Patents by Inventor Tianhong Zhang
Tianhong Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240106016Abstract: A battery cell, a battery module, a battery pack, an energy storage system, and an electric vehicle. The battery cell includes one or more stress sensors. The stress sensors are located on the explosion-proof valve and face outside a housing of the battery cell, or the stress sensors are located on the explosion-proof valve and face inside a housing of the battery cell. Each stress sensor is configured to detect stress that is inside the battery cell and that acts on a corresponding position on the explosion-proof valve, and the one or more stress sensors are configured to transmit all obtained electrical signals to processor. The processor determines a faulty target battery cell based on one or more received electrical signals.Type: ApplicationFiled: September 12, 2023Publication date: March 28, 2024Applicant: Huawei Digital Power Technologies Co., Ltd.Inventors: Haonan LE, Jing ZHU, Bao ZHANG, Tianhong HOU, Junliang LU
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Publication number: 20230361933Abstract: Embodiments of this application disclose a resource conflict processing method and an apparatus. The method includes: determining that a first resource of at least one piece of to-be-sent first information and a second resource of at least one piece of to-be-received second information overlap in time domain; and sending the first information on the first resource or receiving the second information on the second resource according to a first rule, where the first rule includes one of the following: determining, based on priorities of HARQs, whether to send the first information on the first resource or receive the second information on the second resource; or determining, based on priorities of HARQs and priorities of resource conflict indication information, whether to send the first information on the first resource or receive the second information on the second resource.Type: ApplicationFiled: July 14, 2023Publication date: November 9, 2023Inventors: Haining Huang, Chao Li, Tianhong Zhang
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Publication number: 20230362973Abstract: In a communication method, a third terminal device detects first SCI from a first terminal device and second SCI from a second terminal device, where one or more resources indicated by the first SCI overlap with one or more resources indicated by the second SCI. The third terminal device sends assistance information to the first terminal device when a specific condition is met, where the assistance information is used to assist the first terminal device in resource selection.Type: ApplicationFiled: July 14, 2023Publication date: November 9, 2023Inventors: Haining Huang, Chao Li, Tianhong Zhang
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Publication number: 20230362917Abstract: This application has disclosed a method for sending and transmission of a resource conflict indication and a communication apparatus. When determining that a reserved resource indicated by first SCI conflicts with a reserved resource indicated by second SCI, a first terminal device sends an RCI to a second terminal device at a determined time domain and/or frequency domain position before a conflict position; or when determining that a resource corresponding to first SCI conflicts with a resource corresponding to second SCI, a first terminal device sends an RCI to a second terminal device at a determined time domain and/or frequency domain position after a conflict position. The RCI is sent at the determined time domain and/or frequency domain position.Type: ApplicationFiled: July 14, 2023Publication date: November 9, 2023Inventors: Tianhong Zhang, Chao Li, Haining Huang, Fan Yang, Xiang Mi
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Publication number: 20230344610Abstract: An indication information sending method includes receiving, by a second terminal apparatus, first information, and determining, based on the first information, whether the second terminal apparatus is capable of providing auxiliary resource information for a first terminal apparatus. The auxiliary resource information is for determining a sending resource of the first terminal apparatus.Type: ApplicationFiled: June 29, 2023Publication date: October 26, 2023Inventors: Fan YANG, Chao LI, Tianhong ZHANG
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Publication number: 20230180192Abstract: Embodiments of this application provide a communication method and apparatus, and a readable storage medium. The method includes: A first device sends information about a first priority and a second priority to a second device. The first priority is used to assist the second device in selecting a resource for sidelink transmission, the information about the first priority is carried in SCI and/or a MAC CE, and the second priority is a physical layer priority of the first device. In the method, the first device sends the information about the first priority and the second priority to the second device. The information about the first priority is used to assist the second device in selecting the resource for sidelink transmission. Therefore, the second device may further select, based on the information about the first priority, the resource for sidelink transmission, to implement resource selection of the second device.Type: ApplicationFiled: February 3, 2023Publication date: June 8, 2023Inventors: Tianhong ZHANG, Haining HUANG, Chao LI, Lili ZHANG, Fan YANG
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Patent number: 9125969Abstract: Comblike, surfactant polymers for changing the surface properties of biomaterials are provided. Such surfactant polymers comprise a polymeric backbone of repeating monomeric units having functional groups for coupling with side chains, a plurality of hydrophobic side chains linked to the backbone via the functional groups, and a plurality of hydrophilic side chains linked to said backbone via the functional groups. Medical devices coated with the surfactant polymers are also provided. The surfactant polymers may be used to decrease the thrombogenic properties, encapsulation, and bacterial colonization of medical devices.Type: GrantFiled: March 16, 2012Date of Patent: September 8, 2015Assignee: NANOMIMETICS, INC.Inventors: Jan J. Lewandowski, Yubiao Liu, Roger Marchant, Tianhong Zhang, Yongxing Qiu, Mark A. Ruegsegger
