Abstract: An automated packing system is disclosed for placing a plurality of objects into a shipping container. The system includes a supply bin receiving conveyor for receiving a supply bin at a supply station, a placement planning system for determining a packing placement order for the plurality of objects, a detection system for detecting a plurality of objects within the supply bin responsive to the position of the supply bin on the receiving conveyor as aligned by the alignment system, an object selection system for selecting a selected object from the plurality of objects to be placed into the shipping container, and a programmable motion device for grasping and acquiring the selected object from the plurality of objects at the supply station, and for placing the selected object into the shipping container in a selected orientation.

Abstract: A method of processing objects is disclosed using a programmable motion device. The method includes the steps of acquiring an object from a plurality of mixed objects at an input area, perceiving identifying indicia in connection with the object, assigning an intermediate station to a destination location for the object responsive to the identifying indicia in connection with the object, and moving the acquired object toward the intermediate station.

Abstract: Disclosed herein are microelectronic packages having thermally conductive layers and methods for manufacturing the same. The microelectronics packages may include a substrate and a plurality of dies connected to the substrate and/or each other to form a die stack. The dies may have a perimeter. A thermally conductive layer may be located in between the respective dies. The thermally conductive layers may extend past at least a portion of the perimeters, thereby providing enhanced cooling of the die stack.

Abstract: In accordance with disclosed embodiments, there is a method of integrating and accessing passive components in three-dimensional fan-out wafer-level packages. One example is a microelectronic die package that includes a die, a package substrate attached to the die on one side of the die and configured to be connected to a system board, a plurality of passive devices over a second side of the die, and a plurality of passive device contacts over a respective passive die, the contacts being configured to be coupled to a second die mounted over the passive devices and over the second side of the die.

Abstract: An automated packing system is disclosed for placing a plurality of objects into a shipping container. The system includes a supply bin receiving conveyor for receiving a supply bin at a supply station, a destination container location assessment system for positioning a destination container, a detection system for detecting a plurality of objects within the supply bin responsive to the position of the supply bin on the receiving conveyor as aligned by the alignment system, an object selection system for selecting a selected object from the plurality of objects to be placed into the shipping container, and a programmable motion device for grasping and acquiring the selected object from the plurality of objects at the supply station, and for placing the selected object into the shipping container in a selected orientation.

Abstract: A semiconductor device is disclosed, comprising a first semiconductor die comprising a plurality of transistors; a second semiconductor die comprising power supply circuitry configured to generate a supply voltage for the plurality of transistors of the first semiconductor die; and a heat spreader structure. A power supply routing for a reference voltage or a power supply voltage which extends from the heat spreader structure through the second semiconductor die to the first semiconductor die.

Abstract: A method for operating a vehicle in an automatic driving operation not requiring any user action which can be deactivated by a deactivation action of a driver of the vehicle includes, during the automatic driving operation in a learning phase, driving situations in which the driver deactivates the automatic driving operation are recorded by a surroundings recording device and the recorded driving situations are stored in a memory as subjectively critical driving situations. The method further includes, during an operating phase of the automatic driving operation, comparing a currently recorded driving situation to the stored subjectively critical driving situations and emitting a warning to the driver when the currently recorded driving situation matches one of the stored subjectively critical driving situations within a tolerance range.

Abstract: A sensor device is disclosed. The sensor device includes a torque sensor unit and a steering angle sensor unit for a motor vehicle. The torque sensor unit is configured to detect a torque which is applied to a steering shaft, rotatable about a main axis of rotation. The torque sensor unit includes at least one torque sensor magnetic unit to generate a torque sensor magnetic field and at least one torque magnetic sensor to generate a torque sensor signal as a function of a torque applied to the shaft. The steering angle sensor unit is configured to detect a rotary angle of the shaft. The steering angle sensor unit includes a main rotor, a first secondary rotor, and a first steering angle magnetic sensor.

Abstract: A box handling system is disclosed for use in an object processing system. The box handling system includes a box tray including a recessed area for receiving a box, and the recessed area includes a plurality of floor and edge portions for receiving the box that contains objects to be processed.

Abstract: An articulated arm system is disclosed that includes an articulated arm including an end effector, and a robotic arm control systems including at least one sensor for sensing at least one of the position, movement or acceleration of the articulated arm, and a main controller for providing computational control of the articulated arm, and an on-board controller for providing, responsive to the at least one sensor, a motion signal that directly controls at least a portion of the articulated arm.

