Patents by Inventor Tim Jones

Tim Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200188947
    Abstract: A dual-impeller spreader capable of independently a flowrate of particulate material about two halves of the spreader's coverage area. The spreader includes a frame, a hopper, and wheels rotatably connected to the frame via an axle. A first impeller is fixed to a first impeller shaft rotatably coupled to the axle via a first gear train, and a second impeller is fixed to a second impeller shaft rotatably coupled to the axle via a second gear train. A first shut-off control selectively opens and closes a first set of hopper exit openings located above the first impeller, while a second shut-off control selectively opens and closes a second set of hopper exit openings located above the second impeller. The first shut-off control and the second shut-off control selectively open and close the respective openings independent of each other.
    Type: Application
    Filed: October 10, 2019
    Publication date: June 18, 2020
    Inventors: Richard Sevrey, Justin B. Parizek, Casey Martin, John Marshall, Tim Jones
  • Patent number: 10493248
    Abstract: Embodiments hereof relate to methods of delivering a valve prosthesis to an annulus of a native valve of a heart, the native valve having chordae tendineae. A chordae management catheter is positioned within a ventricle of the heart, the chordae management catheter having a displacement component at a distal end thereof. The displacement component has an annular shape and defines a central lumen therethrough. The displacement component is radially expanded to push chordae tendineae within the ventricle radially outward. A valve delivery system is introduced into the ventricle of the heart via a ventricular wall of the heart. The valve delivery system has the valve prosthesis at a distal portion thereof. The valve delivery system is advanced through the central lumen of the radially expanded displacement component towards the annulus of the native valve of the heart. The valve prosthesis is deployed into apposition with the annulus of the native valve.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: December 3, 2019
    Assignee: MEDTRONIC VASCULAR, INC.
    Inventors: Paul Devereux, Paraic Frisby, Frank White, Tomas Kitt, Marc Anderson, Grainne Carroll, Ciaran McGuinness, Tim Jones
  • Patent number: 10460853
    Abstract: An electrical cable is provided with a rounded insulated electrical conductor that transitions to a flattened section to fit into areas where the rounded portion does not fit. A round electrical conductor transitions to a flattened section for electrical conduction routing via the undercarriage of a vehicle, for routing under the carpeting of the passenger compartment, or other confined spaces. The electrical cable may illustratively be used in an electric car application where distribution of electrical current from the battery compartment to the motor requires additional wiring in the vehicle not found in combustion based engines. The reduced vertical profile of the flattened section provides for additional clearance between the vehicle undercarriage and the road, or between the undercarriage frame and the interior passenger compartment carpet.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: October 29, 2019
    Assignee: Flex-Cable
    Inventors: Tim Jones, Robert W. Christie, Jan Christiansen, Erwin Kroulik
  • Patent number: 10368988
    Abstract: Embodiments hereof relate methods of delivering a valve prosthesis to an annulus of a native valve of a heart. A valve delivery system is introduced into a ventricle of the heart via a ventricular wall of the heart. The valve delivery system has a displacement component at the distal portion thereof. The valve prosthesis is in a delivery configuration and the displacement component is in a delivery state in which the displacement component has a first outer diameter. While the valve prosthesis is in the delivery configuration, the displacement component of the valve delivery system is radially expanded into an expanded state in which the displacement component has a second outer diameter greater than the first outer diameter. The valve delivery system is advanced towards the annulus of the native valve of the heart with the displacement component in the expanded state to displace chordae tendineae.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: August 6, 2019
    Assignee: MEDTRONIC VASCULAR, INC.
    Inventor: Tim Jones
  • Publication number: 20190107906
    Abstract: Managing metadata associated with a digital media asset includes selecting the digital media asset, displaying the digital media asset in a filmstrip format that presents one or more scenes from the digital media asset along a timeline, wherein each scene corresponds with an underlying point in time along the timeline, and wherein the digital media asset has a start time and an end time that define the timeline, displaying at least one track in timeline alignment with the film strip format wherein the at least one track corresponds with a type of metadata associated with the digital media asset, and displaying on the at least one track, one or more segments, wherein each segment has a start point and an end point along the timeline and wherein each respective segment represents a span of time in which the type of metadata occurs within the digital media asset.
