Abstract: An induction system is disclosed for filtering the induction of objects to a plurality of object processing systems. The induction system includes an evaluation means for evaluating at least one characteristic of an object, and routing means for routing the object in one of a plurality of directions responsive to the evaluated characteristic, at least one of the plurality of directions leading to a selected one of the plurality of object processing systems.

Abstract: The invention relates to neutralizing antibodies of GM-CSF and compositions comprising the same for use in the treatment of inflammatory disorders such as rheumatoid arthritis according to specific dosing regimen. The invention relates also to neutralizing antibodies of GM-CSF and compositions comprising the same for use in the treatment of pain, e.g. pain experienced in inflammatory disorders such as rheumatoid arthritis, according to specific dosage regimen.

Abstract: A distribution system is disclosed for use in an induction system with an object processing system. The distribution system provides distribution of dissimilar objects into one of a plurality of receiving units. The distribution system includes an urging system for urging an object on a conveyor from the conveyor to one of a plurality of adjacent receiving stations via a receiving chute, wherein each receiving station is lower than the conveyor.

Abstract: In accordance with an embodiment, the invention provides an end effector for use with a programmable motion device. The end effector includes a pair of mutually opposing surfaces, at least one of the pair of mutually opposing surfaces being movable with respect to an end effector support structure for supporting the at least one of the pair of mutually opposing surfaces.

Abstract: A method of processing objects using a programmable motion device is disclosed. The method includes the steps of perceiving identifying indicia representative of an identity of a plurality of objects and directing the plurality of objects toward an input area from at least one input conveyance system, acquiring an object from the plurality of objects at the input area using an end effector of the programmable motion device, and moving the acquired object toward an identified processing location using the programmable motion device, said identified processing location being associated with the identifying indicia and said identified processing location being provided as one of a plurality of processing locations that are radially spaced from the programmable motion device.

Abstract: A processing system is disclosed for processing objects. The processing system includes a perception system for providing perception data regarding an object, and a primary transport system for providing transport of the object along a primary direction toward a processing location that is identified based on the perception data.

Abstract: Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. For example, in some embodiments, a microelectronic assembly may include a substrate having a first surface including a cavity and an opposing second surface; a die above the cavity and electrically coupled to the second surface of the substrate; a circuit board attached to the substrate; and a cooling apparatus at least partially nested in the cavity, wherein the cooling apparatus is in thermal contact with the die. In some embodiments, a microelectronic assembly may include a circuit board having a surface including a cavity; a substrate having a first surface attached to the circuit board and a die electrically coupled to an opposing second surface; and a cooling apparatus at least partially nested in the cavity, wherein the cooling apparatus is in thermal contact with the die.

Abstract: Embodiments herein relate to systems, apparatuses, techniques or processes related to packages that are fully or partially encapsulated in a mold material, with one or more grooves in the mold material to reduce failure in the package during operation. In embodiments, the grooves will allow greater flexibility within the body of the package as it experiences thermo-mechanical stress during operation and will reduce stresses that may be placed on internal components such as chips or bridges in the package, as well as stresses that may be placed on interconnects of the package that are coupled to a substrate. Other embodiments may be described and/or claimed.

Abstract: Disclosed herein are microelectronics packages that include thermal pillars for at least localized extraction of generated heat and methods for manufacturing the same. The microelectronics packages may include a substrate and a plurality of dies stacked on the substrate with at least one of the plurality of dies connected to the substrate. A heat spreader may be located proximate at least a portion of the plurality of dies. Respective thermal pillars from a plurality of thermal pillars may extend from at least one of the plurality dies to the heat spreader. Each of the plurality of thermal pillars may define a respective pathway from at least one of the plurality of dies to the heat spreader.

Abstract: Disclosed herein are microelectronic packages having thermally conductive layers and methods for manufacturing the same. The microelectronics packages may include a substrate and a plurality of dies connected to the substrate and/or each other to form a die stack. The dies may have a perimeter. A thermally conductive layer may be located in between the respective dies. The thermally conductive layers may extend past at least a portion of the perimeters, thereby providing enhanced cooling of the die stack.