Abstract: Microelectronic integrated circuit package structures include a package structure comprising two or more first integrated circuit (IC) dies directly on and electrically coupled to a substrate. A bridge die is adjacent to the two or more first IC dies and directly on the substrate. A second IC die is directly on the bridge die and on at least one of the two or more first IC dies, and a third IC die is directly on the bridge die, adjacent to the second IC die. A mold material at least partially surrounds the two or more first IC dies and the second and third IC dies.

Abstract: An IC device comprises a composite die structure that includes a base layer of comprising bulk silicon and a first chiplet integral with the base layer. The first chiplet includes first interconnects in first interconnect layers. A second chiplet is bonded to the base layer and horizontally adjacent to the first chiplet. The second chiplet includes second interconnects in second interconnect layers. A first dielectric material is between the first and second chiplets. Third interconnect layers extend over both the first and second interconnect layers. The third interconnect layers include third interconnects and a surface comprising conductive contacts opposite the base layer of the composite die structure. The third interconnects are coupled with the first interconnects, the second interconnects, and the conductive contacts. The third interconnect layers comprise a second dielectric material different from the first dielectric material.

Abstract: A longitudinal control device and a method for a motor vehicle with an electrical drive machine, comprising: an accelerator pedal for specifying a driver intention; a control unit coupled to the accelerator pedal for detecting an accelerator pedal position and an accelerator pedal speed, and to the drive machine to control a drive torque; accelerator pedal characteristics, in particular an accelerator pedal characteristic map, which the control unit accesses to determine an intended drive torque from the driver intention specified by way of the accelerator pedal position; wherein the control unit determines and/or controls an intended drive torque gradient according to a driver intention.

Abstract: A sortation system is disclosed for providing processing of homogenous and non-homogenous objects in both structured and cluttered environments. The sortation system includes a programmable motion device including an end effector, a perception system for recognizing any of the identity, location, and orientation of an object presented in a plurality of objects, a grasp selection system for selecting a grasp location on the object, the grasp location being chosen to provide a secure grasp of the object by the end effector to permit the object to be moved from the plurality of objects to one of a plurality of destination locations, and a motion planning system for providing a motion path for the transport of the object when grasped by the end effector from the plurality of objects to the one of the plurality of destination locations, wherein the motion path is chosen to provide a path from the plurality of objects to the one of the plurality of destination locations.

Abstract: A programmable motion system is disclosed that includes a dynamic end effector system. The dynamic end effector system includes a plurality of acquisition units that are provided at an exchange station within an area accessible by the programmable motion device, and a coupling system for coupling any of the plurality of acquisition units to an end effector of the programmable motion device such that any of the acquisition units may be automatically selected from the exchange station and used by the programmable motion device without requiring any activation or actuation by the exchange station and without requiring any intervention by a human.

Abstract: An induction system for filtering the induction of objects to an object processing system is disclosed. The induction system includes an evaluation means for evaluating at least one characteristic of an object, and a routing system for routing the object in one of a plurality of directions responsive to the evaluated characteristic, at least one of the plurality of directions leading to the object processing system.

Abstract: Telescopic rail with an outer rail, a middle rail, and an inner rail, which, even with a compact design, has both a self-closing mechanism and a mechanism for releasable locking of the rail elements in the fully extended end position.

Abstract: Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. For example, in some embodiments, a microelectronic assembly may include a substrate having a surface including a first cavity; a first die at least partially nested in the first cavity and electrically coupled to the substrate; and a circuit board having a surface including a second cavity, wherein the surface of the substrate is electrically coupled to the surface of the circuit board, and wherein the first die extends at least partially into the second cavity in the circuit board.

Abstract: Embodiments disclosed herein include electronic package and methods of forming such packages. In an embodiment, an electronic package comprises a mold layer and a first die embedded in the mold layer. In an embodiment, the first die comprises first pads at a first pitch and second pads at a second pitch. In an embodiment, the electronic package further comprises a second die embedded in the mold layer, where the second die comprises third pads at the first pitch and fourth pads at the second pitch. In an embodiment, a bridge die is embedded in the mold layer, and the bridge die electrically couples the second pads to the fourth pads.