    Type: Application
    Filed: October 9, 2018
    Publication date: April 11, 2019
    Inventors: Matthew G. Berry, Tim Jones, Isaac Kunkel
  • Patent number: 10095367
    Abstract: Managing metadata associated with a digital media asset includes selecting the digital media asset, displaying the digital media asset in a filmstrip format that presents one or more scenes from the digital media asset along a timeline, wherein each scene corresponds with an underlying point in time along the timeline, and wherein the digital media asset has a start time and an end time that define the timeline, displaying at least one track in timeline alignment with the film strip format wherein the at least one track corresponds with a type of metadata associated with the digital media asset, and displaying on the at least one track, one or more segments, wherein each segment has a start point and an end point along the timeline and wherein each respective segment represents a span of time in which the type of metadata occurs within the digital media asset.
    Type: Grant
    Filed: October 15, 2010
    Date of Patent: October 9, 2018
    Assignee: TIVO SOLUTIONS INC.
    Inventors: Matthew G. Berry, Tim Jones, Isaac Kunkel
  • Publication number: 20180125642
    Abstract: Embodiments hereof relate methods of delivering a valve prosthesis to an annulus of a native valve of a heart. A valve delivery system is introduced into a ventricle of the heart via a ventricular wall of the heart. The valve delivery system has a displacement component at the distal portion thereof. The valve prosthesis is in a delivery configuration and the displacement component is in a delivery state in which the displacement component has a first outer diameter. While the valve prosthesis is in the delivery configuration, the displacement component of the valve delivery system is radially expanded into an expanded state in which the displacement component has a second outer diameter greater than the first outer diameter. The valve delivery system is advanced towards the annulus of the native valve of the heart with the displacement component in the expanded state to displace chordae tendineae.
    Type: Application
    Filed: November 9, 2016
    Publication date: May 10, 2018
    Inventors: Frank White, Tim Jones, Marc Anderson, Paraic Frisby, Emma Keane, Brendan Vaughan
  • Publication number: 20180126127
    Abstract: Embodiments hereof relate to methods of delivering a valve prosthesis to an annulus of a native valve of a heart, the native valve having chordae tendineae. A chordae management catheter is positioned within a ventricle of the heart, the chordae management catheter having a displacement component at a distal end thereof. The displacement component has an annular shape and defines a central lumen therethrough. The displacement component is radially expanded to push chordae tendineae within the ventricle radially outward. A valve delivery system is introduced into the ventricle of the heart via a ventricular wall of the heart. The valve delivery system has the valve prosthesis at a distal portion thereof. The valve delivery system is advanced through the central lumen of the radially expanded displacement component towards the annulus of the native valve of the heart. The valve prosthesis is deployed into apposition with the annulus of the native valve.
    Type: Application
    Filed: November 9, 2016
    Publication date: May 10, 2018
    Inventors: Paul Devereux, Paraic Frisby, Frank White, Tomas Kitt, Marc Anderson, Grainne Carroll, Ciaran McGuinness, Tim Jones, Patrick Griffin
  • Patent number: 9379048
    Abstract: In one embodiment, a semiconductor package includes a first and a second die flag, wherein the first and second die flags are separated by a gap. First and second metal oxide semiconductor field effect transistor (MOSFET) die are on the first and the second die flags, respectively. A power control integrated circuit (IC) is stacked on top of at least one of the first or the second MOSFET die. A mold compound is encapsulating the power control IC, the first and second MOSFET die, and the first and second die flags.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: June 28, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Frank Tim Jones, Phillip Celaya
  • Publication number: 20140239472
    Abstract: In one embodiment, a semiconductor package includes a first and a second die flag, wherein the first and second die flags are separated by a gap. First and second metal oxide semiconductor field effect transistor (MOSFET) die are on the first and the second die flags, respectively. A power control integrated circuit (IC) is stacked on top of at least one of the first or the second MOSFET die. A mold compound is encapsulating the power control IC, the first and second MOSFET die, and the first and second die flags.
    Type: Application
    Filed: February 28, 2013
    Publication date: August 28, 2014
    Inventors: Frank Tim Jones, Phillip Celaya
  • Patent number: 8752622
    Abstract: To investigate the quality and nature of perforations in a downhole environment, a ‘pecking’ finger and depth measuring probe that can be axially and radially displaced enables the perforation to be located and its depth determined, through sequentially pecking around the wall lining. By swinging a pecking finger supporting a depth measuring probe tip and measuring the displacement of the finger, the edge and center of the hole can be determined with the largest displacement being when the tip is fully in the hole. The depth measuring probe is then deployed and the depth of the perforation established by an increase in the force required to push the probe and by the displacement of the pecking finger as it is pushed back by the reaction forces. Radially extendable clamps at the ends of the tool fix the tool with a surrounding bore.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: June 17, 2014
    Assignee: Advanced Perforating Technologies Limited
    Inventors: Eric Atherton, Tim Jones
  • Patent number: 8614298
    Abstract: Humanized anti-A? antibodies derived from a murine antibody directed to a N-terminal epitope of A? are described. The humanized antibodies have reduced or no human T cell epitopes and bind A? with an affinity similar to that of the murine antibody.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: December 24, 2013
    Assignee: Medtronic, Inc.
