Abstract: The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effects into account A semiconductor memory test mode configuration includes a first capacitor for storing digital data connecting a cell plate line to a first bit line through a first select transistor. The first select transistor is activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines for measuring a differential read signal on the first and second bit lines.

Abstract: The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effects into account. A semiconductor memory test mode configuration includes a first capacitor for storing digital data connecting a cell plate line to a first bit line through a first select transistor. The first select transistor is activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is activated through a connection to the word line.

Abstract: Improved sensing of ferroelectric memory cells is disclosed. When a memory access is initiated, the bitlines are precharged to a negative voltage, for example, −0.5 to −1.0V. This increases the effective plateline pulse (VPLH) to VPLH+the magnitude of the negative voltage. This results in an increase in the difference between VHI and VL0 read signals, thereby increasing the sensing window.

Abstract: An improved cell design for series memory architecture is disclosed. The improved cell design facilitates the formation of capacitors using a single etch process instead of two, as conventionally required. In one embodiment, each capacitor of a capacitor pair is provided with at least one plug contacting a common diffusion region of two adjacent cell transistors. In another embodiment, a large plug with sufficient overlap to the bottom electrodes of pair of capacitors is used.

Abstract: A redundancy unit comprising first and second fuse blocks for programming the redundancy element is disclosed. One fuse block has laser blowable fuses and the other electrical fuses. The redundancy unit can be programmed by either one of the fuse blocks, enabling the redundancy unit to able to be used for defects identified before packaging and as well as after.

Abstract: A memory IC having improved sensing during reads is disclosed. The IC includes the use of first and second reference voltages for sensing to compensate for asymmetry that exists between cells on bitline true and bitline complement. The first reference voltage is used for sensing a cell on bitline true while the second reference voltage is used for sensing a cell on bitline complement.

Abstract: An improved cell design for series memory architecture is disclosed. The improved cell design facilitates the formation of capacitors using a single etch process instead of two, as conventionally required. In one embodiment, each capacitor of a capacitor pair is provided with at least one plug contacting a common diffusion region of two adjacent cell transistors. In another embodiment, a large plug with sufficient overlap to the bottom electrodes of pair of capacitors is used.

Abstract: A test circuit is integrated in a ferroelectric memory component in order to make analog measurements of bit line signals of ferroelectric memory cells. The test circuit, when in a test mode, reads out analog signal values for the respective memory content of the cells and feds the analog signal values to a downstream evaluation device. The test circuit is integrated as an analog circuit in the ferroelectric memory component and, in the test mode with non-activated or disconnected sense amplifiers, is configured to output analog bit line signals from the memory component to a point outside the memory component.

Abstract: A semiconductor memory device includes a memory cell array, a plurality of input/output terminals to input cell data written to the memory cell array and output cell data read from the memory cell array, a test mode setting circuit which sets a test mode to monitor a plurality of timing signals which control input/output operation timing of the cell data, and switch circuits connected to the plurality of input/output terminals. The switch circuits simultaneously output the plurality of timing signals from the plurality of input/output terminals in the test mode.

Abstract: A test circuit for testing differential read signals during a memory access is disclosed. The test circuit is coupled to a pair of bitlines. During a read access, a selected memory cell produces a differential read signal on the bitlines. When the test circuit is activated, the magnitude of the differential read signal is varied. This enables easy testing of read signal margins in, for example, memory ICs.

Abstract: An improved redundancy scheme for a memory matrix is disclosed. The memory matrix a plurality of memory cells interconnected in first and second directions. The memory cells are grouped into memory elements. A redundant memory element having a plurality of redundant memory cells is provided. The redundant memory element is segmented into R sections in the first direction, wherein R is a whole number greater to or equal to 2. By segmenting the redundant element into R sections, it can be used to repair defects in up to R different memory elements.

Abstract: An MRAM configuration has selection transistors and MTJ layer sequences lying in parallel with each other in a memory cell matrix. A considerable space saving can thus be achieved and therefore the MRAM configuration is less expensive to manufacture and has a greater packing density. In addition, the MRAM configuration allows a rapid read access with a minimal area requirement.

Abstract: An integrated magnetoresistive semiconductor memory system, in which n memory cells that contain two magnetic layers each separated by a thin dielectric barrier, and associated word lines and bit lines that cross one another are vertically stacked in n layers. The system further contains a decoding circuit for selecting one of the n memory layers. The decoding circuit, on both ends of a word line or a bit line, is provided with one configuration each that contains n layer selecting transistors for selecting one of the n memory layers, and with a line selection transistor for selecting the respective horizontal word line or bit line on which a voltage is to be impressed.

Abstract: An integrated ferroelectric memory configuration and a method for producing the integrated ferroelectric memory configuration, in which memory cells are arranged using the stacking principle, and both capacitor electrodes, which are located one above the other, of each memory cell are directly electrically connected by means of contact plugs to corresponding source and drain regions of an associated selection transistor in the substrate. Contact plugs for the contact connection to the upper capacitor electrodes are produced from above the configuration.

Abstract: A semiconductor memory device includes a memory cell array, a plurality of input/output terminals to input cell data written to the memory cell array and output cell data read from the memory cell array, a test mode setting circuit which sets a test mode to monitor a plurality of timing signals which control input/output operation timing of the cell data, and switch circuits connected to the plurality of input/output terminals. The switch circuits simultaneously output the plurality of timing signals from the plurality of input/output terminals in the test mode.

Abstract: In order to provide a particularly space-saving capacitor configuration in a memory device, a plurality of second electrode regions which are not in direct electrical contact with one another are formed on areas of a first electrode region covered by a dielectric material. During operation of the capacitor configuration, portions of the first electrode region form bottom electrodes which are connected by a connecting region, so that an additional connecting device for the bottom electrodes is not necessary.

Abstract: An improved redundancy scheme for a memory matrix is disclosed. The memory matrix a plurality of memory cells interconnected in first and second directions. The memory cells are grouped into memory elements. A redundant memory element having a plurality of redundant memory cells is provided. The redundant memory element is segmented into R sections in the first direction, wherein R is a whole number greater to or equal to 2. By segmenting the redundant element into R sections, it can be used to repair defects in up to R different memory elements.

Abstract: An improved redundancy scheme for chained memory architecture is disclosed. The redundancy scheme comprises including redundant cells as part of the memory chain. As such, a redundant cell is used to repair a defective cell within the chain. This eliminates the need in conventional chained architecture to replace the whole memory block when there is a defective cell.

Abstract: An IC with memory cells arranged in groups is described. The memory cells, for example, are ferroelectric memory cells. The IC includes a variable voltage generator (VVG) for generating an output voltage having a different voltage level depending on a location of an addressed memory cell within the memory group is provided. By providing different voltage levels for reads and/or writes, signal loss caused by capacitances which is dependent on the location of the memory cell within the group can be avoided. This improves read and/or write operations in series memory architectures.

Abstract: Memory reliability is improved by using redundancy to repair errors detected by ECC. In one embodiment, redundancy repairs errors which cannot be corrected by ECC. The redundancy can employ the use of electronic fuses, enabling repairs after an IC containing the memory is packaged. Redundancy can also be performed prior to packaging of the IC.