Abstract: A method and system for assessing the quality of at least one component of optical material which has at least one first center axis includes directing at least one light beam towards at least one detector device such that while changing the position and/or orientation of the component relative to the light beam, the light beam crosses at least from time to time the component and determining, with at least one determination device, at least one characterizing value of at least one figure of merit of the component based on analyzing, with at least one analyzing device, the dependency of a parameter of the light beam detected by the detector device on the position and/or orientation of the component.

Abstract: Emissions of NOX and/or CO are reduced at the stack by systems and methods wherein a primary fuel is thoroughly mixed with a specific range of excess combustion air. The primary fuel-air mixture is then discharged and anchored within a combustion chamber of a burner. Further, the systems and methods provide for dynamically controlling NOX content in emissions from a furnace by adjusting the flow of primary fuel and of a secondary stage fuel, and in some cases controlling the amount or placement of combustion air into the furnace.

Abstract: The present disclosure relates to dual beam device and three-dimensional circuit pattern inspection techniques by cross sectioning of inspection volumes with large depth extension exceeding 1 ?m below the surface of a semiconductor wafer, as well as methods, computer program products and apparatuses for generating 3D volume image data of a deep inspection volume inside a wafer without removal of a sample from the wafer. The disclosure further relates to 3D volume image generation and cross section image alignment methods utilizing a dual beam device for three-dimensional circuit pattern inspection.

Abstract: Systems and methods operate to infer a fuel composition in a combustion system. The fuel composition may be inferred by receiving measured operating parameters including one or more of fuel data defining fuel characteristics used in combustion within a heater of the combustion system, emissions data defining emission gasses exiting the heater, airflow data defining ambient air being supplied to the heater and airflow rate of the air within the heater. One or more relationships within the measured operating parameters may be identified that result in a list of potential fuel compositions. One of the potential fuel compositions from the list may be selected having sufficient likelihood of resulting in the measured operating parameters as an inferred fuel composition. The output the inferred fuel composition to a heater controller of the combustion system and used for automatic control thereof.

Abstract: Combustion heater control systems and methods that include dynamic safety settings. Current operating parameters of the combustion heater are sensed at a plurality of time intervals and converted into a time-varying signal. The time-varying signal is compared to a burner stability envelope indicating when a burner is likely to enter an unstable state. The unstable state may include huffing, flashback, and/or liftoff. When the burner is likely to enter an unstable state, the combustion heater is controlled to prevent the unstable state.

Abstract: Methods for determining metrology sites for products includes detecting corresponding objects in measurement data of one or more product samples, and aligning the detected objects are aligned. The methods also include analyzing the aligned objects, and determining metrology sites based on the analysis. Devices use such methods to determine metrology sites for products.

Abstract: Systems and methods for determining operating discrepancy a process heater. The discrepancy may be identified by solving a fired-systems model of the heater. The fired-systems model is then compared to current operating data. If the sensed current operating data is outside of the expected value(s), as defined by the fired-systems model, the systems and methods may take a remediation action to resolve the discrepancy. The discrepancy may include convection fouling identification and identification of tramp-air leaks within the process heater that are otherwise not easily detected by a human operator.

Abstract: A method of determining a size of a contact area between a first 3D structure and a second 3D structure in an integrated semiconductor sample, includes the following steps: obtaining at least a first cross section image and a second cross section image parallel to the first cross section image, wherein obtaining the first and second cross section images includes subsequently removing a cross section surface layer of the integrated semiconductor sample using a focused ion beam to make a new cross section accessible for imaging, and imaging the new cross section of the integrated semiconductor sample with an imaging device; performing image registration of the obtained cross section images and obtaining a 3D data set; determining a 3D model representing the first 3D structure and the second 3D structure in the 3D data set; and determining a relative overlap of the first 3D structure with the second 3D structure based on the 3D model.

Abstract: A 3D tomographic inspection method for the inspection of semiconductor features in an inspection volume of a semiconductor wafer includes obtaining a 3D tomographic image, and selecting a plurality of 2D cross section images. The method also includes identifying contours of HAR structures, and extracting deviation parameters. The deviation parameters describe fabrication errors such as displacement, deviation in radius or diameter, area or shape.

