Patents by Inventor Thomas Gross

Thomas Gross has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260061660
    Abstract: A machine or device for reducing material including a cutting drum and/or removable, multipiece cutting blade assembly. A machine for reducing material that includes a skinless cutting drum. In one aspect there is disclosed a woodchipper for reducing material that includes a skinless cutting drum and a discharge assembly.
    Type: Application
    Filed: August 28, 2025
    Publication date: March 5, 2026
    Applicant: Dyna Sales and Service LLC
    Inventors: Michael Miller, Nathan Miller, Frank Force, Thomas Gross
  • Publication number: 20250206856
    Abstract: A composition comprising a curable polybutadiene polymer comprising at least 60% by weight, preferably at least 80% by weight of units derived from butadiene, based on the total weight of the polymer, and wherein the polymer has a Mooney viscosity ML 1+4 at 100° C. of from 42 to 150 MU and is branched and wherein the polymer satisfies the equation: Mooney viscosity ML 1+4 at 100° C. of the polymer/branching degree ?? of the polymer?4.6. Also provided are methods of making the polymers and articles obtained with the composition and methods of making articles.
    Type: Application
    Filed: November 23, 2022
    Publication date: June 26, 2025
    Inventors: Lena HESPING, Thomas RUENZI, Kevin PESCH, Jiawen ZHOU, Thomas PESCH, Thomas GROSS, Arnd KURZ
  • Publication number: 20240392926
    Abstract: A tank for flammable liquids and gases for use as a fuel reservoir of a vehicle, contains a tank container, which is equipped with a plurality of thermal pressure relief valves in the event of potential fire. The tank container is equipped on its outer side with a fire protection lining which is adapted in terms of its contour to an enveloping surface of the tank container.
    Type: Application
    Filed: August 19, 2022
    Publication date: November 28, 2024
    Inventor: Thomas Gross
  • Patent number: 11132051
    Abstract: This disclosure presents systems and methods to provide an interactive environment in response to touch-based inputs. A first body channel communication device coupled to a user may transmit and/or receive signals configured to be propagated along skin of the user such that the skin of the user comprises a signal transmission path. A second body channel communication device coupled to an interaction entity may be configured to transmit and/or receive signals configured to be propagated along the skin of the user along the signal transmission path. A presentation device may present images of virtual content to the user. Information may be communicated between the first body channel communication device, the second body channel communication device, and the presentation device so that virtual content specific to the interaction entity may be presented to augment an appearance of the interaction entity.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: September 28, 2021
    Assignees: Disney Enterprises, Inc., ETH Zürich (Eidgenössische Technische Hochschule Zürich)
    Inventors: Robert Sumner, Benjamin Buergisser, Fabio Zünd, Gergely Vakulya, Virag Varga, Thomas Gross, Alanson Sample
  • Patent number: 11057972
    Abstract: This disclosure includes systems, methods, and techniques for controlling a plurality of light-emitting diodes (LEDs). For example, a circuit includes a switching device, where the switching device is electrically connected to an LED of the plurality of LEDs, and where the switching device is configured to control whether the LED receives an electrical signal from a power source. Additionally, the circuit includes processing circuitry configured to receive a photocurrent signal indicative of a photocurrent value corresponding to the LED, compare the photocurrent value with a threshold photocurrent value, and control, based on the comparison of the photocurrent value with the threshold photocurrent value, an output current of the LED.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: July 6, 2021
    Assignee: Infineon Technologies AG
    Inventors: Adolfo De Cicco, Rosario Chiodo, Andrea Logiudice, Dietrich Bonart, Thomas Gross
  • Patent number: 10935590
    Abstract: A semiconductor wafer includes a semiconductor substrate having a plurality of die areas separated from one another by dicing areas. Each die area includes one or more metal layers above the semiconductor substrate and a plurality of fuse structures formed in at least one of the one or more metal layers. Each fuse structure includes a fuse area between first and second fuse heads. Each die area also includes a first pair of contacts connected to different areas of the first fuse head of at least some of the fuse structures. The wafer can be singulated along the dicing areas into individual dies. A corresponding method of fuse verification is also provided.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: March 2, 2021
    Assignee: Infineon Technologies AG
    Inventors: Dietrich Bonart, Thomas Gross, Franziska Haering
  • Patent number: 10903079
    Abstract: A method includes: forming first and second trenches in a semiconductor body; forming a first material layer on the semiconductor body in the first and second trenches such that a first residual trench remains in the first trench and a second residual trench remains in the second trench; removing the first material from the second trench; and forming a second material layer on the first material layer in the first residual trench and on the semiconductor body in the second trench. The first material layer includes dopants of a first doping type and the second material layer includes dopants of a second doping type. The method further includes diffusing dopants from the first material layer in the first trench into the semiconductor body to form a first doped region, and from the second material layer in the second trench into the semiconductor body to form a second doped region.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: January 26, 2021
    Assignee: Infineon Technologies Dresden GmbH & Co. KG
    Inventors: Rolf Weis, Thomas Gross, Hermann Gruber, Franz Hirler, Andreas Meiser, Markus Rochel, Till Schloesser, Detlef Weber
  • Publication number: 20210011542
    Abstract: This disclosure presents systems and methods to provide an interactive environment in response to touch-based inputs. A first body channel communication device coupled to a user may transmit and/or receive signals configured to be propagated along skin of the user such that the skin of the user comprises a signal transmission path. A second body channel communication device coupled to an interaction entity may be configured to transmit and/or receive signals configured to be propagated along the skin of the user along the signal transmission path. A presentation device may present images of virtual content to the user. Information may be communicated between the first body channel communication device, the second body channel communication device, and the presentation device so that virtual content specific to the interaction entity may be presented to augment an appearance of the interaction entity.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 14, 2021
    Inventors: Robert Sumner, Benjamin Buergisser, Fabio Zünd, Gergely Vakulya, Virag Varga, Thomas Gross, Alanson Sample
  • Patent number: 10607972
    Abstract: A semiconductor device includes an active region disposed in a semiconductor substrate and an uppermost metal level including metal lines, where the uppermost metal level is disposed over the semiconductor substrate. Contact pads are disposed at a major surface of the semiconductor device, where the contact pads are coupled to the metal lines in the uppermost metal level. An isolation region separates the contact pads disposed at the major surface. Adjacent contact pads are electrically isolated from one another by a portion of the isolation region. Reflective structures are disposed between the upper metal level and the contact pads, where each of the reflective structures that is directly over the active region completely overlaps an associated portion of the isolation region separating the contact pad.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: March 31, 2020
    Assignee: Infineon Technologies AG
    Inventors: Dietrich Bonart, Bernhard Weidgans, Johann Gatterbauer, Thomas Gross, Martina Heigl
  • Publication number: 20200062878
    Abstract: In-chain phosphine- and/or phosphonium-containing diene-polymers, the preparation and use thereof, as well as vulcanizable rubber compounds comprising such polymers, and their use for the production of moldings in particular in the production of tires.
    Type: Application
    Filed: February 23, 2018
    Publication date: February 27, 2020
    Applicant: ARLANXEO DEUTSCHLAND GMBH
    Inventors: Thomas RÜNZI, Norbert STEINHAUSER, Alex LUCASSEN, Thomas GROSS
  • Publication number: 20190287804
    Abstract: A method includes: forming first and second trenches in a semiconductor body; forming a first material layer on the semiconductor body in the first and second trenches such that a first residual trench remains in the first trench and a second residual trench remains in the second trench; removing the first material from the second trench; and forming a second material layer on the first material layer in the first residual trench and on the semiconductor body in the second trench. The first material layer includes dopants of a first doping type and the second material layer includes dopants of a second doping type. The method further includes diffusing dopants from the first material layer in the first trench into the semiconductor body to form a first doped region, and from the second material layer in the second trench into the semiconductor body to form a second doped region.
    Type: Application
    Filed: March 12, 2019
    Publication date: September 19, 2019
    Inventors: Rolf Weis, Thomas Gross, Hermann Gruber, Franz Hirler, Andreas Meiser, Markus Rochel, Till Schloesser, Detlef Weber
  • Publication number: 20190113562
    Abstract: A semiconductor wafer includes a semiconductor substrate having a plurality of die areas separated from one another by dicing areas. Each die area includes one or more metal layers above the semiconductor substrate and a plurality of fuse structures formed in at least one of the one or more metal layers. Each fuse structure includes a fuse area between first and second fuse heads. Each die area also includes a first pair of contacts connected to different areas of the first fuse head of at least some of the fuse structures. The wafer can be singulated along the dicing areas into individual dies. A corresponding method of fuse verification is also provided.
    Type: Application
    Filed: October 17, 2017
    Publication date: April 18, 2019
    Inventors: Dietrich Bonart, Thomas Gross, Franziska Haering
  • Publication number: 20180308830
    Abstract: A semiconductor device includes an active region disposed in a semiconductor substrate and an uppermost metal level including metal lines, where the uppermost metal level is disposed over the semiconductor substrate. Contact pads are disposed at a major surface of the semiconductor device, where the contact pads are coupled to the metal lines in the uppermost metal level. An isolation region separates the contact pads disposed at the major surface. Adjacent contact pads are electrically isolated from one another by a portion of the isolation region. Reflective structures are disposed between the upper metal level and the contact pads, where each of the reflective structures that is directly over the active region completely overlaps an associated portion of the isolation region separating the contact pad.
    Type: Application
    Filed: May 8, 2018
    Publication date: October 25, 2018
    Inventors: Dietrich Bonart, Bernhard Weidgans, Johann Gatterbauer, Thomas Gross, Martina Heigl
  • Publication number: 20180244865
    Abstract: Polymer masterbatch compositions, the production and use thereof, as well as vulcanizable rubber compounds comprising these masterbatch compositions, and their use for the production of moldings in the production of tires.
    Type: Application
    Filed: August 3, 2016
    Publication date: August 30, 2018
    Applicant: ARLANXEO Deutschland GmbH
    Inventors: Thomas GROSS, Heike KLOPPENBURG, Alex LUCASSEN, Thomas RUENZI, Norbert STEINHAUSER, Olaf HALLE
  • Patent number: 9969833
    Abstract: Cold flow-reduced polymers having good processing characteristics have, at the ends of the polymer chains, a silane-containing carboxyl group of the formula (I) where R1 and R2 are the same or different and are each an H, alkyl, alkoxy, cycloalkyl, cycloalkoxy, aryl, aryloxy, alkaryl, alkaryloxy, aralkyl or aralkoxy; R3 and R4 are the same or different and are each an H, alkyl, cycloalkyl, aryl, alkaryl or aralkyl radical; A is a divalent organic radical.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: May 15, 2018
    Assignee: ARLANXEO Deutschland GmbH
    Inventors: Norbert Steinhauser, Thomas Gross
  • Patent number: 9966368
    Abstract: A semiconductor device includes an active region disposed in a semiconductor substrate and an uppermost metal level including metal lines, where the uppermost metal level is disposed over the semiconductor substrate. Contact pads are disposed at a major surface of the semiconductor device, where the contact pads are coupled to the metal lines in the uppermost metal level. An isolation region separates the contact pads disposed at the major surface. Adjacent contact pads are electrically isolated from one another by a portion of the isolation region. Reflective structures are disposed between the upper metal level and the contact pads, where each of the reflective structures that is directly over the active region completely overlaps an associated portion of the isolation region separating the contact pad.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: May 8, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Dietrich Bonart, Bernhard Weidgans, Johann Gatterbauer, Thomas Gross, Martina Heigl
  • Patent number: 9920149
    Abstract: Polymers are functionalized at chain ends thereof with silane-containing carboxyl groups of the formula (I) where R1 and R2 are the same or different and are each an H, alkyl, alkoxy, cycloalkyl, cycloalkoxy, aryl, aryloxy, alkaryl, alkaryloxy, aralkyl or aralkoxy radical; R3 and R4 are the same or different and are each an H, alkyl, cycloalkyl, aryl, alkaryl or aralkyl radical; and A is a divalent organic radical.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: March 20, 2018
    Assignee: ARLANXEO Deutschland GmbH
    Inventors: Norbert Steinhauser, Thomas Gross
  • Patent number: 9875978
    Abstract: According to various embodiments, a method may include: forming a first layer on a surface using a first lift-off process; forming a second layer over the first layer using a second lift-off process; wherein the second lift-off process is configured such that the second layer covers at least one sidewall of the first layer at least partially.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: January 23, 2018
    Assignee: Infineon Technologies AG
    Inventors: Johann Gatterbauer, Bernhard Weidgans, Dietrich Bonart, Thomas Gross, Martina Debie
  • Patent number: 9845366
    Abstract: The invention relates to methods for achieving a step increase in the Mooney viscosity in production of high-molecular-weight polybutadiene having >95% by weight content of cis-1,4 units and <1% by weight 1,2-vinyl content, characterized in that 1) at least one monomer selected from butadiene and/or isoprene is polymerized at temperatures of from ?20° C. to 150° C. in the presence of at least one inert, organic solvent and in the presence of at least one catalyst based on neodymium carboxylate, 2) the polymerization is then terminated by addition of protic compounds and 3) then sulphur chlorides are added to the polymer, and prior to addition these sulphur chlorides are treated with a carboxylic acid, fatty acid and/or fatty acid ester.
    Type: Grant
    Filed: June 18, 2013
    Date of Patent: December 19, 2017
    Assignee: ARLANXEO Deutschland GmbH
    Inventors: Heike Kloppenburg, Thomas Gross, Alex Lucassen, Dave Hardy, Yan Zhang, Alicia Le-Sattler
  • Patent number: 9822491
    Abstract: A method is provided for foaming a ballast bed of a railway track wherein the railway track comprises sleepers positioned on the ballast bed and rails positioned on the sleepers, wherein the rails are covered at least in a partial area along a region of the ballast bed to be foamed, and a foaming agent is introduced into the ballast bed while the rails are covered, wherein the ballast bed has in a sleeper bay defined by two successive sleepers an upper side facing against the gravitational direction, and the ballast bed is heaped up so that the upper side of the ballast bed reaches at least up to an underneath side of the sleeper facing in the gravitational direction.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: November 21, 2017
    Assignee: COVESTRO DEUTSCHLAND AG
    Inventors: Torsten Erwe, Thomas Gross, Thomas Kleiner