Abstract: Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a substrate; a lid surrounding an individual die, wherein the lid includes a planar portion and two or more sides extending from the planar portion, and wherein the individual die is electrically coupled to the substrate by interconnects; and a material surrounding the interconnects and coupling the two or more sides of the lid to the substrate.

Abstract: Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. For example, in some embodiments, a microelectronic assembly may include a substrate having a surface including a first cavity; a first die at least partially nested in the first cavity and electrically coupled to the substrate; and a circuit board having a surface including a second cavity, wherein the surface of the substrate is electrically coupled to the surface of the circuit board, and wherein the first die extends at least partially into the second cavity in the circuit board.

Abstract: A semiconductor package includes a first semiconductor die, a semiconductor device comprising a second semiconductor die, and one or more wire bond structures. The wire bond structure includes a bond interface portion. The wire bond structure is arranged next to the first semiconductor die. The first semiconductor die and the bond interface portion of the wire bond structure are arranged at the same side of the semiconductor device. An interface contact structure of the semiconductor device is electrically connected to the wire bond structure.

Abstract: An order fulfillment system is disclosed in which objects to be collected into orders are provided in output totes. The system includes a primary sortation system that includes a loop conveyance system that moves objects around a closed loop that includes a plurality of primary sortation exits, each of which leads to a location inside the closed loop, and a secondary sortation system that includes a plurality of secondary conveyances, each of which receives an object at one of the plurality of primary sortation exits, and conveys the object to one of a plurality of totes, the plurality of totes being within the closed loop of the primary sortation system.

Abstract: A programmable motion robotic system is disclosed that includes a plurality of arm sections that are joined one to another at a plurality of joints to form an articulated arm, and a hose coupling an end effector of the programmable motion robotic system to a vacuum source. The hose is attached to at least one arm section of the articulated arm by a pass-through coupling that permits the hose to pass freely through the coupling as the plurality of arm sections are moved about the plurality of joints.

Abstract: A microelectronic assembly is provided, comprising: an interposer having a first side and a second side opposite to the first side; a plurality of integrated circuit (IC) dies in a plurality of layers on the first side of the interposer, the plurality of IC dies being encased by a dielectric material; a package substrate on the second side of the interposer; a plurality of conductive vias through the plurality of layers; and redistribution layers adjacent to the layers in the plurality of layers, at least some of the redistribution layers comprising conductive traces coupling the conductive vias to the IC dies.

Abstract: A distribution system is disclosed for use with an induction system with an object processing system. The distribution system provides distribution of dissimilar objects into one of a plurality of receiving units. The distribution system includes an urging system for urging an object on a conveyor from the conveyor to a chute that includes at least one actuatable door for selectively dropping the object through the at least one actuable door, said chute leading to a first receiving station with a second receiving station being positioned below the at least one actuable door.

Abstract: Embodiments of a microelectronic assembly comprise a package substrate, including: a first layer comprising a first plurality of mutually parallel channels of a first material; a second layer comprising columns of the first material; and a third layer comprising a second plurality of mutually parallel channels of the first material. The second layer is between the first layer and the third layer, at least some columns extend between and contact the first plurality of mutually parallel channels and the second plurality of mutually parallel channels, and at least a portion of the first layer, the second layer, and the third layer comprises a second material different from the first material.

Abstract: Embodiments of a microelectronic assembly include a package substrate comprising: a first layer comprising a first plurality of mutually parallel channels of a first material; a second layer comprising columns of the first material; and a third layer comprising a second plurality of mutually parallel channels of the first material, the second plurality of mutually parallel channels being orthogonal to the first plurality of mutually parallel channels. The second layer is between the first layer and the third layer, at least some columns extend between and contact the first plurality of mutually parallel channels and the second plurality of mutually parallel channels, and at least a portion of the first layer, the second layer and the third layer comprises a second material different from the first material.

Abstract: An induction system is disclosed for filtering the induction of objects to a plurality of object processing systems. The induction system includes an evaluation means for evaluating at least one characteristic of an object, and routing means for routing the object in one of a plurality of directions responsive to the evaluated characteristic, at least one of the plurality of directions leading to a selected one of the plurality of object processing systems.