Abstract: Recyclable hot melt adhesive compositions suitable for plastic bonding may be prepared from styrene-ethylene-butylene-styrene tri-block and/or styrene-ethylene-butylene di-block copolymers which are tackified with at least one hydrogenated resin based on alpha-methyl styrene, vinyl toluene, styrene, coumarone-indene, dicyclopentadiene or mixtures thereof, optionally containing small amounts of white mineral oil or similar diluent. In addition, the adhesive may or may not include minor amounts of the above-described pure monomer resins (specifically composed of styrene, alpha methyl styrene or vinyl toluene or mixtures thereof) in their non-hydrogenated form to serve as end block reinforcing resins.

Abstract: Hot melt packaging adhesive compositions consisting essentially of 35 to 45% by weight of an ethylene n-butyl acrylate copolymer containing 25-45% by weight, preferably 30 to 40% n-butyl acrylate and having a melt index of at least 50; 35 to 55% of a terpene phenolic tackifier; and 10 to 20% by weight of a high melting synthetic wax provide adhesives characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability.