Abstract: The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Abstract: The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Abstract: The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Abstract: The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Abstract: The present invention relates to radiation curable compositions comprising at least one metallocene polyolefin. The radiation curable compositions are useful for a variety of applications, particularly as coatings and adhesives. The radiation curable composition may comprise a single metallocene polyolefin, or blend thereof. The ultraviolet curable compositions further comprise at least one photoinitiator and/or at least one photoinduced coupling agent. For pressure sensitive adhesive applications, the radiation curable composition also preferably comprises other ingredients such as a tackifying resins and plasticizers.

Abstract: Disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive, in turn comprising at least one first homogenous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350° F. (177° C.), up to 60 weight percent wax and up to 40 weight percent tackifier. In particular, disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20 &agr;-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and b) up to 60 weight percent of at least one tackifying resin; and c) up to 40 weight percent of at least one wax, wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/(cm.second)) at 150° C.

Abstract: Disclosed are hot melt adhesives comprising at least one first homogeneous linear etylene polymer having a particular density and melt viscosity at 350.degree.F. (177.degree.C.), and an optional wax and tackifier. In particular, disclosed is a hot melt adhesive characterized by: a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least ibe C.sub.2 --C.sub.20 .alpha.-olefin interpolymer having a density from 0.850 g/cm.sup.3 to 0.895 g/cm.sup.3 ; and b) optionally at least one tackifying resin; and c) optionally at least one wax wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/cm.second) at 150.degree.C. Preferred hot melt adhesives for use in adhering cardboard or paperboard are disclosed, as well as the resultant adhered products. Also disclosed is a dual reactor process for the preparation of the inventive hot melt adhesives.

Abstract: The present invention is a hot melt adhesive composition comprising at least one ingredient present in an encapsulated form. The encapsulated ingredient may be any known hot melt adhesive formulation ingredient as well as any hot melt adhesive additive such as antioxidants and fragrances for which there is a desirable change in adhesive properties by isolating such ingredient for a duration of time. The encapsulated ingredient is released from the shell by means of pressure, temperature, diffusion, pH, light, radiation, ultrasound, and combinations thereof. Hot melt adhesive compositions comprising at least one encapsulated ingredient are useful for a variety of novel products including self-supported friction glue sticks, non-tacky pelletized pressure sensitive adhesives, cohesive adhesive systems, hot melt adhesive compositions exhibiting improved thermal stability and odor, as well as for a variety of other adhesive applications.

Abstract: The present invention is a hot melt adhesive composition comprising at least one ingredient present in an encapsulated form. The encapsulated ingredient may be any known hot melt adhesive formulation ingredient as well as any hot melt adhesive additive such as antioxidants and fragrances for which there is a desirable change in adhesive properties by isolating such ingredient for a duration of time. The encapsulated ingredient is released from the shell by means of pressure, temperature, diffusion, pH, light, radiation, ultrasound, and combinations thereof. Hot melt adhesive compositions comprising at least one encapsulated ingredient are useful for a variety of novel products including self-supported friction glue sticks, non-tacky pelletized pressure sensitive adhesives, cohesive adhesive systems, hot melt adhesive compositions exhibiting improved thermal stability and odor, as well as for a variety of other adhesive applications.

Abstract: A water sensitive hot melt adhesive composition comprising 5 to 80% by weight of a A-B-A linear or radial rubbery block copolymer, 10 to 50% by weight of a water soluble or water dispersible plasticizer; 0 to 85% by weight of a compatible tackifying resin; 0 to 35% by weight polar wax; and 0 to 3% by weight stabilizer.

Abstract: In a process for manufacturing degradable cigarette filters wherein adhesive is applied to at least one longitudinal edge of the plug wrap paper, a bond is made while the adhesive is molten and the resultant bond is held in compression for sufficient time to prevent bond movement, the improvement which comprises, using as the adhesive, from about 20 to 60% by weight of an intermediate or high DS starch ester having from about 2 to 18 carbon atoms in the ester component and a DS (degree of substitution) of from about 0.3 to 2.5, 5 to 40% by weight of a polar wax, 5 to 50% by weight of a plasticizing diluent, 0 to 25% by weight of a compatible tackifier and 0 to 3% by weight of an antioxidant.

Abstract: In a process for manufacturing degradable cigarette filters wherein adhesive is applied to at least one longitudinal edge of the plug wrap paper, a bond is made while the adhesive is molten and the resultant bond is held in compression for sufficient time to prevent bond movement, the improvement which comprises, using as the adhesive, a water sensitive hot melt adhesive comprising 50 to 90 weight percent of a graft copolymer which copolymer comprises 40 to 85 weight percent of at least one vinyl monomer and 15 to 60 weight percent of at least one polyalkylene oxide polymer, 0 to 50 weight percent of a compatible tackifying resin, 5 to 40 weight percent of a polar wax, 0 to 3 weight percent antioxidant and 0 to 30 weight percent of another compatible water soluble or water sensitive thermoplastic polymer; characterized in that the resulting cigarette filter will open when exposed to moisture.

