Abstract: An integrated semiconductor memory has memory cells that are combined to form addressable normal units and to form at least one redundant unit for replacing one of the normal units. In addition, the semiconductor memory has an address bus to which an address can be applied, and a redundancy circuit that is connected to the address bus. The redundancy circuit is used to select the redundant unit. An input of a processing unit is connected to a connection of the address bus and also to a connection for a test signal, and the output of the processing unit is connected to an input of the redundancy circuit. The redundant unit can be tested before the repair information is programmed in the redundancy circuit. The circuit complexity required for this is comparatively low.

Abstract: A current driver configuration for MRAMs includes word-line drivers and bit-line drivers at respective first ends of word lines and bit lines. The word line drivers and the bit line drivers each include a series circuit formed by an n-channel field-effect transistor and a current source. Further series circuits are provided at the respective second ends of the word lines and the bit lines. Each of the further series circuits includes a second n-channel field-effect transistor and a voltage source.

Abstract: The memory has writable memory cells. In addition, it has a bit line pair which connects the memory cells MC to a differential sense amplifier. A control unit is used for precharging the bit lines in a plurality of steps before one of the memory cells is conductively connected to one of the bit lines for a read access operation. For a write access operation, the control unit carries out no more than some of the bit line precharging steps provided for a read access operation before the sense amplifier transfers data to the bit line pair.

Abstract: An integrated memory contains two normal read amplifiers and two first redundant read amplifiers. It also contains bit lines which are combined into at least two individually addressable normal columns, at least one of which from each normal column is connected to one of the normal read amplifiers. It also has first redundant bit lines which are combined into one individually addressable redundant column, at least one of which is connected to one of the redundant read amplifiers. The first redundant read amplifier and its redundant columns are provided for replacing the two normal read amplifiers and one of the normal columns.

Abstract: A decoder element is provided with an output, whereby an output signal with one of three different possible potentials is produced. The output signal may have a value of either a first potential, a second potential, and a third potential, where the second potential lies between the first potential and the third potential. The output signal is produced according to voltage values of input signals at terminal connections of the decoder element.

Abstract: A magneto-resistive random access memory (MPAM) configuration is described in which line driver circuits are respectively assigned via connecting nodes to two memory cell arrays, with the result that the area for the driver circuits can practically be halved. Therefore a space-saving architecture and a more efficient MRAM configuration is obtained.

Abstract: The integrated memory has m>1 bit lines that are connected to an input of a read-write amplifier via a switching element. Only one switching element is conductively connected for each read or write access. The memory is provided with a switching unit that influences read or write access occurring by way of the read-write amplifier and bit lines. The circuit unit is provided with an activation input. A column-end decoder has a first decoder stage and m second decoder stages. The outputs of the second decoder stages are connected to a control input for each of the switching elements. The output of the first decoder stage is connected to the activation input of the switching unit.

Abstract: The memory has writable memory cells. In addition, it has a bit line pair which connects the memory cells MC to a differential sense amplifier. A control unit is used for precharging the bit lines in a plurality of steps before one of the memory cells is conductively connected to one of the bit lines for a read access operation. For a write access operation, the control unit carries out no more than some of the bit line precharging steps provided for a read access operation before the sense amplifier transfers data to the bit line pair.

Abstract: In a semiconductor memory configuration, a refresh operation is always started by a refresh logic circuit when a comparison circuit determines that there is a specific minimum difference when comparing a characteristic variable of at least one reference memory cell with a reference value (VREF).

Abstract: The decoder element is used for producing an output signal having three different potentials at an output. The second potential is situated between the first potential and the third potential. The decoder element makes it possible to produce any one of the three potentials at its output based upon the potentials on its connections.

Abstract: A semiconductor memory, in particular a ferroelectric semiconductor memory, has a differential write/read amplifier which is connected, via transfer transistors, to a bit line pair. The bit line pair includes a bit line and a corresponding reference bit line. The differential write/read amplifier is for reading data from and writing data to the memory capacitor (MC). In order to improve the accuracy of the bit line reference voltage, a main reference bit line is connected, via a charge switching element, to a reference voltage. At least one further reference bit line is connected to the main reference bit line via an equalization switching element for charge equalization between the reference bit lines.

Abstract: An integrated semiconductor memory has memory cells that are combined to form addressable normal units and to form at least one redundant unit for replacing one of the normal units. In addition, the semiconductor memory has an address bus to which an address can be applied, and a redundancy circuit that is connected to the address bus. The redundancy circuit is used to select the redundant unit. An input of a processing unit is connected to a connection of the address bus and also to a connection for a test signal, and the output of the processing unit is connected to an input of the redundancy circuit. The redundant unit can be tested before the repair information is programmed in the redundancy circuit. The circuit complexity required for this is comparatively low.

