Abstract: A hot melt adhesive composition that includes a styrenic block copolymer that includes greater than 55% by weight styrene based on the weight of the styrenic block copolymer, at least 15% by weight plasticizer, and from 30% by weight to 70% by weight of a tackifying agent.

Abstract: The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer. The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.

Abstract: The invention features hot melt adhesive compositions including from 50% by weight to 95% by weight of a non-single site catalyzed amorphous poly alpha-olefin copolymer derived from propylene and at least one monomer selected from the group consisting of butene and hexene and having a viscosity of no greater 10,000 cP at 190° C. and from 5% by weight to 45% by weight of a polybutene-1 polymer.

Abstract: The hot melt adhesive composition includes from 1% by weight to less than 10% by weight total polymer content, of which less than 10% by weight, based on the hot melt adhesive composition, is a single site-catalyzed propylene polymer selected from the group consisting of a single site-catalyzed propylene homopolymer, a single site-catalyzed propylene/alpha-olefin copolymer, and combinations thereof, liquid plasticizer, and at least 45% by weight of a hydrocarbon tackifying agent having a softening point greater than 90° C.

Abstract: A method of encapsulating an electronic component. The method includes applying a first layer of an encapsulating composition onto an electronic component from an applicator roll, the electronic component being disposed on a substrate. The applicator roll comprises an outer surface and is spaced apart from the electronic component such that a gap exists between the applicator roll and the electronic component. The gap controls the thickness of the first layer of encapsulating composition. The first layer of encapsulating composition encapsulates the electronic component on the substrate. An interface between the surface of the electronic component and the encapsulating composition being substantially free of voids.

Abstract: The invention includes a hot melt adhesive composition including from 15% by weight to 60% by weight of polyester polymer selected from a group consisting of poly lactic acid based polymer (PLA) and polyhydroxy alkanoate (PHA) based polymer and greater than 30% by weight to 85% by weight, greater than 40% by weight to 85% by weight, or even greater than 50% by weight to 85% by weight of a polyester plasticizer having a weight average molecular weight (Mw) as tested by SEC of no greater than 10,000 Da.

Abstract: The invention is directed to hot melt adhesive compositions that can be formulated to include a large percentage of bio-based components. The hot melt adhesive composition includes both liquid bio-based tackifying agent and solid bio-based tackifying agent and can further include bio-based polymers and bio-based plasticizers.

Abstract: The hot melt compositions of this invention include from 15% by weight to 60% by weight of a styrene block copolymer, from 15% to 75% by weight of a wax having a Congealing Point (ASTM D938) of from 45° C. to 90° C. and optionally a propylene based polymer. The hot melt composition can be free of both tackifying agent and plasticizer and is useful in a variety of hygiene applications.

Abstract: A hot melt adhesive composition that includes at least 40% by weight of an unmodified, semi-crystalline propylene polymer that includes at least 50% by weight propylene, and at least 15% by weight wax.

Abstract: The invention includes a reactive hot melt adhesive composition including an isocyanate functional prepolymer derived from a polyfunctional isocyanate having a functionality of about 2 or more and a polyol, an active hydrogen organofunctional silane, an active hydrogen non-silane capping agent and a thermoplastic polymer.

Abstract: The invention features hot melt adhesive compositions including from 50% by weight to 95% by weight of a non-single site catalyzed amorphous poly alpha-olefin copolymer derived from propylene and at least one monomer selected from the group consisting of butene and hexene and having a viscosity of no greater 10,000 cP at 190° C. and from 5% by weight to 45% by weight of a polybutene-1 polymer.

Abstract: A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melt temperature of at least 70° C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.

Abstract: The invention features a hot melt adhesive composition that can be applied at temperatures as low as 107° C., while maintaining excellent bonding under stress and a very fast setting time.

Abstract: A hot melt adhesive composition that includes at least 35% polymer, from about 15% by weight, to no greater than 75% by weight propylene polymer derived from at least 50% by weight propylene and from 0 mole % to about 37.5% by weight of an alpha-olefin comonomer other than propylene, the propylene polymer exhibiting a heat of fusion of from about 5 Joules per gram (J/g) to 60 J/g, from 5% by weight to about 50% by weight ethylene alpha-olefin copolymer derived from at least 50% by weight ethylene and at least one alpha-olefin comonomer having at least three carbon atoms, the ethylene alpha-olefin copolymer having a density of no greater than 0.90 g/cm3, and from 18% by weight to about 37% by weight of a wax component that exhibits a melting point greater than 80° C. and a heat of fusion of at least 200 J/g.

Abstract: The invention includes a reactive hot melt adhesive composition including an isocyanate functional prepolymer derived from a polyfunctional isocyanate having a functionality of about 2 or more and a polyol, an active hydrogen organofunctional silane, an active hydrogen non-silane capping agent and a thermoplastic polymer.

Abstract: The invention features a hot melt adhesive composition that can be applied at temperatures as low as 107° C.

Abstract: A hot melt adhesive composition that includes at least 35% polymer, from about 15% by weight, to no greater than 75% by weight propylene polymer derived from at least 50% by weight propylene and from 0 mole % to about 37.5% by weight of an alpha-olefin comonomer other than propylene, the propylene polymer exhibiting a heat of fusion of from about 5 Joules per gram (J/g) to 60 J/g, from 5% by weight to about 50% by weight ethylene alpha-olefin copolymer derived from at least 50% by weight ethylene and at least one alpha-olefin comonomer having at least three carbon atoms, the ethylene alpha-olefin copolymer having a density of no greater than 0.90 g/cm3, and from 18% by weight to about 37% by weight of a wax component that exhibits a melting point greater than 80° C. and a heat of fusion of at least 200 J/g.

Abstract: The invention is directed to hot melt adhesive compositions that include one or more ethylene based copolymers, no greater than about 27% by weight of a tackifying agent and a wax.

Abstract: A hot melt adhesive composition that includes at least 40% by weight of an unmodified, semi-crystalline propylene polymer that includes at least 50% by weight propylene, and at least 15% by weight wax.

Abstract: Disclosed are adhesives and processes for preparing the same, comprising at least one first homogeneous ethylene/?-olefin interpolymer, and optionally at least one tackifier, and optionally at least one plasticizer. The claimed adhesives are useful as adhesives such as are employed in various applications, such as in masking tape, clear office tape, labels, decals, bandages, decorative and protective sheets (such as shelf and drawer liners), floor tiles, sanitary napkin/incontinence device placement strips, sun control films, the joining of gaskets to automobile windows, packaging, bookbinding, construction of nonwoven articles, and insulation bonding.