    Inventors: Lisa Lynn Shafer, Francis Joseph Carr, James Peter Gregson, Dawn Ann Bembridge, Tim Jones
  • Patent number: 8571685
    Abstract: A lead, method of manufacturing same, and system for stimulation is provided. The lead includes an insulative member or layer that masks a portion of the electrode(s) to effectively generate a directional lead that focuses or directs the stimulation to desired location(s). In another embodiment, the lead further includes a marking system to allow a clinician to orient the directional lead, as desired, while the lead is within a body.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: October 29, 2013
    Assignee: Advanced Neuromodulation Systems, Inc.
    Inventors: Terry Daglow, Brian Franz, John H. Erickson, Sandy Hooper, Tim Jones
  • Patent number: 8555969
    Abstract: Methods and apparatus that change the mobility of formation fluids using thermal and non-thermal stimulation including, an example apparatus to simultaneously provide thermal and non-thermal stimulation to change a mobility of a fluid in a subsurface formation includes one or more containers to hold one or more reactants. Additionally, the example apparatus includes a reactor to initiate a chemical reaction with at least one of the reactants. Further, the example apparatus includes an injector to inject a product of the chemical reaction into a formation. The product of the chemical reaction includes heat and a gaseous diluent to change a mobility of a fluid in a subsurface formation.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: October 15, 2013
    Assignee: Schlumberger Technology Corporation
    Inventors: Anthony Robert Holmes Goodwin, Tim Jones, Keith James Massie, John Nighswander, Gary Tustin
  • Patent number: 8384206
    Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: February 26, 2013
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Stephen St. Germain, Roger M. Arbuthnot, Frank Tim Jones
  • Publication number: 20130013039
    Abstract: A lead, method of manufacturing same, and system for stimulation is provided. The lead includes an insulative member or layer that masks a portion of the electrode(s) to effectively generate a directional lead that focuses or directs the stimulation to desired location(s). In another embodiment, the lead further includes a marking system to allow a clinician to orient the directional lead, as desired, while the lead is within a body.
    Type: Application
    Filed: July 16, 2012
    Publication date: January 10, 2013
    Inventors: Terry Daglow, Brian Franz, John H. Erickson, Sandy Hooper, Tim Jones
  • Patent number: 8224456
    Abstract: A lead, method of manufacturing same, and system for stimulation is provided. The lead includes an insulative member or layer that masks a portion of the electrode(s) to effectively generate a directional lead that focuses or directs the stimulation to desired location(s). In another embodiment, the lead further includes a marking system to allow a clinician to orient the directional lead, as desired, while the lead is within a body.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: July 17, 2012
    Assignee: Advanced Neuromodulation Systems, Inc.
    Inventors: Terry Daglow, Brian Franz, John H. Erickson, Sandy Hooper, Tim Jones
  • Publication number: 20110177076
    Abstract: Humanized anti-A? antibodies derived from a murine antibody directed to a N-terminal epitope of A? are described. The humanized antibodies have reduced or no human T cell epitopes and bind A? with an affinity similar to that of the murine antibody.
    Type: Application
    Filed: March 21, 2011
    Publication date: July 21, 2011
    Applicant: MEDTRONIC, INC.
    Inventors: Lisa Lynn Shafer, Francis Joseph Carr, James Peter Gregson, Dawn Ann Bembridge, Tim Jones
  • Publication number: 20110169152
    Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.
    Type: Application
    Filed: March 22, 2011
    Publication date: July 14, 2011
    Inventors: Stephen St. Germain, Roger M. Arbuthnot, Frank Tim Jones
  • Patent number: 7935575
    Abstract: In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.
    Type: Grant
    Filed: April 7, 2008
    Date of Patent: May 3, 2011
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Stephen St. Germain, Roger M. Arbuthnot, Frank Tim Jones