Patents by Inventor Ti Wang

Ti Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250100161
    Abstract: A method includes receiving a carrier, the carrier including a carrier body, a first filter, and a housing securing the first filter to the carrier body. The method further includes uninstalling the housing from the carrier, replacing the first filter with a second filter, reinstalling the housing on the carrier body, and inspecting the second filter. Inspecting the second filter includes using an automatic inspection mechanism to detect surface flatness of the second filter.
    Type: Application
    Filed: December 9, 2024
    Publication date: March 27, 2025
    Inventors: Jen-Ti WANG, Yi-Ming CHEN, Chih-Wei LIN, Cheng-Ho HUNG, Fu-Hsien LI
  • Patent number: 12162134
    Abstract: A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: December 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jen-Ti Wang, Chih-Wei Lin, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung
  • Publication number: 20240355659
    Abstract: A method includes moving a wafer transport device on a transport rail, wherein the wafer transport device comprises a hoist unit configured to grip a wafer container unit; stopping the wafer transport device above a load port; after stopping the wafer transport device, reading data of a rail mark located on the transport rail; aligning an orientation of the wafer transport device according to the data of the rail mark; after aligning the orientation of the wafer transport device according to the data of the rail mark, aligning the wafer transport device with respect to a top surface of the load port; after aligning the wafer transport device with respect to the top surface of the load port, lowering the hoist unit.
    Type: Application
    Filed: June 28, 2024
    Publication date: October 24, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih CHEN, Shi-Chi CHEN, Ting-Wei WANG, Jen-Ti WANG, Kuo-Fong CHUANG
  • Patent number: 12062561
    Abstract: A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: August 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih Chen, Shi-Chi Chen, Ting-Wei Wang, Jen-Ti Wang, Kuo-Fong Chuang
  • Patent number: 12050153
    Abstract: A method for monitoring a transport vehicle is provided. The method includes the operations as follows. A transport vehicle is scanned by a monitor during the transport vehicle is operated on a rail to acquire a vehicle pattern of the transport vehicle. The vehicle pattern of the transport vehicle is analyzed. An abnormal transport vehicle is determined based on the vehicle pattern. The monitor is placed nearby the rail. A method for transport vehicle maintenance is also provided.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: July 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun-Jung Huang, Kuang Huan Hsu, Jen-Ti Wang, Po-Feng Tsai, An-Sheng Chung
  • Publication number: 20240190034
    Abstract: An adjustable flip stop has a body, a fixing component, and a flip arm. The fixing component has a bolt and a nut. The bolt is mounted through a fixing hole of the body and has a bolt head contained in an interior of a T-track, and the nut is threaded with the bolt to locate the body between the bolt head and the nut. The flip arm has a connecting element, an arm body, and an adjusting element. The connecting element is pivotally connected to the body, and the arm body has a longitudinal direction. The adjusting element is combined with the connecting element and is capable of being combined at different positions of the arm body in the longitudinal direction to make the arm body and the connecting element fixed with respect to each other. The adjustable flip stop is applicable with fences of different heights.
    Type: Application
    Filed: December 12, 2022
    Publication date: June 13, 2024
    Inventors: Hui-Chuan LIAO, Chun-Ti Wang
  • Patent number: 11998073
    Abstract: A non-woven protective clothing against blood and viruses is composed from a non-woven fabric layer, which has two surfaces; and a moisture-permeable layer, which is a porous film that is laminated to one of the surfaces of the non-woven fabric layer; and an elastic pore filling layer, which is a hydrophilic polyurethane. The elastic pore filling layer is coated or printed onto the surface of the moisture-permeable layer, and the thickness of the elastic pore filling layer is thinner than that of the moisture-permeable layer. The synthetic blood permeability of the non-woven protective clothing against blood and viruses can resist a pressure of 2.0 psi for one minute, and the Phi-X174 bacteriophage penetrability thereof can resist a pressure of 2.0 psi for one minute.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: June 4, 2024
    Assignee: WEB-PRO CORPORATION
    Inventors: Fu-Chun Lin, Ping-Sen Liao, Ya-Tong Cai, Tsung-Chia Wang, Chiu-Ti Wang
  • Patent number: 11854844
    Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Yuan Chu, Jen-Ti Wang, Wei-Chih Chen, Kuo-Fong Chuang, Cheng-Ho Hung
  • Publication number: 20230411193
    Abstract: When there is an interruption in power to an area of an integrated circuit manufacturing facility, product may be stranded in a vehicle mounted to an automated material handling system. An automated rescue vehicle can be deployed to retrieve the stranded vehicle so that a payload carried by that vehicle can be recovered and processing can resume. The rescue vehicle can carry a battery payload. The battery payload provides backup power while the rescue operation is performed. With such an automated system, no human intervention is needed to recover product during a power outage. In addition to improving wafer throughput during the power outage, such a rescue operation may prevent quality degradation for time-critical sequences of processing operations.