Abstract: Systems and methods iteratively solve a fired-systems model of the process heater based on fuel information, a target heat release of the plurality of burners, ambient air information, and available airflow at each of the plurality of burners to identify optimized burner air register settings to achieve a target global excess oxygen level to be sensed by the oxygen sensor. The optimized burner air register settings may be output to a heater controller of the process heater for control of the process heater.

Abstract: The present disclosure relates to a method for non-destructive inspection of a structure, preferably a through-glass via, TGV, of a substrate, preferably a glass substrate, comprising the steps of: applying a moldable mass onto a surface of the structure of the substrate; hardening of the moldable mass so that the mass is elastic; non-destructive removing of the elastic mass from the structure; and analyzing the removed elastic mass according to at least one parameter, preferably a quality parameter.

Abstract: A three-dimensional circuit pattern inspection technique includes cross sectioning integrated circuits for obtaining a 3D volume image of an integrated semiconductor sample. The method employs a feature based alignment of cross section images based on features of an integrated semiconductor sample. A computer program product and apparatus are provided.

Abstract: A method includes detecting a plurality of anomalies in an imaging dataset of a wafer. The wafer includes a plurality of semiconductor structures. The method also includes executing multiple iterations. At least some of the iterations include determining a current classification of the plurality of anomalies using a machine-learned classification algorithm and tiles of the imaging dataset associated with the plurality of anomalies. The current classification includes a current set of classes into which the anomalies of the plurality of anomalies are binned. The method further includes, based on at least one decision criterion, selecting at least one anomaly of the plurality of anomalies for a presentation to a user. In addition, the method includes, based on an annotation of the at least one anomaly provided by the user with respect to the current classification, re-training the classification algorithm.

Abstract: A method includes obtaining an image data set that depicts semiconductor components, and applying a hierarchical bricking to the image data set. In this case, the bricking includes a plurality of bricks on a plurality of hierarchical levels. The bricks on different hierarchical levels have different image element sizes of corresponding image elements.

Abstract: A method, including: recording plural images of an object by scanning plural particle beams across the object and detecting signals generated by the particle beams, wherein the plural particle beams are generated by a multi-beam particle microscope; determining plural regions of interest; determining plural image regions in each of the recorded images; determining plural displacement vectors; and determining image distortions based on image data of the recorded images and the determined displacement vectors.

Abstract: A method includes obtaining at least one 2-D image dataset of semiconductor structures formed on a wafer including one or more defects during a wafer run of a wafer using a predefined fabrication process. The method also includes determining, based on at least one machine-learning algorithm trained on prior knowledge of the fabrication process and based on the at least one 2-D image dataset, one or more process deviations of the wafer run from the predefined fabrication process as a root cause of the one or more defects. A 3-D image dataset may be determined as a hidden variable.

Abstract: A method includes controlling a multi-scanning electron microscope, mSEM, to capture a first image of a wafer attached to a motorized handling stage while the motorized handling stage is in a first position. The first image includes at least a part of a notch of the wafer. The method also includes determining a radial axis of the wafer based on the first image, and controlling the motorized handling stage to shift the wafer along the radial axis by half a diameter of the wafer so that the motorized handling stage is in a second position. The method further includes controlling the mSEM to capture a second image of the wafer while the motorized handling stage is in the second position. The second image includes wafer structures.

Abstract: An optical tool is used to define critical regions in a wafer including a plurality of dies manufactured with different process parameters. An mSEM is used to scan the critical regions.

Abstract: Methods for determining metrology sites for products includes detecting corresponding objects in measurement data of one or more product samples, and aligning the detected objects are aligned. The methods also include analyzing the aligned objects, and determining metrology sites based on the analysis. Devices use such methods to determine metrology sites for products.

Abstract: Methods for determining one or more quality or size parameters of a structure in a semiconductor product, on the basis of an image of the semiconductor product which was generated with the aid of charged particles which have been radiated onto the semiconductor product, include: providing the image of the semiconductor product; applying the provided image to a machine-learning-based method such as, e.g., an artificial neural network which has been trained with training images of semiconductor products and which is configured to generate an output parameter from the provided image; and determining the size parameter of the structure on the basis of the output parameter.