Abstract: An encapsulated integrated circuit package includes a large number of traces spaced a significant distance from the integrated circuit. Bond pads of the integrated circuit are electrically connected to corresponding traces by corresponding long wires. Since the long wires are intermediately bonded to intermediate bonding pads between the integrated circuit and the traces and extend along the surface of the substrate, the long wires are not susceptible to wire sweep during the encapsulation process used to form the package body.

Abstract: Semiconductor packages and other electronic assemblies having an active heat sink are disclosed, along with methods of making the same. The active heat sink includes a cavity partially filled with a heat activated liquid. Heat generated during operation of a chip boils the heat activated liquid. The vapor condenses on an inner surface of the active heat sink and transfers heat to an outer, possibly finned, surface exposed to ambient to dissipate heat. In some embodiments, the active heat sink may be a closed vessel mounted on the chip. In some embodiments, the vessel of the active heat sink is formed from a die pad of a leadframe substrate. The die pad includes a recess that forms the active heat sink cavity when bonded to the back surface of the chip. The heat activated liquid directly contacts the back surface of the chip in these embodiments.

Abstract: Methods for forming packages for housing an integrated circuit device are disclosed. In one embodiment, a plastic sheet having an first surface is provided. An array of package sites is formed on the first surface of the plastic sheet. The package sites each include a metal die pad and leads surrounding the die pad. The package sites may be formed by applying a first metal layer on the first surface of the plastic sheet, and then applying a second metal layer in a pattern that defines the die pads and leads of the package sites. The first metal layer is then selectively etched using the second metal layer as an etch mask. Next, an integrated circuit die is placed on each die pad of the array. The die is electrically connected to the leads surrounding the respective die pad. An encapsulant is applied onto the first surface of the plastic sheets so as to cover the package sites.

Abstract: A stackable package for an integrated circuit (e.g., a flip chip) is disclosed. The package includes a molded plastic package body having a first side, an opposite second side, and side surfaces extending vertically between the first and second sides. A plurality of leads extend from the package body. Each lead has a first portion embedded in the package body, a second portion extending vertically adjacent to a peripheral side surface of the package body, and a third portion adjacent to and extending over first side of package body. A surface of embedded first portion of the leads is exposed at the second side of the package body. The package may be vertically stacked on another package and electrically connected thereto. Keys extending from the package body of the first package engage keyholes of the other package. A heat sink is horizontally disposed between the packages. The heat sink has a rectangular body and radiating fins.

Abstract: A miniature radio-frequency identification (RFID) transceiver and a method for making the same are provided. The RFID transceiver is small in size and physically rugged. The RFID transceiver includes an integrated circuit and a radio-frequency antenna that is fixed to the integrated circuit and electrically connected to the integrated circuit. The integrated circuit includes an RFID transceiver circuit. The antenna may be a single thin-film layer over the top surface of the integrated circuit or multiple layers that form a larger antenna in a compact, folded structure. Multiple antenna layers may also be used to form a three-dimensional structure for improved antenna operation or may be used to form separate, independent antennas.

Abstract: A method of making a package for an integrated circuit device having an optical cell is disclosed. The package includes a base of molded encapsulant material. A metal leadframe is embedded in the plastic base at the upper surface of the base. Encapsulant material covers the lower and side surfaces of the die pad and the leads of the leadframe, but does not cover the upper surfaces of the die pad and leads. An optical integrated circuit device is attached to the exposed surface of the die pad. An adhesive bead is applied around the optical device on the exposed upper surface of the leads. An optically clear cover is placed on the adhesive bead. When hardened, the bead supports the cover above the optical device.

Abstract: A structure comprises a substrate with electronic components formed on a first surface of the substrate. The structure includes a scribe line on a first surface of the substrate. The structure includes a trench formed by a laser on the second or back-side surface of the substrate, thus protecting the front-side surface of the substrate and, more particularly, the electronic component such as an integrated circuit and/or functional unit on the front-side surface of the substrate during singulation. Since, according to the invention, no saw blade is used, the width of the scribe line does not need to be any larger than the width of the beam from the laser plus some minimal tolerance for alignment. As a result, using the invention, the width of scribe line is on the order of twenty-four times smaller than the width of scribe lines required by the prior art methods.

Abstract: Micromachine chips are tested for validity while the micromachine chips are still in wafer form. Any defective micromachine chips are marked or otherwise identified. Coupons are attached to the micromachine chips. The coupons are attached only to the micromachine chips which have been tested and found to be good. In this manner, waste of coupons is avoided and labor associated with attaching the coupons to defective micromachine chips is saved.

Abstract: An image sensor package includes an image sensor having bond pads and an active area on an upper surface of the image sensor. The image sensor package further includes a window support on the upper surface of the image sensor. The window support entirely encloses the upper surface including the active area and the bond pads. A window is in contact with the window support, the window overlying the active area. Generally, the window support and the window entirely enclose, and thus protect, the active area of the image sensor.