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Patent number: 8963331Abstract: Some embodiments include semiconductor processing methods in which a copper barrier is formed to be laterally offset from a copper component, and in which nickel is formed to extend across both the barrier and the component. The barrier may extend around an entire lateral periphery of the component, and may be spaced from the component by an intervening ring of electrically insulative material. The copper component may be a bond pad or an interconnect between two levels of metal layers. Some embodiments include semiconductor constructions in which nickel extends across a copper component, a copper barrier is laterally offset from the copper component, and an insulative material is between the copper barrier and the copper component.Type: GrantFiled: April 30, 2014Date of Patent: February 24, 2015Assignee: Micron Technology, Inc.Inventors: Tianhong Zhang, Akram Ditali
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Publication number: 20140232003Abstract: Some embodiments include semiconductor processing methods in which a copper barrier is formed to be laterally offset from a copper component, and in which nickel is formed to extend across both the barrier and the component. The barrier may extend around an entire lateral periphery of the component, and may be spaced from the component by an intervening ring of electrically insulative material. The copper component may be a bond pad or an interconnect between two levels of metal layers. Some embodiments include semiconductor constructions in which nickel extends across a copper component, a copper barrier is laterally offset from the copper component, and an insulative material is between the copper barrier and the copper component.Type: ApplicationFiled: April 30, 2014Publication date: August 21, 2014Applicant: Micron Technology, Inc.Inventors: Tianhong Zhang, Akram Ditali
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Patent number: 8749066Abstract: Some embodiments include semiconductor processing methods in which a copper barrier is formed to be laterally offset from a copper component, and in which nickel is formed to extend across both the barrier and the component. The barrier may extend around an entire lateral periphery of the component, and may be spaced from the component by an intervening ring of electrically insulative material. The copper component may be a bond pad or an interconnect between two levels of metal layers. Some embodiments include semiconductor constructions in which nickel extends across a copper component, a copper barrier is laterally offset from the copper component, and an insulative material is between the copper barrier and the copper component.Type: GrantFiled: September 13, 2012Date of Patent: June 10, 2014Assignee: Micron Technology, Inc.Inventors: Tianhong Zhang, Akram Ditali
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Publication number: 20130001788Abstract: Some embodiments include semiconductor processing methods in which a copper barrier is formed to be laterally offset from a copper component, and in which nickel is formed to extend across both the barrier and the component. The barrier may extend around an entire lateral periphery of the component, and may be spaced from the component by an intervening ring of electrically insulative material. The copper component may be a bond pad or an interconnect between two levels of metal layers. Some embodiments include semiconductor constructions in which nickel extends across a copper component, a copper barrier is laterally offset from the copper component, and an insulative material is between the copper barrier and the copper component.Type: ApplicationFiled: September 13, 2012Publication date: January 3, 2013Applicant: MICRON TECHNOLOGY, INC.Inventors: Tianhong Zhang, Akram Ditali
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Patent number: 8288867Abstract: Some embodiments include semiconductor processing methods in which a copper barrier is formed to be laterally offset from a copper component, and in which nickel is formed to extend across both the barrier and the component. The barrier may extend around an entire lateral periphery of the component, and may be spaced from the component by an intervening ring of electrically insulative material. The copper component may be a bond pad or an interconnect between two levels of metal layers. Some embodiments include semiconductor constructions in which nickel extends across a copper component, a copper barrier is laterally offset from the copper component, and an insulative material is between the copper barrier and the copper component.Type: GrantFiled: May 21, 2010Date of Patent: October 16, 2012Assignee: Micron Technology, Inc.Inventors: Tianhong Zhang, Akram Ditall
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Patent number: 8163302Abstract: Comblike, surfactant polymers for changing the surface properties of biomaterials are provided. Such surfactant polymers comprise a polymeric backbone of repeating monomeric units having functional groups for coupling with side chains, a plurality of hydrophobic side chains linked to the backbone via the functional groups, and a plurality of hydrophilic side chains linked to said backbone via the functional groups. Medical devices coated with the surfactant polymers are also provided. The surfactant polymers may be used to decrease the thrombogenic properties, encapsulation, and bacterial colonization of medical devices.Type: GrantFiled: April 4, 2008Date of Patent: April 24, 2012Assignee: NanoMimetics, Inc.Inventors: Roger E. Marchant, Tianhong Zhang, Yongxing Qiu, Mark A. Ruegsegger
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Publication number: 20100230819Abstract: Some embodiments include semiconductor processing methods in which a copper barrier is formed to be laterally offset from a copper component, and in which nickel is formed to extend across both the barrier and the component. The barrier may extend around an entire lateral periphery of the component, and may be spaced from the component by an intervening ring of electrically insulative material. The copper component may be a bond pad or an interconnect between two levels of metal layers. Some embodiments include semiconductor constructions in which nickel extends across a copper component, a copper barrier is laterally offset from the copper component, and an insulative material is between the copper barrier and the copper component.Type: ApplicationFiled: May 21, 2010Publication date: September 16, 2010Applicant: MICRON TECHNOLOGY, INC.Inventors: Tianhong Zhang, Akram Ditali
