Abstract: A box handling system is disclosed for use in an object processing system. The box handling system includes a box tray including a recessed area for receiving a box, and the recessed area includes a plurality of floor and edge portions for receiving the box that contains objects to be processed.

Abstract: In accordance with an embodiment, the invention provides an end effector for use with a programmable motion device. The end effector includes a pair of mutually opposing surfaces, at least one of the pair of mutually opposing surfaces being movable with respect to an end effector support structure for supporting the at least one of the pair of mutually opposing surfaces.

Abstract: A processing system is disclosed for providing processing of objects that includes a programmable motion device including an end effector, a perception system for recognizing any of the identity, location, and orientation of an object presented in a plurality of objects at an input location, a grasp acquisition system for acquiring the object using the end effector to permit the object to be moved from the plurality of objects to one of a plurality of destination bins, and a motion planning system for determining a changing portion of a trajectory path of the end effector from the object to a base location proximate to the input location, and determining an unchanging portion of a trajectory path of the end effector from the base location to a destination bin location proximate to a destination bin.

Abstract: A maintenance system is disclosed for assisting in maintaining an automated carrier system for moving objects to be processed. The maintenance system includes a plurality of automated carriers that are adapted to move on an array of discontinuous standard track sections, each said automated carrier including a carrier body that is no larger in either a length or width direction that a standard track section, and an automated maintenance carrier that is adapted to move on the array of discontinuous track sections, said automated maintenance system including a maintenance body that is larger in at least one of a length or width direction than the standard track section.

Abstract: An end effector is disclosed for an articulated arm. The end effector includes a valve assembly including a plurality of supply channels, each supply channel including a supply conduit, a pressure sensor in fluid communication with the supply conduit, and a supply conduit plug. The supply conduit is in fluid communication with a vacuum source. During use, each supply conduit is either at vacuum such that the pressure within the supply conduit is substantially at a vacuum pressure, or is at a pressure that is substantially higher than vacuum pressure because the supply conduit plug has moved to block a portion of the supply conduit. The pressure sensor of each supply conduit provides a pressure sensor signal responsive to whether the pressure in the conduit is either substantially at vacuum or is at a pressure that is substantially higher than vacuum.

Abstract: An object processing system is disclosed that includes a plurality of track sections, and a plurality of remotely actuatable carriers for controlled movement along at least portions of the plurality of track sections, wherein each of the remotely controllable carriers is adapted to support and transport an object processing bin.

Abstract: A method of processing objects using a programmable motion device is disclosed. The method includes the steps of perceiving identifying indicia representative of an identity of a plurality of objects and directing the plurality of objects toward an input area from at least one input conveyance system, acquiring an object from the plurality of objects at the input area using an end effector of the programmable motion device, and moving the acquired object toward an identified processing location using the programmable motion device, said identified processing location being associated with the identifying indicia and said identified processing location being provided as one of a plurality of processing locations that are radially spaced from the programmable motion device.

Abstract: In accordance with disclosed embodiments, there is a method of integrating and accessing passive components in three-dimensional fan-out wafer-level packages. One example is a microelectronic die package that includes a die, a package substrate attached to the die on one side of the die and configured to be connected to a system board, a plurality of passive devices over a second side of the die, and a plurality of passive device contacts over a respective passive die, the contacts being configured to be coupled to a second die mounted over the passive devices and over the second side of the die.

Abstract: An arrangement for an overvoltage protection of a subsea electrical apparatus and a method for operating it. The arrangement includes a tank submersible below a water surface level, an electrical apparatus accommodated in the tank, and a surge arrester arrangement accommodated in the tank and coupled to a power supply of the electrical apparatus in the tank for providing the overvoltage protection of the electrical apparatus. The arrangement further includes a controllable grounding switch for connecting the surge arrester arrangement to a ground point in response to a control of the grounding switch to a closed state and for disconnecting the surge arrester arrangement from the ground point in response to a control of the grounding switch to an open state.

Abstract: A processing system for processing objects using a programmable motion device is disclosed. The processing system a perception unit for perceiving identifying indicia representative of an identity of an object associated with an input conveyance system, and an acquisition system for acquiring the object from a plurality of objects at an input area using an end effector of the programmable motion device, wherein the programmable motion device is adapted for assisting in the delivery of the object to an identified processing location. The identified processing location being associated with the identifying indicia and said identified processing location being provided as one of a plurality of processing locations. The processing system also includes a delivery system for receiving the object in a carrier and for delivering the object toward the identified processing location.

Abstract: A programmable motion robotic system is disclosed that includes a plurality of arm sections that are joined one to another at a plurality of joints to form an articulated arm, and a hose coupling an end effector of the programmable motion robotic system to a vacuum source. The hose is attached to at least one arm section of the articulated arm by a pass-through coupling that permits the hose to pass freely through the coupling as the plurality of arm sections are moved about the plurality of joints.

Abstract: IC devices including BPRs with integrated decoupling capacitance are disclosed. An example IC device includes a first layer comprising a transistor and a support structure adjoining the first layer. The support structure includes BPRs, which are power rails buried in the support structure, and a decoupling capacitor based on the BPRs. The conductive cores of the BPRs are the electrodes of the decoupling capacitor. The dielectric barriers of the BPRs can be the dielectric of the decupling capacitor. The dielectric of the decupling capacitor may also include a dielectric element between the BPRs. Additionally or alternatively, the IC device includes another decoupling capacitor at the backside of the support structure. The other decoupling capacitor is coupled to the BPRs and can provide additional decoupling capacitance for stabilizing power supply facilitated by the BPRs.

Abstract: IC devices including transformers that includes two electrically conductive layers are disclosed. An example IC device includes a transformer that includes a first coil, a second coil, and a magnetic core coupled to the two coils. The first coil includes a portion or the whole electrically conductive layers at the backside of a support structure. The second coil includes a portion or the whole electrically conductive layers at either the frontside or the backside of the support structure. The two coils may have a lateral coupling, vertical coupling, or other types of couplings. The transformer is coupled to a semiconductor device over or at least partially in the support structure. The semiconductor device may be at the frontside of the support structure. The transformer can be coupled to the semiconductor device by TSVs. The IC device may also include BPRs that facilitate backside power delivery to the semiconductor device.

Abstract: A semiconductor die is provided. The semiconductor die includes a plurality of transistors arranged at a front side of a semiconductor substrate and an electrically conductive structure and a trench extending from a backside of the semiconductor substrate into the semiconductor substrate. A length of the trench is equal or larger than a lateral dimension of the semiconductor substrate.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a plurality of transistors arranged at a front side of a semiconductor substrate and a test structure located at the front side of the semiconductor substrate. Further, the semiconductor structure comprises a first electrically conductive connection extending from the test structure through the semiconductor substrate to a backside test pad arranged at a backside of the semiconductor substrate.

Abstract: A distribution system is disclosed for use in an induction system with an object processing system. The distribution system provides distribution of dissimilar objects into one of a plurality of receiving units. The distribution system includes an urging system for urging an object on a conveyor from the conveyor to one of a plurality of adjacent receiving stations via a receiving chute, wherein each receiving station is lower than the conveyor.

Abstract: Signal routing using structures based on buried power rails (BPRs) is described. An example IC device includes a support structure, a plurality of IC components provided over the support structure, and first and second electrically conductive structures having respective portions that are buried in the support structure, such structures referred to as “buried signal rails” (BSRs). The first BSR may be electrically coupled to a terminal of one of the plurality of IC components, the second BSR may be electrically coupled to a terminal of another one of the plurality of IC components, and the IC device may further include a bridge interconnect embedded within the support structure, the bridge interconnect having a first end in contact with the first BSR and a second end in contact with the second BSR. Implementing BSRs in IC devices may allow significantly increasing standard cell library density and provide geometry-free signal routing.

Abstract: An object processing system is disclosed that includes a plurality of track sections, and a plurality of remotely actuatable carriers for controlled movement along at least portions of the plurality of track sections, wherein each of the remotely controllable carriers is adapted to support and transport an object processing bin.

Abstract: A box handling system is disclosed for use in an object processing system. The box handling system includes a box tray including a recessed area for receiving a box, and the recessed area includes a plurality of floor and edge portions for receiving the box that contains objects to be processed.

Abstract: A maintenance system is disclosed for assisting in maintaining an automated carrier system for moving objects to be processed. The maintenance system includes a plurality of automated carriers that are adapted to move on an array of discontinuous standard track sections, each said automated carrier including a carrier body that is no larger in either a length or width direction that a standard track section, and an automated maintenance carrier that is adapted to move on the array of discontinuous track sections, said automated maintenance system including a maintenance body that is larger in at least one of a length or width direction than the standard track section.