Abstract: The present invention concerns an apparatus for ultrasonic welding of at least two material webs comprising a processing sonotrode which can be excited with an ultrasonic vibration, a processing counterpart tool and a material web guide which is so designed that the material web can be passed through between the processing sonotrode and the processing counterpart tool, in which there is provided a device for heating at least one material web prior to the welding operation. To provide an ultrasonic welding apparatus which avoids the stated disadvantages and which nonetheless provides a high processing speed it is proposed according to the invention that the device for preheating at least one material web has a preheating sonotrode which can be excited with an ultrasonic vibration.

Abstract: According to various embodiments, a method for manufacturing a semiconductor device may include providing a semiconductor workpiece including a device region at a first side of the semiconductor workpiece, wherein a mechanical stability of the semiconductor workpiece is insufficient to resist at least one back end process without damage, and depositing at least one conductive layer over a second side of the semiconductor workpiece opposite the first side of the semiconductor workpiece, wherein the at least one conductive layer increases the mechanical stability of the semiconductor workpiece to be sufficient to resist the at least one back end process without damage.

Abstract: The present invention relates to a method of specifically releasing a one or more members of a sub-group of objects from an entity, a method of detecting a subject's disease by detecting one or more members of a sub-group of biological entities indicative of the disease and a method of isolating one or more members of a sub-group of objects from a group of objects.

Abstract: One or more embodiments relate to a method for making a semiconductor structure, comprising: providing a workpiece; forming a barrier layer over the workpiece; forming a separation layer over the barrier layer; forming a conductive layer over the separation layer; and wet etching the conductive layer.

Abstract: In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes forming a contact layer over a first major surface of a substrate. The substrate includes device regions separated by kerf regions. The contact layer is disposed in the kerf region and the device regions. A structured solder layer is formed over the device regions. The contact layer is exposed at the kerf region after forming the structured solder layer. The contact layer and the substrate in the kerf regions are diced.

Abstract: A protective cover for an article of footwear can include a first portion covering the top and sides of the footwear and a second portion covering the back of the footwear. The first portion can include locations to receive at least part of a connecting mechanism, and the second portion of the cover can be connected to the first portion of the cover by the connecting mechanism.

Abstract: An apparatus and a method for determining at least one parameter relating to the shape of the sausage, which is transported on a transport device, in particular between two circulating means of transport. A measuring device has at least one distance sensor, which is disposed in such a way that said sensor can detect a distance c to a sausage that is being transported. Furthermore, an evaluation device is provided, which determines at least one parameter relating to the sausage as a function of the distance.

Abstract: A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

Abstract: One or more embodiments relate to a method for making a semiconductor structure, comprising: providing a workpiece; forming a barrier layer over the workpiece; forming a separation layer over the barrier layer; forming a conductive layer over the separation layer; and wet etching the conductive layer.

Abstract: The invention relates to an aqueously dispersible epoxy resin E, comprising building blocks derived from an aliphatic polyether polyol A, an epoxy resin B having at least two epoxide groups per molecule, an epoxy resin B? having at least two epoxide groups per molecule, which may be identical to B, or different from B, an epoxy-functional fatty acid ester D, and an aromatic polyol C, a process for the preparation thereof, and a method of use thereof.

Abstract: The present disclosure relates to a set of at least 100 single-stranded oligonucleotide probes directed against (or complementary to) portions of a genomic target sequence of interest. The present disclosure also relates to a method of detecting a genomic target sequence of interest using the set of oligonucleotide probes and a method of generating the set of oligonucleotide probes. Further the present disclosure relates to a kit comprising the set of oligonucleotide probes and at least one further component.

Abstract: An illumination optical unit for EUV projection lithography has a first and second facet mirrors, each with a plurality of reflecting facets on a support. The facets of the first facet mirror can be switched between various tilt positions. In each tilt position, the tiltable first facet is assigned to a second facet of the second facet mirror for deflecting EUV radiation in the direction of this second facet. Each of the first facets is assigned to a set of second facets by its tilt positions. The two facet mirrors are arranged so that an arrangement distribution of second facets, impinged upon via the first facets, results in an illumination-angle distribution of an illumination of an illumination field.

