Patents by Inventor Thomas V. Sikina

Thomas V. Sikina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190150271
    Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 16, 2019
    Inventors: Semira M. Azadzoi, James E. Benedict, John P. Haven, Thomas V. Sikina, Andrew R. Southworth
  • Publication number: 20190148832
    Abstract: The concepts, systems, circuits and techniques described herein are directed toward a spiral antenna which may be provided using additive manufacturing technology so as to provide an antenna capable of operation at frequencies which are higher than spiral antennas manufactured using standard photo-etch or printed circuit board (PCB) manufacturing processes.
    Type: Application
    Filed: November 5, 2018
    Publication date: May 16, 2019
    Inventors: Peter J. Adams, Thomas V. Sikina, John P. Haven, James E. Benedict
  • Publication number: 20190148807
    Abstract: Circuits and methods include transmission lines formed from a conductive cladding on a substrate surface. The transmission line includes additional reference conductors positioned co-planar on the surface, including a gap between the transmission line and each of the reference conductors. The transmission line and the reference conductors are at least partially encapsulated (e.g., sandwiched) between two substrates. Isolation boundaries may be included as ground planes, e.g., above and below the transmission line, on opposing surfaces of the substrates, and Faraday walls, e.g., vertically, through the substrates. Current densities generated by various electromagnetic signals are distributed among the transmission line and the reference conductors (as a tri-conductor arrangement), and may be partially further distributed to the isolation (ground) boundaries.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 16, 2019
    Inventors: Thomas V. Sikina, John P. Haven, James E. Benedict
  • Publication number: 20190150296
    Abstract: Electromagnetic circuit structures and methods are provided for a circuit board that includes a hole disposed through a substrate to provide access to an electrical component, such as a signal trace line (or stripline), that is at least partially encapsulated (e.g., sandwiched) between substrates. The electrical component includes a portion substantially aligned with the hole, and an electrical conductor is disposed within the hole. The electrical conductor is soldered to the portion of the electrical component.
    Type: Application
    Filed: May 24, 2018
    Publication date: May 16, 2019
    Inventors: Andrew R. Southworth, Thomas V. Sikina, John P. Haven, James E. Benedict, Kevin Wilder
  • Publication number: 20190148828
    Abstract: A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 16, 2019
    Inventors: Thomas V. Sikina, John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina, Andrew R. Southworth
  • Publication number: 20190148837
    Abstract: Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.
    Type: Application
    Filed: November 5, 2018
    Publication date: May 16, 2019
    Inventors: John P. Haven, Thomas V. Sikina, Peter J. Adams, James E. Benedict
  • Patent number: 10281571
    Abstract: A radar system uses a rotating antenna array having rows that display dispersive properties while feeding multiple radiating elements. In some embodiments, the radiating elements are dual polarized. In at least one embodiment, beam spoiling may be used to generate an unfocused transmit beam that covers an entire elevation range of interest. Digital beam forming may be used during a receive mode to achieve a stack of narrow-width receive beams in elevation. Frequency scanning may also be used to achieve stacked beams in azimuth.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: May 7, 2019
    Assignee: Raytheon Company
    Inventors: Eli Brookner, Thomas V. Sikina, Peter R. Drake, Yuchoi F. Lok, Jacqueline M. Bourgeois, Daniel F. Rypysc, Francis Hartwich, Yueh-Chi Chang, Leon Green
  • Publication number: 20180183146
    Abstract: A via-less beamformer provided from a plurality of circuits elements having circuit layouts selected to mitigate unwanted reactive coupling there between. At least one of the plurality of circuit elements is provided having a circuit layout selected based upon reactive field theory. In one embodiment, a circuit layout may be selected by: determining which circuit features of the circuit elements produce reactive fields in response to a signal provided thereto, separating the total field into a modal set and determining the modal weighting coefficients based on geometrical and/or design features of the of the circuit elements. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits. In one embodiment the via-less beamformer comprises one or more branch hybrid coupler circuits. In one embodiment the via-less beamformer comprises one or more via-less combiner/divider circuits and one or more branch hybrid coupler circuits.
