Abstract: An insect trap which includes a base having a rear surface and a front surface, a housing mounted to cover at least a portion of the front surface of the base, an insect attractant such as a light located at least partially within the housing, an insect neutralizer such as an adhesive surface located at least partially within the housing, and an electrical plug protruding from the rear surface of the base whereby the insect trap may be mounted to an electrical socket by inserting the electrical plug into the electrical socket. The insect trap can be easily mounted and removed, making it suitable for intermittent, seasonal, or temporary use.

Abstract: The invention relates to assembled particles of a plant virus containing a foreign peptide insert in the coat protein of the virus. The site of the insert is preferably free from direct sequence repeats flanking the insert. The invention relates to a method of production of the particles and their use, in particular in vaccines.

Abstract: The present invention relates to polypeptides to be administered especially to humans and in particular for therapeutic use. The polypeptides are modified polypeptides whereby the modification results in a reduced propensity for the polypeptide to elicit an immune response upon administration to the human subject. The invention in particular relates to the modification of human interferon beta to result in proteins that are substantially non-immunogenic or less immunogenic than any non-modified counterpart when used in vivo.

Abstract: A method and system for tracking data packets that utilizes a tree data structure with a recursive pruning algorithm that collapses the branches of the tree that represent contiguous ranges or regions to maintain a minimally optimum memory size. Each contiguous region is identified by a node, which includes the start and end range of packets. Each node further includes left and right pointer elements, which point to adjacent lower and higher nodes, respectively. When a packet sequence number is not contiguous with any other sequence numbers previously received, a new node is created that contains only a single value range. When a new packet is received that has a contiguous sequence number (i.e., immediately preceding or succeeding sequence number), the original node is updated so as to reflect the new contiguous range.

Abstract: An insect trap which includes a base having a rear surface and a front surface, a housing mounted to cover at least a portion of the front surface of the base, an insect attractant such as a light located at least partially within the housing, an insect neutralizer such as an adhesive surface located at least partially within the housing, and an electrical plug protruding from the rear surface of the base whereby the insect trap may be mounted to an electrical socket by inserting the electrical plug into the electrical socket. The insect trap can be easily mounted and removed, making it suitable for intermittent, seasonal, or temporary use.

Abstract: This invention relates to a novel approach for identification of T-cell epitopes, that give rise to an immune reaction in a living host. By means of this novel method biological compounds can be generated which have a no or at least a reduced immunogenicity when exposed to the immune system of a given species and compared with the relevant non-modified entity. Thus the invention relates also to novel biological molecules, especially proteins and antibodies, obtained by the method according to the invention.

Abstract: The present invention relates to antibodies which are directed to the EGF receptor (HER 1) to be administered especially to humans and in particular for therapeutic use in tumors. The antibodies are modified whereby the modification results in a reduced propensity for the antibody to elicit an immune response upon administration to the human subject. The invention in particular relates to the modification of anti-EGFR antibody 425 in its different forms and fragments thereof to result in Mab 425 variants that are substantially non-immunogenic or less immunogenic than any non-modified counterpart when used in vivo.

Abstract: The present invention relates to polypeptides to be administered especially to humans and in particular for therapeutic use. The polypeptides are modified polypeptides whereby the modification results in a reduced propensity for the polypeptide to elicit an immune response upon administration to the human subject. The invention in particular relates to the modification of interleukin-1 receptor antagonist (IL-1RA) to result in IL-1RA proteins that are substantially non-immunogenic or less immunogenic than any non-modified counterpart when used in vivo.

Abstract: The present invention relates to polypeptides to be administered especially to humans and in particular for therapeutic use. The polypeptides are modified polypeptides whereby the modification results in a reduced propensity for the polypeptide to elicit an immune response upon administration to the human subject. The invention in particular relates to the modification of human obesity protein (leptin) to result in leptin proteins that are substantially non-immunogenic or less immunogenic than any non-modified counterpart when used in vivo.

Abstract: The present invention relates to polypeptides to be administered especially to humans and in particular for therapeutic use. The polypeptides are modified polypeptides whereby the modification results in a reduced propensity for the polypeptide to elicit an immune response upon administration to the human subject. The invention in particular relates to the modification of human brain-derived neutrophic factor (BDNF) to result in BDNF proteins that are substantially non-immunogenic or less immunogenic than any non-modified counterpart when used in vivo.