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Patent number: 7749885Abstract: Some embodiments include semiconductor processing methods in which a copper barrier is formed to be laterally offset from a copper component, and in which nickel is formed to extend across both the barrier and the component. The barrier may extend around an entire lateral periphery of the component, and may be spaced from the component by an intervening ring of electrically insulative material. The copper component may be a bond pad or an interconnect between two levels of metal layers. Some embodiments include semiconductor constructions in which nickel extends across a copper component, a copper barrier is laterally offset from the copper component, and an insulative material is between the copper barrier and the copper component.Type: GrantFiled: December 15, 2006Date of Patent: July 6, 2010Assignee: Micron Technology, Inc.Inventors: Tianhong Zhang, Akram Ditali
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Patent number: 7504767Abstract: An electrode structure for a display device comprising a gate electrode proximate to an emitter and a focusing electrode separated from the gate electrode by an insulating layer containing a ridge are provided. When the focusing electrode is an aperture-type electrode, the ridge protrudes closer to the emitter than the sidewall of the gate electrode or the sidewall of the focusing electrode. When the focusing electrode is a concentric-type electrode, the ridge protrudes above the upper surface of the gate electrode or the upper surface of the focusing electrode. A method for making the aperture-type and concentric-type electrode structures is described. A display device containing such electrode structures is also described. By forming an insulating ridge between the gate and focusing electrodes, shorting between the two electrodes is reduced and yield enhancement increased.Type: GrantFiled: March 28, 2005Date of Patent: March 17, 2009Assignee: Micron Technology, Inc.Inventors: Benham Moradi, Zhong-Yi Xia, Tianhong Zhang
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Publication number: 20080247988Abstract: Comblike, surfactant polymers for changing the surface properties of biomaterials are provided. Such surfactant polymers comprise a polymeric backbone of repeating monomeric units having functional groups for coupling with side chains, a plurality of hydrophobic side chains linked to said backbone via the functional groups, and a plurality of hydrophilic side chains linked to said backbone via the functional groups. The hydrophobic side chains comprise an alkyl group comprising from 2 to 18 methylene groups. The alkyl groups are linked to the polymeric backbone through ester linkages, secondary amine linkages, or, preferably, amide linkages.Type: ApplicationFiled: May 21, 2007Publication date: October 9, 2008Inventors: Roger E. MARCHANT, Tianhong ZHANG, Yongxing QIU, Mark A. RUEGSEGGER
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Publication number: 20080142982Abstract: Some embodiments include semiconductor processing methods in which a copper barrier is formed to be laterally offset from a copper component, and in which nickel is formed to extend across both the barrier and the component. The barrier may extend around an entire lateral periphery of the component, and may be spaced from the component by an intervening ring of electrically insulative material. The copper component may be a bond pad or an interconnect between two levels of metal layers. Some embodiments include semiconductor constructions in which nickel extends across a copper component, a copper barrier is laterally offset from the copper component, and an insulative material is between the copper barrier and the copper component.Type: ApplicationFiled: December 15, 2006Publication date: June 19, 2008Inventors: Tianhong Zhang, Akram Ditali
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Patent number: 7276474Abstract: Comblike, surfactant polymers for changing the surface properties of biomaterials are provided. Such surfactant polymers comprise a polymeric backbone of repeating monomeric units having functional groups for coupling with side chains, a plurality of hydrophobic side chains linked to said backbone via the functional groups, and a plurality of hydrophilic side chains linked to said backbone via the functional groups. The hydrophobic side chains comprise an alkyl group comprising from 2 to 18 methylene groups. The alkyl groups are linked to the polymeric backbone through ester linkages, secondary amine linkages, or, preferably, amide linkages.Type: GrantFiled: April 13, 2004Date of Patent: October 2, 2007Assignee: Nanomimetics, Inc.Inventors: Roger E. Marchant, Tianhong Zhang, Yongxing Qiu, Mark A. Ruegsegger
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Patent number: RE40490Abstract: A method and apparatus for programmable field emission display comprising an array of cathodoluminescent elements. Each cathodoluminescent element in the array is responsive to separate select signals to cause light to be emitted from said display at a location in the array corresponding to each separate cathodoluminescent element. In one embodiment, to account for processing variation and the like, each cathodoluminescent element is provided with a programmable element for adjusting the operating level of the associated cathodoluminescent element in response to select signals of predetermined voltage levels. Each programmable element includes a charge storage device and is initially programmed by storing a level of electric charge thereon such that uniformity of operation among the plurality of cathodoluminescent elements in the array is improved. In one embodiment the programmable element comprises a floating gate transistor.Type: GrantFiled: November 12, 2003Date of Patent: September 9, 2008Assignee: Micron Technology, Inc.Inventors: Tianhong Zhang, Zhongyi Xia, John Lee, Benham Moradi