face each other, and the first and third inductor elements overlap each other. The first and third main surfaces face each other, the second and fourth inductor elements overlap each other, and a creepage distance between the second and third semiconductor chips is larger than a separation distance between the second and third semiconductor chips.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: July 21, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Shinichi Kuwabara, Yasutaka Nakashiba, Tetsuya Iida
  • Patent number: 10711689
    Abstract: A control device is provided capable of reliably preventing occurrence of a surging state by judging a possibility of the surging state in a relatively easy manner and promptly executing a surging state avoidance control. When a supercharging pressure decreasing state in which a target supercharging pressure decreases is detected, an operating speed of a wastegate valve is determined based on a detected engine rotational speed. That is, by lowering the operating speed as the engine rotational speed lowers, reduction in flow rate of the air passing through a compressor is prevented, and the occurrence of the surging state is reliably prevented. By lowering the operating speed instead of changing a target opening degree of the wastegate valve, a maximum opening degree of the wastegate valve can be suppressed, and responsiveness in the case where an acceleration request is made immediately after deceleration of an engine can be improved.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: July 14, 2020
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yuichi Masukake, Tetsuya Iida, Yujiro Tsutsumi, Ayumu Horiba
  • Publication number: 20200161278
    Abstract: The control system according to embodiments includes a switching element, a control unit controlling the conductive state of the switching element, and a first capacitor storing charge supplied to the control unit. The first capacitor and the control unit are connected with each other via the switching element.
    Type: Application
    Filed: October 10, 2019
    Publication date: May 21, 2020
    Inventors: Shinichi KUWABARA, Yasutaka NAKASHIBA, Tetsuya IIDA
  • Publication number: 20200161284
    Abstract: The semiconductor module includes a semiconductor chip and a semiconductor chip. The semiconductor chip includes an optical device such as an optical waveguide, an optical receiver, and a grating coupler, and a wiring formed over the optical device. The semiconductor chip includes a semiconductor element such as a MISFET formed in the semiconductor substrate, and a wiring formed over the semiconductor element. a top surface of the semiconductor chip is laminated to a top surface of the semiconductor chip such that the wirings are in direct contact with each other. In the semiconductor substrate, a through hole having a circular shape in plan view is formed, in the through hole, an insulating film is formed as a cladding layer, and the semiconductor substrate surrounded by the through hole constitutes an optical waveguide.
    Type: Application
    Filed: October 10, 2019
    Publication date: May 21, 2020
    Inventors: Tetsuya IIDA, Yasutaka NAKASHIBA
  • Patent number: 10656442
    Abstract: In an optical waveguide supplied with electricity by using a heater, miniaturization of the device is achieved by enhancing heat dissipation efficiency and heat resistance. In a modulator including an optical waveguide formed on an insulating film, a first interlayer insulating film that covers the optical waveguide, a heater formed on the first interlayer insulating film, and a second interlayer insulating film that covers the heater, a heat conducting portion adjacent to the optical waveguide and the heater and penetrating the first and second interlayer insulating films is formed.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: May 19, 2020
    Assignee: Renesas Electronics Corporation
    Inventors: Tetsuya Iida, Yasutaka Nakashiba, Shinichi Kuwabara
  • Publication number: 20200109638
    Abstract: A gas turbine includes a plurality of first-stage stator vanes arranged in a circumferential direction, the first-stage stator vanes each including a vane surface having a pressure surface and a suction surface, a first combustor disposed on a suction surface side of one of the first-stage stator vanes, the first combustor having a first combustor outlet which includes a first side wall portion extending along a radial direction, and a second combustor disposed on a pressure surface side of the one of the first-stage stator vanes and adjacent to the first combustor in the circumferential direction. The one of the first-stage stator vanes satisfies 0.05??y/P?0.25, where ?y is a protruding amount of the suction surface from the inner wall surface of the first side wall portion to the circumferential direction, and P is an arrangement pitch of the first-stage stator vanes in the circumferential direction.
    Type: Application
    Filed: June 19, 2018
    Publication date: April 9, 2020
    Inventors: Tetsuya SHIMMYO, Shunsuke TORII, Koichiro IIDA, Hitoshi KITAGAWA, Kenji SATO, Kentaro TOKUYAMA
  • Publication number: 20200109139
    Abstract: The present invention relates to a pyrimidine compound or a pharmaceutically acceptable salt thereof represented by the following formula [I] wherein each symbol is as defined in the specification and a method of therapeutically or prophylactically treating an undesirable cell proliferation, comprising administering such a compound. The compound of the present invention has superior activity in suppressing undesirable cell proliferation, particularly, an antitumor activity, and is useful as an antitumor agent for the prophylaxis or treatment of cancer, rheumatism, and the like. In addition, the compound of the present invention can be a more effective antitumor agent when used in combination with other antitumor agents such as an alkylating agent or metabolism antagonist.
    Type: Application
    Filed: May 20, 2019
    Publication date: April 9, 2020
    Applicant: Japan Tobacco Inc.
    Inventors: Hisashi KAWASAKI, Hiroyuki ABE, Kazuhide HAYAKAWA, Tetsuya IIDA, Shinichi KIKUCHI, Takayuki YAMAGUCHI, Toyomichi NANAYAMA, Hironori KURACHI, Masahiro TAMARU, Yoshikazu HORI, Mitsuru TAKAHASHI, Takayuki YOSHIDA, Toshiyuki SAKAI
  • Publication number: 20200111591
    Abstract: Provided is a rare earth sintered magnet in which a multi-layer main phase particle having multiple layers including a layer 1 having R2 concentration, represented by at %, higher than that of a center of the particle, a layer 2 which is formed on the outside of the layer 1 and has R2 concentration lower than that of the layer 1, and a layer 3 which is formed on the outside of the layer 2 and has R2 concentration higher than that of the layer 2 is present at least in a portion in the vicinity of a surface of the main phase particle within at least 500 ?m from a surface of the sintered magnet body.
    Type: Application
    Filed: October 3, 2019
    Publication date: April 9, 2020
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tetsuya Ohashi, Hiroki Iida, Koichi Hirota, Hajime Nakamura, Mikio Yoshida, Kazuya Fukui, Michihiro Oida