    Type: Application
    Filed: December 27, 2016
    Publication date: June 28, 2018
    Applicant: Raytheon Company
    Inventors: Thomas V. Sikina, John P. Haven, Philip M. Henault, Alkim Akyurtlu
  • Patent number: 9979084
    Abstract: Methods and apparatus to calibrate an array by sequentially calibrating elements in a subarray with respect to each other using a satellite. The satellite is repeatedly illuminated for calibrating the elements using reference elements to determine plane fronts from which active elements can be calibrated with respect to each other.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: May 22, 2018
    Assignee: Raytheon Company
    Inventors: Thomas V. Sikina, Jack J. Schuss, Joseph C. Yeh, Patrick J. Makridakis
  • Patent number: 9974160
    Abstract: Systems and methods described herein are provided for electrically coupling conductors within a multilayered printed circuit board (PCB) using an interconnect formed along an outer surface of one or more stripline boards making up the multilayered PCB. The multilayered PCB may include first and second stripline boards each having multiple dielectric layers. A first conductor may be formed in the first stripline between the multiple dielectric layers and a second conductor may be formed in the second stripline between the multiple dielectric layers. The interconnect may be formed over an outer surface the dielectric layers such that the interconnect extends from the first conductor to the second conductor. An electrically conductive wall may be formed over the edge or side portion of the dielectric layers to form a cavity that encloses the interconnect and the outer surface of the multilayered PCB.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: May 15, 2018
    Assignee: Raytheon Company
    Inventors: Thomas V. Sikina, Mary K. Herndon, John P. Haven, Alkim Akyurtlu
  • Patent number: 9379446
    Abstract: Methods and apparatus for a dual polarization super-element radiator assembly. In one embodiment, an assembly comprises a first waveguide, a series of slot couplers formed in the first waveguide, first and second conductive strips, a second waveguide adjacent to the first waveguide, a series of notches formed in a conductive material extending along or parallel to the longitudinal axis of the second waveguide, the notches having respective throats, a series of slots located proximate the notch throats, and a third conductive strip disposed over and aligned with the notches, wherein the slot couplers and the notches provide a dual polarization super-element radiator.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: June 28, 2016
    Assignee: Raytheon Company
    Inventors: Jack J. Schuss, Thomas V. Sikina, Gregory M. Fagerlund, Steven P. Kemp
  • Publication number: 20160156100
    Abstract: Methods and apparatus to calibrate an array by sequentially calibrating elements in a subarray with respect to each other using a satellite. The satellite is repeatedly illuminated for calibrating the elements using reference elements to determine plane fronts from which active elements can be calibrated with respect to each other.
    Type: Application
    Filed: December 2, 2014
    Publication date: June 2, 2016
    Applicant: Raytheon Company
    Inventors: Thomas V. Sikina, Jack J. Schuss, Joseph C. Yeh, Patrick J. Makridakis
  • Patent number: 9331751
    Abstract: Described embodiments calibrate an array antenna using near-field antenna measurements individually for each antenna element in an antenna under test (AUT). A signal is received at a first AUT antenna element from an antenna probe assembly by transmitting from the antenna probe assembly at each of multiple known probe locations in a near-field of the AUT. A signal is received at each probe location by transmitting from the first antenna element of the AUT to the antenna probe assembly. The received signals are combined into a combined signal for the first antenna element that de-correlates multi-path in the combination result. The combined signal is processed to generate a calibration coefficient for the first AUT antenna element. Remote boundary condition (RBC) testing is performed to reduce temporal instability. The multiple known probe locations lie on one of the following: a planar surface, a cylindrical surface, and a spherical surface.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: May 3, 2016
    Assignee: Raytheon Company
    Inventors: Thomas V. Sikina, Jack J. Schuss, Joseph E. Hilliard, Jr.
