Abstract: Genetically modified CCNT1 and XPO1 genes encoding proteins that inhibit virus infection in cells. The genetically modified CCNT1 gene encodes a protein with a C261Y substitution with respect to the human CCNT1 protein. The genetically modified XPO1 gene encodes a protein with P411T, M412V, and/or F414S substitutions with respect to the human XPO1 protein. The genetically modified CCNT1 and XPO1 genes can be introduced in cells. The cells comprising the genetically modified CCNT1 and XPO1 genes can be introduced in a subject with a virus infection to treat the infection.

Abstract: In some examples, a device includes a semiconductor element, a layer element, and a single connector element electrically connecting the semiconductor element and the layer element. In some examples, the single connector element includes two or more discrete connector elements, and each discrete connector element of the two or more discrete connector elements electrically connects the semiconductor element and the layer element. In some examples, the single connector element also includes conductive material attached to the two or more discrete connector elements.

Abstract: A milling system for milling a track surface with at least one rotatable milling plate. A modular blade system for each milling plate allows individual blades to be removed and replaced when an individual blade becomes dull or broken. The blade system also allows the milling plates to be oriented in both Type 2 and Type 3 configurations depending upon track surroundings and the presence of encumbrance. The milling plates can be mounted to a positioning assembly for adjusting the relative distance between the milling plate and the track surface as well as the angle at which the milling plate engages the track surface. The milling system can include a depth guide so as to physically prevent the milling plate from cutting too deeply into the track surface.

Abstract: A chip arrangement including a chip comprising a chip back side; a back side metallization on the chip back side, the back side metallization including a plurality of layers; a substrate comprising a surface with a metal layer; a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc; wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate. The plurality of layers may include one or more of a contact layer configured to contact a semiconductor material of the chip back side; a barrier layer; a solder reaction, and an oxidation protection layer configured to prevent oxidation of the solder reaction layer.

Abstract: A milling system for milling a track surface with at least one rotatable milling plate. A modular blade system for each milling plate allows individual blades to be removed and replaced when an individual blade becomes dull or broken. The blade system also allows the milling plates to be oriented in both Type 2 and Type 3 configurations depending upon track surroundings and the presence of encumbrance. The milling plates can be mounted to a positioning assembly for adjusting the relative distance between the milling plate and the track surface as well as the angle at which the milling plate engages the track surface. The milling system can include a depth guide so as to physically prevent the milling plate from cutting too deeply into the track surface.

Abstract: A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

Abstract: A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator and the first chip.

Abstract: A milling system for milling a track surface with at least one rotatable milling plate. A modular blade system for each milling plate allows individual blades to be removed and replaced when an individual blade becomes dull or broken. The blade system also allows the milling plates to be oriented in both Type 2 and Type 3 configurations depending upon track surroundings and the presence of encumbrance. The milling plates can be mounted to a positioning assembly for adjusting the relative distance between the milling plate and the track surface as well as the angle at which the milling plate engages the track surface. The milling system can include a depth guide so as to physically prevent the milling plate from cutting too deeply into the track surface.

Abstract: A method of manufacturing a component is disclosed. An embodiment of the method comprises dicing a carrier in a plurality of components, the carrier being disposed on a support carrier, after dicing, placing a connection layer on the carrier and removing the components from the support carrier.

Abstract: A method of manufacturing a component is disclosed. An embodiment of the method comprises dicing a carrier in a plurality of components, the carrier being disposed on a support carrier, after dicing, placing a connection layer on the carrier and removing the components from the support carrier.

Abstract: A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

Abstract: An integrated circuit device includes a semiconductor chip and a control chip at different supply potentials. A lead chip island includes an electrically conductive partial region and an insulation layer. The semiconductor chip is arranged on the electrically conductive partial region of the lead chip island and the control chip is cohesively fixed on the insulation layer.

Abstract: A semiconductor device includes a metal carrier and a spacer element attached to the metal carrier. The semiconductor device includes a first sintered metal layer on the spacer element and a semiconductor chip on the first sintered metal layer.

Abstract: An integrated circuit device includes a semiconductor chip with a metallization layer on the chip. A gas-phase deposited insulation layer is disposed on the metallization layer.

Abstract: A method of configuring a frequency transposition scheme for transposing a set of received frequencies of an audio signal received by a hearing aid worn by a subject to a transposed set of frequencies, wherein the method comprises determining at least one subject-dependent parameter indicative of the subject's ability to detect audio frequencies, and at least one subject-dependent parameter indicative of the location in frequency of one or more spectral cues, configuring a subject-dependent frequency transposition scheme based on the determined subject-dependent parameters, the subject-dependent frequency transposition scheme being configured so as to improve the subject's spatial hearing capabilities, and adapting the hearing aid to perform the configured subject-dependent frequency transposition scheme.

Abstract: A digital filter includes at least a first and a second delayed summation line. One of the delay lines includes a warped finite impulse response (FIR) filter and the other line is a FIR filter. Midpoint elements from the first delayed summation line are used as input to the second delayed summation line. Output from the first delayed summation line is delayed with a delay corresponding to the total delay of the second delayed summation line and the delayed output from the first delayed summation line is added to output from the second delayed summation line to faun a new output.

Abstract: A semiconductor device includes a metal carrier and a spacer element attached to the metal carrier. The semiconductor device includes a first sintered metal layer on the spacer element and a semiconductor chip on the first sintered metal layer.

Abstract: A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator and the first chip.

Abstract: A semiconductor module is disclosed. One embodiment provides a first semiconductor chip, a second semiconductor chip and a spacer. The first semiconductor chip has a depression at a first main surface. The spacer applied to the first main surface and at least partly fills the depression. The second semiconductor chip is applied to the spacer.