Abstract: An apparatus for inspecting a plurality of electronic chips singularized from a wafer, wherein the apparatus comprises an electromagnetic radiation source arranged and configured for illuminating at least part of a first main surface of the singularized wafer with electromagnetic radiation, and a detection unit configured for detecting electromagnetic radiation from a side facing a second main surface of the singularized wafer and opposing the first main surface.

Abstract: An illumination optical unit for EUV projection lithography illuminates an object field with illumination light. The illumination optical unit has a first facet mirror including a plurality of first facets on a first mirror carrier. Disposed downstream of the first facet mirror is a second facet mirror including a plurality of second facets arranged on a second mirror carrier around a facet arrangement center. Partial beams of the illumination light are guided superposed on one another into the object field, respectively via illumination channels which have one of the first facets and one of the second facets. Second maximum angle facets are arranged at the edge of the second mirror carrier. The second maximum angle facets predetermine maximum illumination angles of the illumination light which deviate maximally from a chief ray incidence on the object field.

Abstract: A method of manufacturing electronic dies by separating a wafer into electronic dies, wherein the method comprises forming a groove in the wafer with a first material removal tool having a first thickness, enlarging the groove by a second material removal tool having a second thickness larger than the first thickness, and subsequently increasing a depth of the groove by a third material removal tool having a third thickness smaller than the second thickness until the wafer is separated.

Abstract: A remote control having at least one multifunction button, to which force is applied in one direction by magnets and counter-magnets or mechanical springs, and to which journals with thickened heads are attached, wherein the thickened heads through interaction with bearing shells of a supporting plate serve as centering, guide, and movement stop of the multifunction button.

Abstract: The present invention relates to a method of attaching a dental component (10) having an angulated screw channel (60) to a dental implant (46). The present invention also relates to a dental component (10) having an angulated screw channel (60) and a metal adapter (14).

Abstract: A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle comprises a light port, and wherein the light port includes a source of light, shining a light from the source of light at an edge of the wafer thereby passing light by the edge of the wafer and processing the wafer on the receptacle based on the light passing by the edge of the wafer and received by a light sensitive element.

Abstract: A radar system for vehicle comprises a left corner radar sensor configured to be mounted on the front left corner of a vehicle, a right corner radar sensor configured to be mounted on the front right corner of a vehicle, the left corner radar sensor being configured to transmit an object detection radar signal in a field of view extending from a left side portion area to a front portion area covering respectively the left portion and the front portion of the vehicle, the right corner radar sensor being configured to transmit another object detection radar signal in another field of view extending from a right side portion area to another front portion area covering respectively the right portion and the front portion of the vehicle.

Abstract: A sensor element for a motor vehicle, includes a sensor circuit for detecting a physical variable, a first housing, in which the sensor circuit is arranged, a second housing, in which the first housing is arranged, a thermoplastic, which at least partially encloses the first housing and fixes the first housing in the second housing in a positioning position, at least two positioning recesses for receiving positioning pins being formed in the first housing in order to fix the first housing in the positioning position while the first housing is being enveloped by the thermoplastic.

Abstract: In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a contact layer over a first major surface of a substrate. The substrate includes device regions separated by kerf regions. The contact layer is disposed in the kerf region and the device regions. A structured solder layer is formed over the device regions. The contact layer is exposed at the kerf region after forming the structured solder layer. The contact layer and the substrate in the kerf regions are diced.

Abstract: A method for monitoring the performance range of a radar system placed behind a portion of a vehicle including, in an operational mode, the steps of: transmitting a first signal in a high range resolution mode from the radar system through the portion of the vehicle; receiving a first return signal comprising a part of the first signal that is reflected by the portion of the vehicle at the radar system; measuring the first return signal; comparing the first return signal with a calibration return signal representative of a part of the first signal that is reflected by the portion of the vehicle in a calibration mode; determining the relative loss of transmission of the portion of the vehicle from the comparing step.

Abstract: The invention relates to a device and a method for transferring sausage portions with a supply transport device, at least one removal transport device, and at least one ejector for ejecting at least one sausage portion from the supply transport device onto the removal transport device. The removal transport device comprises a lower transport device and a holding device disposed thereabove between which the at least one sausage portion is transported.

Abstract: A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light at an edge of the wafer and based on light that passed the edge of the wafer, processing the wafer on the receptacle.

Abstract: In order to configure or produce an electrically controllable optical element on the basis of the electro-optic Kerr effect with a low threshold and operating voltage, a minimized temperature dependence of the effect and a low response time, the Kerr liquid according to the invention comprises a mixture of rod-shaped molecules and non-rod-shaped molecules as active composites, a thin layer having a pre-stamping, wide-mesh, anisotropic network between structured and/or planar conductive layer applied to a substrate thus configure a thin-film cell in such a way that without electric field the state of the active composite of the Kerr liquid in the working temperature region RT is isotropic and that by electrically continuous adjustment, of the voltage U or by a switching-on or switching-off a change the voltage U, in the optical element a voltage-induced phase shift or a refractive index deviation is generated and the light passes through an electrode gap perpendicular to the electrodes.

Abstract: The invention relates to a method for determining the injection rate of an injection valve (1) using a mathematical model which is based on measurement values comprising the stroke (x) of a piston (3) that delimits a measurement chamber (2) during the injection of a test fluid (4) into the measurement chamber (2). The injection rate is corrected on the basis of an additional measurement value. According to the invention, the pressure (pa) in an adapter volume (5), via which the injection valve (1) is connected to the measurement chamber (2), is used as an additional measurement value for correcting the injection rate. The invention further relates to a device for determining the injection rate of an injection valve.

Abstract: According to various embodiments, a method for manufacturing a semiconductor device may include providing a semiconductor workpiece including a device region at a first side of the semiconductor workpiece, wherein a mechanical stability of the semiconductor workpiece is insufficient to resist at least one back end process without damage, and depositing at least one conductive layer over a second side of the semiconductor workpiece opposite the first side of the semiconductor workpiece, wherein the at least one conductive layer increases the mechanical stability of the semiconductor workpiece to be sufficient to resist the at least one back end process without damage.

Abstract: The present invention relates to a method of attaching a dental component having an angulated screw channel to a dental implant. The present invention also relates to a dental component having an angulated screw channel and a metal adapter.

Abstract: A protective cover for an article of footwear can include a first portion covering the top and sides of the footwear and a second portion covering the back of the footwear. The first portion can include locations to receive at least part of a connecting mechanism, and the second portion of the cover can be connected to the first portion of the cover by the connecting mechanism.

Abstract: A device for measuring spatial points includes an ergonomic manual handle for facilitating efficient three-dimensional measurement using data processing.

Abstract: Based on received input, a vertex table of the database layer and a vertex key column in the vertex table can be identified. The vertex key column defines vertices of a graph representation. Also based on the received input, an edge table of the database layer, an edge key column in the edge table, a source column in the edge table, and a target column in the edge table can be identified. The source column and target column define relationships between vertices of the plurality of vertices. Within a graph workspace object, graph relationships linking the vertices defined by the vertex key column via edges defined by the source column and target column in the edge table can be assigned, and the graph workspace can be generated in a higher level programming layer based on the graph workspace object.