  • Publication number: 20160054439
    Abstract: A radar system uses a rotating antenna array having rows that display dispersive properties while feeding multiple radiating elements. In some embodiments, the radiating elements are dual polarized. In at least one embodiment, beam spoiling may be used to generate an unfocused transmit beam that covers an entire elevation range of interest. Digital beam forming may be used during a receive mode to achieve a stack of narrow-width receive beams in elevation. Frequency scanning may also be used to achieve stacked beams in azimuth.
    Type: Application
    Filed: August 20, 2015
    Publication date: February 25, 2016
    Applicant: Raytheon Company
    Inventors: Eli Brookner, Thomas V. Sikina, Peter R. Drake, Yuchoi F. Lok, Jacqueline M. Bourgeois, Daniel F. Rypysc, Francis Hartwich, Yueh-Chi Chang, Leon Green
  • Publication number: 20160043778
    Abstract: Near field array antenna calibration is performed using multiple probe element locations within the near field of an array antenna for each element of the array.
    Type: Application
    Filed: August 5, 2014
    Publication date: February 11, 2016
    Inventors: Thomas V. Sikina, Jack J. Schuss, Joseph E. Hilliard, JR.
  • Patent number: 9070964
    Abstract: Methods and apparatus for a super-element assembly for a phased array radar aperture, the super-element assembly having a first port and a second port to receive a first signal at the first port to generate a main beam, and receive a second signal at the second port to generate an image beam for generating scan volume coverage using the main and image beams.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: June 30, 2015
    Assignee: Raytheon Company
    Inventors: Jack J. Schuss, Thomas V. Sikina, Kaichiang Chang, Jeffrey C. Upton
  • Patent number: 9019153
    Abstract: Methods and apparatus for a calibration system including a support structure movable over an array, a super-element secured to the support structure to obtain information at selected locations in relation to the array, and a processor to compute a sum of voltages for determining a level of calibration for the array.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: April 28, 2015
    Assignee: Raytheon Company
    Inventors: Jack J. Schuss, Thomas V. Sikina, Jeffrey C. Upton
  • Patent number: 8963789
    Abstract: A conformal hybrid elctro-optical/radio frequency (EO/RF) aperture including an optical phased array (OPA) in a center portion of the aperture, and a variable inclination continuous transverse stub (VICTS) RF antenna surrounding the OPA using a plurality of continuous transverse stub (CTS) subarrays.
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: February 24, 2015
    Assignee: Raytheon Company
    Inventors: Yueh-Chi Chang, Bradley G. Porter, Gregory M. Fagerlund, Leonard C. Bennett, Thomas V. Sikina, Brandon K. Mui
  • Patent number: 8866686
    Abstract: Methods and apparatus for a super-element assembly including a dielectric subassembly having first and second conductive patch conductors extending a longitudinal axis of the super-element assembly, a ridged waveguide having a series of slots formed along its length. The super-element assembly provides a significant advance in the art in module reduction, production cost reduction, and enhanced scan angle response.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: October 21, 2014
    Assignee: Raytheon Company
    Inventors: Thomas V. Sikina, Gregory M. Fagerlund, Jack J. Schuss, Karen A. Rapoza
  • Publication number: 20120177376
    Abstract: A conformal hybrid elctro-optical/radio frequency (EO/RF) aperture including an optical phased array (OPA) in a center portion of the aperture, and a variable inclination continuous transverse stub (VICTS) RF antenna surrounding the OPA using a plurality of continuous transverse stub (CTS) subarrays.
    Type: Application
    Filed: August 10, 2011
    Publication date: July 12, 2012
    Applicant: Raytheon Company
    Inventors: Yueh-Chi Chang, Bradley G. Porter, Gregory M. Fagerlund, Leonard C. Bennett, Thomas V. Sikina, Brandon K. Mui