Abstract: The present invention relates to polypeptides to be administered especially to humans and in particular for therapeutic use. The polypeptides are modified polypeptides whereby the modification results in a reduced propensity for the polypeptide to elicit an immune response upon administration to the human subject. The invention in particular relates to the modification of keratinocyte growth factor (KGF) to result in keratinocyte growth factor (KGF) proteins that are substantially non-immunogenic or less immunogenic than any non-modified counterpart when used in vivo.

Abstract: The present invention relates to polypeptides to be administered especially to humans and in particular for therapeutic use. The polypeptides are modified polypeptides whereby the modification results in a reduced propensity for the polypeptide to elicit an immune response upon administration to the human subject. The inention in particular relates to the modification of erythropoietin (EPO) to result in erythropoietin proteins that are substantially non-immunogenic or less immunogenic than any non-modified counterpart when used in vivo.

Abstract: The present invention relates to polypeptides to be administered especially to humans and in particular for therapeutic use. The polypeptides are modified polypeptides whereby the modification results in a reduced propensity for the polypeptide to elicit an immune response upon administration to the human subject. The invention in particular relates to the modification of granulocyte colony stimulating factor (G-CSF) to result in granulocyte colony stimulating factor (G-CSF) proteins that are substantially non-immunogenic or less immunogenic than any non-modified counterpart when used in vivo.

Abstract: An extension indicator is provided for determining a predetermined extension applied to an extensibly deformable article such as medical bandage used in compression therapy. The indicator includes first (420) and second (430) co-operating members, each adapted to be secured to an extensibly deformable article (440). One of the members is more extensible than the other and each member (420, 430) bears visual indicia (450, 460, 470) which upon extension of the more extensible member, are adapted to align with each other to indicate a predetermined extension of the more extensible member.

Abstract: A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12).

Abstract: An intelligent status monitoring, reporting and control module is coupled to a SCSI bus that interconnects a cluster of SCSI-compatible data storage modules (e.g., magnetic disk drives). The status monitoring, reporting and control module is otherwise coupled to the cluster of SCSI-compatible data storage modules and to power maintenance and/or other maintenance subsystems of the cluster for monitoring and controlling states of the data storage modules and power maintenance and/or other maintenance subsystems that are not readily monitored or controlled directly by way of the SCSI bus. The status monitoring, reporting and control module sends status reports to a local or remote system supervisor and executes control commands supplied by the local or remote system supervisor. The status reports include reports about system temperature and power conditions. The executable commands include commands for regulating system temperature and power conditions.

Abstract: A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12).

Abstract: An intelligent status monitoring, reporting and control module is coupled to a SCSI bus that interconnects a cluster of SCSI-compatible data storage modules (e.g., magnetic disk drives). The status monitoring, reporting and control module is otherwise coupled to the cluster of SCSI-compatible data storage modules and to power maintenance and/or other maintenance subsystems of the cluster for monitoring and controlling states of the data storage modules and power maintenance and/or other maintenance subsystems that are not readily monitored or controlled directly by way of the SCSI bus. The status monitoring, reporting and control module sends status reports to a local or remote system supervisor and executes control commands supplied by the local or remote system supervisor. The status reports include reports about system temperature and power conditions. The executable commands include commands for regulating system temperature and power conditions.

Abstract: A ball-grid array (BGA) semiconductor package (10,60,90) includes a substrate (31,61,91) attached to a support substrate (32,62,92). The substrate (31,61,91) has an opening (33) extending from an upper surface to a lower surface. An integrated circuit chip (18) is attached to the support substrate (32,62,92) within the opening (33). Bond pads (22) on the integrated circuit chip (18) are electrically connected to ball pads (42,73,106,108) on the lower surface of the substrate (31,61,91). Conductive solder balls (26) are attached to the ball pads (42,73,106,108). The support substrate (32,62,92) provides a low profile and functions as a standoff that limits the collapse of the conductive solder balls (26) when the BGA semiconductor package (10,60,90) is attached to an application board (46).

Abstract: An intelligent status monitoring, reporting and control module is coupled to a SCSI bus that interconnects a cluster of SCSI-compatible data storage modules (e.g., magnetic disk drives). The status monitoring, reporting and control module is otherwise coupled to the cluster of SCSI-compatible data storage modules and to power maintenance and/or other maintenance subsystems of the cluster for monitoring and controlling states of the data storage modules and power maintenance and/or other maintenance subsystems that are not readily monitored or controlled directly by way of the SCSI bus. The status monitoring, reporting and control module sends status reports to a local or remote system supervisor and executes control commands supplied by the local or remote system supervisor. The status reports include reports about system temperature and power conditions. The executable commands include commands for regulating system temperature and power conditions.