Abstract: The invention provides a manufacturing process for making chip-size semi-conductor packages (“CSPs”) at the wafer-level without the added size, cost, and complexity of substrates in the packages or the need to overmold them with plastic. One embodiment of the method includes the provision of a semiconductor wafer with opposite top and bottom surfaces and a plurality of dies integrally defined therein. Each die has an electronic device formed in a top surface thereof, and one or more electrically conductive vias extending therethrough that electrically connect the electronic device to the bottom surface of the die. The openings for the vias are formed ablatively with a laser and plated through with a conductive material. In a BGA form of the CSP, the vias connects the electronic device to lands on the bottom surface of the die. The lands may each have a bump of a conductive metal, e.g., solder, attached to it that functions as an input-output terminal of the CSP.

Abstract: A module of electrically interconnected integrated circuit packages and methods of making the module are disclosed. The module includes at least first and second integrated circuit packages, each of which are comprised of a package body formed of an encapsulant material. A plurality of leads extend from the package bodies of the first and second packages. The leads are bent into a C-shape. Keys and keyholes in the package bodies allow the packages to be stacked one on top of the other. One or more leads of the first package are electrically connected to one or more leads of the second package through an interposer that is positioned between the first and second packages. The interposer includes conductive paths that enable the electrical connection of leads of the first and second packages in cases where the leads to be interconnected are displaced from one and other.

Abstract: A wafer is singulated from the back-side surface of the wafer using laser ablation, thus protecting the front-side surface of the wafer and, more particularly, the integrated circuits and/or functional units on the front-side surface. Since, according to the invention, no saw blade is used, the width of the scribe lines does not need to be any larger than the width of the beam from the laser plus some minimal tolerance for alignment. As a result, using the invention, the width of scribe lines is on the order of twenty-four times smaller than the width of scribe lines required by the prior art methods.

Abstract: An electronic device, such as a sensor die, is packaged by first forming a hole through a substrate. The hole is made large enough to position the entire electronic device within the hole. A tape is then applied to the second surface of the substrate to cover a second side of the hole, thereby creating a tape surface at the bottom of the hole. The electronic device is then positioned within the hole such that the electronic device is in contact with, and adhered to, the tape surface at the bottom of the hole. Electronic connections are made between the electronic device and the substrate and a layer of encapsulant is applied. In one embodiment, the electronic device is a sensor die and an optical element is positioned over an active region of the sensor die before the encapsulant is applied. The encapsulant then surrounds and holds the optical element in position over the active region of the sensor die.

Abstract: A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. Of importance, the substrate serves a dual function. In particular, the substrate is the window which covers the active area of the image sensor. Further, the substrate is the platform upon which the image sensor package is fabricated. As a result, the image sensor package is thin, lightweight and inexpensive to manufacture.

Abstract: Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integrally connected together in an array format. Image sensors are attached and electrically connected to corresponding individual substrates. An adhesive layer attaches the molded window array to the substrate. The substrate and attached molded window array are singulated into a plurality of individual image sensor packages.

Abstract: Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.

Abstract: Methods for forming packages for housing an integrated circuit device are disclosed. In one embodiment, a plastic sheet having an first surface is provided. An array of package sites is formed on the first surface of the plastic sheet. The package sites each include a metal die pad and leads surrounding the die pad. The package sites may be formed by applying a first metal layer on the first surface of the plastic sheet, and then applying a second metal layer in a pattern that defines the die pads and leads of the package sites. The first metal layer is then selectively etched using the second metal layer as an etch mask. Next, an integrated circuit die is placed on each die pad of the array. The die is electrically connected to the leads surrounding the respective die pad. An encapsulant is applied onto the first surface of the plastic sheets so as to cover the package sites.

Abstract: Electrically conductive interior traces and exterior traces are formed on interior and exterior surfaces, respectively, of a window. The interior traces are electrically connected to the exterior traces by electrically conductive vias extending through the window. To mount the window to an image sensor, the interior traces are aligned with bond pads on a front surface of the image sensor. Flip chip bumps are formed between the interior traces and the bond pads thus mounting the window to the image sensor. A sealer is applied to form a seal between the window and the image sensor and to protect an active area of the image sensor.

Abstract: This invention provides a method for making a semiconductor package with stacked dies that substantially reduces risk of fracturing of the dies and prevents breakage of the wire bonds caused by wire sweep. One embodiment of the method includes the provision of a substrate and a pair of semiconductor dies, each having opposite top and bottom surfaces and a plurality of wire bonding pads around the peripheries of their respective top surfaces. One die is attached and wire bonded to a top surface of the substrate. A measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed out to the edges of the dies by pressing the bottom surface of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive. The adhesive is cured and the second die is wire bonded to the substrate. A bead of an adhesive is dispensed around the periphery of the dies such that it covers the wire bonds and bonding pads on the second die.

Abstract: A method of forming an encapsulated integrated circuit package includes forming a large number of traces spaced a significant distance from the integrated circuit. Intermediate bonding pads are formed between the integrated circuit and the traces. Bond pads of the integrated circuit are electrically connected to corresponding traces by corresponding long wires, which are intermediately bonded to the intermediate bonding pads. Since the long wires are intermediately bonded to intermediate bonding pads and extend along the surface of the substrate, the long wires are not susceptible to wire sweep during the encapsulation process used to form the package body.