Abstract: Hot melt adhesive compositions comprising selected modified starch esters as the main or base adhesive material wherein the starch ester has an ester component of about 2 to 18 carbon atoms and a DS of from about 0.3 to 3.0 and a sufficient amount of a non-volatile, polar organic diluent to allow the composition to melt and have a viscosity of less than 50,000 cP at an application temperature of 400.degree. F. or less.

Abstract: A hot melt adhesive composition comprising 5 to 50% by weight hydroxypropyl cellulose, 5 to 40% by weight plasticizer of which up to 85% may be a water insoluble plasticizer; 20 to 70% by weight tackifying resin; 0 to 40% by weight polar wax; 0 to 30% by weight compatible polymer; and, 0 to 3% by weight stabilizer.

Abstract: Hot melt packaging adhesive compositions consisting essentially of 20 to 50% by weight of an ethylene n-butyl acrylate copolymer containing 25-45% by weight, preferably 30 to 40% n-butyl acrylate and having a melt index of at least 10; 30 to 60% of an aliphatic or cycloaliphatic hydrocarbon resin or hydrogenated derivative thereof or a hydrogenated aromatic hydrocarbon resin; and 10 to 30% by weight of a high melting synthetic wax provide adhesives characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability. Further, the adhesive is characterized by a low density and consequently is readily filterable in recycling systems.

Abstract: Hot melt adhesive compositions are prepared from 20 to 98% by weight of a polylactide homo- or copolymer containing at least 20 molar percent of the lactide component; 2 to 80% by weight of a polar tackifier having a Ring and Ball softening point (as described by ASTM E-26) greater than about 60.degree. C.; 0 to 50% by weight of a plasticizer; 0 to 30% by weight of a wax diluent; 0-3% by weight of a stabilizer; and 0-20% of starch. By utilizing a naturally occurring, thermoplastic, biodegradable copolymer as the base polymer, these adhesives advance the state of the art of hot melt adhesives by alleviating the dependence on petroleum based materials and by allowing for the development of hot melt adhesives which either degrade naturally after coming in contact with the soil or which can be composted.

Abstract: Hot melt adhesive compositions are prepared from 20 to 98% by weight of a polylactide homo- or copolymer containing at least 20 molar percent of the lactide component; 2 to 80% by weight of a polar tackifier having a Ring and Ball softening point (as described by ASTM E-26) greater than about 60.degree. C.; 0 to 50% by weight of a plasticizer; 0 to 30% by weight of a wax diluent; 0-3% by weight of a stabilizer; and 0-20% of a polymer. By utilizing a naturally occurring, thermoplastic, biodegradable copolymer as the base polymer, these adhesives advance the state of the art of hot melt adhesives by alleviating the dependence on petroleum based materials and by allowing for the development of hot melt adhesives which either degrade naturally after coming in contact with the soil or which can be composted.

Abstract: Recyclable hot melt adhesive compositions suitable for plastic bonding may be prepared from styrene-ethylene-butylene-styrene tri-block and/or styrene-ethylene-butylene di-block copolymers which are tackified with at least one hydrogenated resin based on alpha-methyl styrene, vinyl toluene, styrene, coumarone-indene, dicyclopentadiene or mixtures thereof, optionally containing small amounts of white mineral oil or similar diluent. In addition, the adhesive may or may not include minor amounts of the above-described pure monomer resins (specifically composed of styrene, alpha methyl styrene or vinyl toluene or mixtures thereof) in their non-hydrogenated form to serve as end block reinforcing resins.

Abstract: Rigid substrates for case and carton sealing and traymaking applications are bonded by spray application of a hot melt adhesive composition comprising 25 to 50 percent of an isotactic thermoplastic polybutene-1/ethylene copolymer containing from about 5.5 to about 10% by weight ethylene; 20 to 60 percent of a tackifier; 15 to 30 percent of an amorphous diluent having a softening point greater than 90.degree. C.; 0 to 2 percent antioxidant; and 0 to 10 percent wax or oil.

Abstract: Hot melt packaging adhesive compositions consisting essentially of 35 to 45% by weight of an ethylene n-butyl acrylate copolymer containing 25-45% by weight, preferably 30 to 40% n-butyl acrylate and having a melt index of at least 50; 35 to 55% of a terpene phenolic tackifier; and 10 to 20% by weight of a high melting synthetic wax provide adhesives characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability.