Abstract: A method and system for displaying an business object explorer within a development environment includes displaying a control bar including actionable items; in response to selection of an actionable item, displaying a list of business objects in a tree area, the business objects including at least one expandable business object; and in response to selection of the at least one expandable business object, expanding the at least one expandable business object to display a hierarchical tree including attributes of the selected at least one expandable business object in the tree area.

Abstract: A semiconductor component includes a semiconductor body, in which are formed: a substrate of a first conduction type, a buried semiconductor layer of a second conduction type arranged on the substrate, and a functional unit semiconductor layer of a third conduction type arranged on the buried semiconductor layer, in which at least two semiconductor functional units arranged laterally alongside one another are provided. The buried semiconductor layer is part of at least one semiconductor functional unit, the semiconductor functional units being electrically insulated from one another by an isolation structure which permeates the functional unit semiconductor layer, the buried semiconductor layer, and the substrate. The isolation structure includes at least one trench and an electrically conductive contact to the substrate, the contact to the substrate being electrically insulated from the functional unit semiconductor layer and the buried layer by the at least one trench.

Abstract: Systems, methods, and devices for operating a multiplex wireless local area network using separated uplink and downlink channels in the 802.11 and television white space (TVWS) spectra are disclosed. Opportunistic detection and use of available TVWS frequency channels allows for fixed and mobile wireless devices to more efficiently use the available wireless bandwidth. By using separated uplink and downlink channels, a fixed wireless device can listen to incoming uplink frames from other mobile and fixed wireless devices and monitor for uplink frame collisions. In the event of an uplink frame collision, the fixed wireless device can immediately send a stop frame in the downlink channel to all involved wireless devices to avoid lost channel time due to the delay caused by most acknowledgement-based collision recovery protocols. Similarly, communicating mobile and fixed wireless devices can transmit and receive data frames in both directions simultaneously.

Abstract: The present invention relates to functionalized high-vinyl-content diene rubbers, to the preparation of rubber mixtures which comprise functionalized high-vinyl-content diene rubbers, and to the use thereof for the production of rubber vulcanizates which serve in particular for the production of highly reinforced rubber mouldings, particularly preferably for the production of tyres, where these have particularly low rolling resistance, and particularly high wet skid resistance and abrasion resistance.

Abstract: The invention relates to a high molecular weight bimodal neodymium-catalysed polybutadiene having a high proportion, >95%, of cis-1,4 units and a low proportion, <1%, of 1,2-vinyl content, wherein the polybutadiene has a linear polymeric main fraction and a long chain branched polymeric fraction, wherein the slope in the RGM relationship is >0.5 for the polymeric main fraction and <0.3 for the long chain branched polymeric fraction.

Abstract: A semiconductor component includes a semiconductor body, in which are formed: a substrate of a first conduction type, a buried semiconductor layer of a second conduction type arranged on the substrate, and a functional unit semiconductor layer of a third conduction type arranged on the buried semiconductor layer, in which at least two semiconductor functional units arranged laterally alongside one another are provided. The buried semiconductor layer is part of at least one semiconductor functional unit, the semiconductor functional units being electrically insulated from one another by an isolation structure which permeates the functional unit semiconductor layer, the buried semiconductor layer, and the substrate. The isolation structure includes at least one trench and an electrically conductive contact to the substrate, the contact to the substrate being electrically insulated from the functional unit semiconductor layer and the buried layer by the at least one trench.

Abstract: According to an embodiment, a method of forming a semiconductor device includes: providing a wafer having a semiconductor substrate with a first side a second side opposite the first side, and a dielectric region arranged on the first side; mounting the wafer with the first side on a carrier system; etching a deep vertical trench from the second side through the semiconductor substrate to the dielectric region, thereby insulating a mesa region from the remaining semiconductor substrate; and filling the deep vertical trench with a dielectric material.

Abstract: Methods, systems, and apparatus, including computer program products, for implementing a software architecture design for a software application implementing plan-driven procurement. The application is structured as multiple process components interacting with each other through service interfaces, and multiple service operations, each being implemented for a respective process component. The process components include The process components include an RFQ Processing process component, a Purchase Request Processing process component, a Purchase Order Processing process component, a Purchasing Contract Processing process component, a Supplier Invoice Processing process component, a Supply and Demand Matching process component, an External Procurement Trigger and Response process component, and a Customer Requirement Processing process component.

Abstract: In a steering arrangement for vehicles, in particular underground transport vehicles, including at least four steerable wheels (2), wherein, during cornering, a respective curve-inner wheel is turned more sharply than the respective curve-outer wheel, at least two wheels (2) located opposite each other in respect to the longitudinal center plane of the vehicle are coupled with each other via angle levers (21) and a tie rod (22) connected to the angle levers (21). Curve-inner or curve-outer wheels consecutively arranged in the longitudinal direction of the vehicle are coupled to common pivotal movement via a gear. The angle levers (21), via a coupling rod (24), are each connected with a steering lever (13) each connected with a steerable wheel (2) via a steering rod (10).

Abstract: A composition of a surface-treated-carbon-black and a functionalized polymer with functionalization along the polymer chain is disclosed, wherein the polymer represents a solution SBR including, but not limited to blends of the SBR (PBR4003) with BR, NR and EPDM, and the SBR polymer functionalization comprises polar, oxygen-containing functional groups, such that the compound exhibits reduced hysteresis and rolling resistance, improved wet traction with excellent abrasion resistance as would be used in passenger, truck and racing tires.

Abstract: Methods and apparatus, including systems and computer program products, for a services architecture design that provides enterprise services having supply chain control functionality at the level of an enterprise application. The design includes a set of service operations, process components, and optionally deployment units. Suitable business objects are also described.

Abstract: The present invention relates to thermosetting powder coating compositions comprising of at least one bismuth-containing inorganic pigment, at least one organic phosphorous stabilizer, at least one thermally polymerizable thermosetting powder coating resin and at least one crosslinker. The inventive thermosetting powder coating compositions are advantageously used where there is a need for heat resistant coatings and where only minor surface modifications during over bake conditions are acceptable. The invention also relates to the use of the inventive thermosetting powder coating compositions for the preparation of powdered paints and varnishes for the making of coatings and to coatings obtained therewith.

Abstract: A method for producing a lightweight, sound insulating covering (1, 1?, 1?, 1??) for a body component of a motor vehicle, in particular a lightweight dashboard covering, wherein the covering (1, 1?, 1?, 1??) is produced as a foamed, sound absorbing molded part in a single-stage operation by injecting a reactive mix, comprising polyol and isocyanate, into a cavity (11) of a foaming tool (9), wherein before and/or during the injecting, at least one predetermined surface portion (17), defining the cavity (11) of the foaming tool (9), is temperature-controlled in such a manner that the foamed molded part comprises an integral substantially pore free skin (1.1) with a thickness of at least 0.5 mm on one side, and comprises an open porous surface (1.2) and/or a thinner, sound permeable skin (1.4) on its side opposite to said skin (1.1).

Abstract: The invention relates to a method for producing sound-absorbing flexible polyurethane foam mouldings.

Abstract: In various implementations, a sales order are received from a sales order requester for at least one good, wherein the sales order includes product options for ordered goods via a sales product requirement specification object. A sales order confirmation is generated at least partially based on the sales order and a plan for production of the ordered goods. The ordered goods to be produced based on the plan are allowed. And an outbound delivery request defined by a planning product requirement specification object is generated, wherein the ordered goods are delivered to the sales order requestor based on the delivery request.

Abstract: A method for producing a lightweight, sound insulating covering (1, 1?, 1?, 1?) for a body component of a motor vehicle, in particular a lightweight dashboard covering, wherein the covering (1, 1?, 1?, 1?) is produced as a foamed, sound absorbing molded part in a single-stage operation by injecting a reactive mix, comprising polyol and isocyanate, into a cavity (11) of a foaming tool (9), wherein before and/or during the injecting, at least one predetermined surface portion (17), defining the cavity (11) of the foaming tool (9), is temperature-controlled in such a manner that the foamed molded part comprises an integral substantially pore free skin (1.1) with a thickness of at least 0.5 mm on one side, and comprises an open porous surface (1.2) and/or a thinner, sound permeable skin (1.4) on its side opposite to said skin (1.1).

Abstract: The invention relates to rubber mixtures containing silane and having possibly functionalized diene rubbers and microgels, to a method for the production thereof, and to the use thereof to produce wet slipping resistant and low-rolling resistance motor vehicle tire treads having high abrasion resistance.

Abstract: The present invention relates to functionalised diene rubbers and their production, to rubber mixtures, comprising these functionalised diene rubbers, and to their use for the production of rubber vulcanisates, which serve in particular for the production of highly reinforced rubber mouldings. Particular preference is given to the use in the production of tyres which have particularly low rolling resistance, and particularly high wet slip resistance and abrasion resistance.

Abstract: A semiconductor component includes a semiconductor body, in which are formed: a substrate of a first conduction type, a buried semiconductor layer of a second conduction type arranged on the substrate, and a functional unit semiconductor layer of a third conduction type arranged on the buried semiconductor layer, in which at least two semiconductor functional units arranged laterally alongside one another are provided. The buried semiconductor layer is part of at least one semiconductor functional unit, the semiconductor functional units being electrically insulated from one another by an isolation structure which permeates the functional unit semiconductor layer, the buried semiconductor layer, and the substrate. The isolation structure includes at least one trench and an electrically conductive contact to the substrate, the contact to the substrate being electrically insulated from the functional unit semiconductor layer and the buried layer by the at least one trench.

Abstract: The present invention relates to polymers based on conjugated dienes or on conjugated dienes and vinylaromatic compounds, to a process for their preparation, and to their use.