Abstract: The invention relates to a method for producing aqueous polyurethane-polyurea dispersions, where A) first a polyurethane prepolymer containing NCO groups is produced by reacting A1) polyisocyanates with A2) polymeric polyols and/or polyamines having number-average molecular weights of more than 400 to 8,000 g/mol, A3) possibly low-molecular-weight compounds having number-average molecular weights of 17-400 g/mol selected from the group comprising mono- and polyalcohols, mono- and polyamines, and amino alcohols, A4) isocyanate-reactive, ionically or potentially ionically hydrophilic compounds and/or isocyanate-reactive non-ionically hydrophilic compounds, A5) isocyanate-reactive compounds, which contain at least one C7 to C24 alkyl group or C7 to C24 alkenyl group, and A6) isocyanate-reactive compounds, which contain at least one polysiloxane group, and B); the NCO groups of the prepolymer that are not yet free are reacted with isocyanate-reactive monoamines, polyamines, hydrazine, and/or hydrazides, dimension

Abstract: A valve for shutting off and/or controlling the throughflow of fluid flows is provided. A valve housing, having a valve seat contact surface, a valve cover with a valve cover thickness which is provided with a material allowance, and the valve body form together a first, maximum lift; and when the worn region of the valve seat contact surface is removed, the valve cover thickness can be removed such that the first, maximum lift remains the same or remains the same with only minor deviations; and/or the valve housing, valve seat contact surface, valve cover with the valve cover thickness, and the valve body is provided with a material allowance form a first, particularly maximum lift; and when the worn region of the valve seat contact surface is removed, the valve body can be removed such that the first, maximum lift remains the same or with only minor deviations.

Abstract: A protective cover for an article of footwear can include a first portion covering the top and sides of the footwear and a second portion covering the back of the footwear. The first portion can include locations to receive at least part of a connecting mechanism, and the second portion of the cover can be connected to the first portion of the cover by the connecting mechanism.

Abstract: The invention relates to a device and a method for transferring sausage portions with a supply transport device, at least one removal transport device, and at least one ejector for ejecting at least one sausage portion from the supply transport device onto the removal transport device. The removal transport device comprises a lower transport device and a holding device disposed thereabove between which the at least one sausage portion is transported.

Abstract: The invention relates to an aqueously dispersible epoxy resin E, comprising building blocks derived from an aliphatic polyether polyol A, an epoxy resin B having at least two epoxide groups per molecule, an epoxy resin B? having at least two epoxide groups per molecule, which may be identical to B, or different from B, an epoxy-functional fatty acid ester D, and an aromatic polyol C, a process for the preparation thereof, and a method of use thereof.

Abstract: The present disclosure relates to a set of at least 100 single-stranded oligonucleotide probes directed against (or complementary to) portions of a genomic target sequence of interest. The present disclosure also relates to a method of detecting a genomic target sequence of interest using the set of oligonucleotide probes and a method of generating the set of oligonucleotide probes. Further, the present disclosure relates to a kit comprising the set of oligonucleotide probes and at least one further component.

Abstract: According to various embodiments, a method for manufacturing a semiconductor device may include providing a semiconductor workpiece including a device region at a first side of the semiconductor workpiece, wherein a mechanical stability of the semiconductor workpiece is insufficient to resist at least one back end process without damage, and depositing at least one conductive layer over a second side of the semiconductor workpiece opposite the first side of the semiconductor workpiece, wherein the at least one conductive layer increases the mechanical stability of the semiconductor workpiece to be sufficient to resist the at least one back end process without damage.

Abstract: A photo book includes a cover and a structural unit integrated with the cover. The structural unit includes an electronic memory element and a connection element connected to the memory element. The cover includes a body element and a flexible sheath surrounding the body element. The body element has a peripheral edge and a through passage that opens out along the peripheral edge of the body element. The structural unit is insertable into the through-passage so that the connection element opens out along a peripheral edge of the cover.