Abstract: A gas passage (1) with a selectively acting penetration surface consisting of quartz, quartz glass, Pyrex glass or the like; in order to provide penetration surfaces which are relatively thin on the one hand but will withstand relatively great pressure differences on the other, it is proposed that the selectively acting penetration surface take the form of a plurality of adjacent windows (5).

Abstract: An integrated memory includes a cell array having memory cells disposed at points of intersection of first bit lines and second bit lines with word lines in the cell array. When one of the memory cells is addressed, the memory content is not affected if respective bit lines associated with each of the memory cells are at a standby potential. Sense amplifiers for amplifying data read from the memory cells onto the bit lines are included, each associated with respective first and second bit lines and disposed on opposite sides of the cell array. Also provided are first switching elements, through which each bit line is connected to the associated sense amplifier, and second switching elements, through which each bit line is connected, on that side of its first switching element which is remote from the associated sense amplifier, to a standby potential.

Abstract: The memory cell configuration has a multiplicity of preferably ferroelectric memory cells in a semiconductor substrate. Mutually parallel bit line trenches run in the longitudinal direction in the main surface of the semiconductor substrate. Bit lines are disposed in the bottoms of the trenches. Source/drain regions are formed in the crowns of the trenches. Channel regions are provided in the walls of the trenches. The channel region on a wall in each case is configured such that a drivable selection transistor of the relevant memory cell is formed there, while the channel region on the other wall is configured such that the transistor located there is closed. Insulated word lines for driving the selection transistors run in the transverse direction along the main surface of the semiconductor substrate through the bit line trenches.

Abstract: An integrated circuit includes a decoder having an output terminal and five input terminals. The decoder has three operating states including a first operating state for generating a first potential at the output terminal, a second operating state for generating a second potential at the output terminal, and a third operating state for generating a third potential at the output terminal. The second potential lies between the first potential and the third potential.

Abstract: For the operation of a memory cell arrangement with MOS transistors as memory cells that comprise a dielectric triple layer (5) with a first silicon oxide layer (51), a silicon nitride layer (52) and a second silicon oxide layer (53) as gate dielectric, whereby the silicon oxide layers are respectively at least 3 nm thick, a first cutoff voltage value is allocated to a first logical value and a second cutoff voltage value of the MOS transistor is allocated to a second logical value for storing digital data. The information stored in the memory cell can be modified by applying corresponding voltage levels, although a complete removal of charge stored in the silicon nitride layer is not possible because of the thickness of the silicon oxide layers. What is exploited when modifying the cutoff voltage is that the electrical field in the dielectric triple layer is distorted by charge stored in the silicon nitride layer.

Abstract: The invention concerns a friction vacuum pump (1) with an inlet (11), an outlet (20) and a rotor (6, 7) and stator (14, 21) which are located between the inlet (11) and the outlet (20) and carry blades (7 and 8), respectively. In order to design an intermediate inlet (28), which passes into an annular channel (31) surrounding the stator and rotor blades (7 and 8), respectively, so that it is simple and effective, the invention proposes that the stator (21) consists of annular blades or blade segments (25) and annular spacers (22, 23, 24), the outer edges (26) of the annular blades or blade segments (25) being located between the spacers (22, 23, 24) and at least one spacer (23, 24) located at the height of the annular channel (31) having perforations (32) in it.

Abstract: A process is disclosed for inspecting a plurality of similar test bodies for leaks. The test bodies are first evacuated by a fore-vacuum vacuum pump (evacuation mode), down to a pressure P.sub.u, selected to ensure that the maximum admissible pressure in the mass spectrometer (5) is not exceeded when the measurement mode is switched on, and then the evacuation mode is switched to a measurement mode by opening the second valve (16). In order to shorten evacuation times, a learning process is used to determine the optimum switching pressure P.sub.u opt.

Abstract: The invention relates to a sheathing laminate for an absorbent product, such as a sanitary napkin, a diaper, an incontinence protector or the like, and which is to be used as a liquid permeable top layer, which, when the product is in use, faces the body of the user. The laminate (30) comprises a web (10) of plastic film, to one side of which are fixed two mutually spaced, longitudinal strips (14, 16) of non-woven material, while to the other side of the plastic film web (10)--in an area between the two strips (14, 16) on the opposite side of the plastic film web--there is fixed a longitudinal intermediate strip (26) of non-woven material. When used on an absorbent product, the laminate has perforations (42) at least within a portion of the area of the intermediate non-woven strip (26). The invention also relates to a process for manufacture of the sheathing laminate.