    Type: Application
    Filed: June 17, 2022
    Publication date: December 21, 2023
    Inventors: Chun-Jung HUANG, Y.Y. LEE, Kuang Huan HSU, Li-Hsin CHU, Jen-Ti WANG, Chieh HSU
  • Patent number: 11848221
    Abstract: A method includes disposing, by using a transport module of a workpiece storage system, a first workpiece on a first workpiece carrier; disposing, by using the transport module, the first workpiece carrier with the first workpiece in a workpiece container; disposing, by using the transport module, a second workpiece in the workpiece container, wherein the first workpiece and the second workpiece have different sizes; and transferring, by using the transport module, the workpiece container containing the second workpiece and the first workpiece carrier with the first workpiece to a stocker to store the workpiece container.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: December 19, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tzu-Chi Chiu, Jen-Ti Wang, Ting-Wei Wang, Kuo-Fong Chuang
  • Patent number: 11766460
    Abstract: Disclosed herein is a use of an amniotic fluid stem cell spheroid in the preparation of a composition or pharmaceutical composition for treating urinary incontinence, wherein said pharmaceutical composition may further comprise hyaluronic acid.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: September 26, 2023
    Assignee: U-NEURON BIOMEDICAL INC.
    Inventors: Shiaw-Min Hwang, Shing-Hwa Lu, Kuei-Chang Li, Wei-Ti Wang
  • Publication number: 20230191619
    Abstract: A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.
    Type: Application
    Filed: February 17, 2023
    Publication date: June 22, 2023
    Inventors: Jen-Ti Wang, Chih-Wei Lin, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung
  • Patent number: 11605553
    Abstract: An automated method of unpacking a container containing semiconductor wafers from a sealed bag is provided. The method includes inflating the bag with a gas using an automated gas dispenser. After inflating the bag, the bag is cut using an automated cutting device to expose the container, and the cut bag is removed from around the container.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: March 14, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Fu-Hsien Li, Chi-Feng Tung, Chi Yuan Chu, Jen-Ti Wang, Hsiang Yin Shen
  • Patent number: 11584019
    Abstract: An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: February 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jen-Ti Wang, Chih-Wei Lin, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung
  • Publication number: 20230041219
    Abstract: A non-woven protective clothing against blood and viruses, which is composed from: a non-woven fabric layer, which has two surfaces; and a high waterproof moisture-permeable layer, which is a porous film that is laminated to one of the surfaces of the non-woven fabric layer; and an elastic pore filling layer, which is a hydrophilic polyurethane. The elastic pore filling layer is coated or printed onto the surface of the high waterproof moisture-permeable layer, and the thickness of the elastic pore filling layer is thinner than that of the high waterproof moisture-permeable layer. The synthetic blood permeability of the non-woven protective clothing against blood and viruses can resist a pressure of 2.0 psi for one minute, and the Phi-X174 bacteriophage penetrability thereof can resist a pressure of 2.0 psi for one minute.
    Type: Application
    Filed: September 15, 2021
    Publication date: February 9, 2023
    Inventors: Fu-Chun LIN, Ping-Sen LIAO, Ya-Tong CAI, Tsung-Chia WANG, Chiu-Ti WANG
  • Publication number: 20220359252
    Abstract: A method includes disposing, by using a transport module of a workpiece storage system, a first workpiece on a first workpiece carrier; disposing, by using the transport module, the first workpiece carrier with the first workpiece in a workpiece container; disposing, by using the transport module, a second workpiece in the workpiece container, wherein the first workpiece and the second workpiece have different sizes; and transferring, by using the transport module, the workpiece container containing the second workpiece and the first workpiece carrier with the first workpiece to a stocker to store the workpiece container.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tzu-Chi CHIU, Jen-Ti WANG, Ting-Wei WANG, Kuo-Fong CHUANG
  • Patent number: 11488870
    Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region, a second region, and a third region; forming a first gate structure on the first region, a second gate structure on the second region, and a third gate structure on the third region; forming an interlayer dielectric (ILD) layer around the first gate structure, the second gate structure, and the third gate structure; removing the first gate structure, the second gate structure, and the third gate structure to form a first recess, a second recess, and a third recess; forming a first interfacial layer in the first recess, the second recess, and the third recess; removing the first interfacial layer in the second recess; and forming a second interfacial layer in the second recess.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: November 1, 2022
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Tien-Yu Hsieh, Kuan-Ti Wang, Han-Chen Chen, Kun-Hsien Lee
  • Publication number: 20220328330
    Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.
    Type: Application
    Filed: June 16, 2022
    Publication date: October 13, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Yuan CHU, Jen-Ti WANG, Wei-Chih CHEN, Kuo-Fong CHUANG, Cheng-Ho HUNG
  • Patent number: 11447992
    Abstract: A pivot device with an interlocking lifting mechanism includes a first interlocking member to which first and second shafts and a second interlocking member are pivotably connected. A torque device is mounted around the first and second shafts. A third interlocking member is pivotably connected to the second interlocking member and includes a sliding groove. A fixing seat includes a pivotal member extending through the sliding groove. The second interlocking member is slidably received in a guiding groove of the guiding seat. When the first shaft pivots through a certain angle, the first interlocking member pivots about the second shaft and actuates the second interlocking member. The third interlocking member pivots relative to the fixing seat. The sliding groove slides relative to the pivotal member. The second distal end synchronously slides relative to the first guiding groove to lift an auxiliary screen unit connected to the third proximal end.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: September 20, 2022
    Assignee: Leohab Enterprise Co., Ltd.
    Inventors: Chun Ti Wang, Fu Chun Chung, Yu Ting Ting
  • Publication number: 20220285190
    Abstract: A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.
    Type: Application
    Filed: May 19, 2022
    Publication date: September 8, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Chih CHEN, Shi-Chi CHEN, Ting-Wei WANG, Jen-Ti WANG, Kuo-Fong CHUANG