Abstract: A thermal processing system includes a source of laser radiation emitting at a laser wavelength, beam projection optics disposed between the reflective surface and a substrate support capable of holding a substrate to be processed, a pyrometer responsive to a pyrometer wavelength, and a wavelength responsive optical element having a first optical path for light in a first wavelength range including the laser wavelength, the first optical path being between the source of laser radiation and the beam projection optics, and a second optical path for light in a second wavelength range including the pyrometer wavelength, the second optical path being between the beam projection optics and the pyrometer. The system can further include a pyrometer wavelength blocking filter between the source of laser radiation and the wavelength responsive optical element.

Abstract: Apparatus for dynamic surface annealing of a semiconductor wafer includes a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of each the laser being individual adjustable and optics for focusing the radiation from the array of lasers into a narrow line beam in a workpiece plane corresponding to a workpiece surface, whereby the optics images respective columns of the laser array onto respective sections of the narrow line beam. A pyrometer sensor is provided that is sensitive to a pyrometer wavelength. An optical element in an optical path of the optics is tuned to divert radiation emanating from the workpiece plane to the pyrometry sensor. As a result, the optics images each of the respective section of the narrow line beam onto a corresponding portion of the pyrometer sensor.

Abstract: A method and apparatus for reducing the pulse-to-pulse laser energy variation (i.e., increasing the pulse-to-pulse laser energy repeatability) from a pulsed laser source are provided. In this manner, laser pulses impingent on a processing plane, such as the surface of a wafer or other substrate, may have substantially the same energy content leading to a more controlled process when compared to conventional processing. The method may be based on in-situ detection of the pulse energy level and the subsequent active adjustment of the transmitted laser pulse energy in a closed-loop control scheme. Furthermore, the active adjustment of the laser pulse energy may occur within a few nanoseconds after the original laser pulse is generated by a pulsed laser source.

Abstract: Embodiments of the present invention provide method and apparatus for annealing semiconductor substrates. One embodiment of the present invention provides a semiconductor processing chamber comprising a first substrate support configured to support a substrate, a second substrate support configured to support a substrate, a shuttle coupled to the first substrate support and configured to move the first substrate support between a processing zone and a first loading zone, wherein the processing zone having a processing volume configured to alternately accommodating the first substrate support and the second substrate support.

Abstract: A method and apparatus for decorrelating coherent light from a light source, such as a pulsed laser, in both time and space in an effort to provide intense and uniform illumination are provided. For some embodiments employing a pulsed light source, the output pulse may be stretched relative to the input pulse width. The methods and apparatus described herein may be incorporated into any application where intense, uniform illumination is desired, such as pulsed laser annealing, welding, ablating, and wafer stepper illuminating.

Abstract: The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy having a desired two-dimensional shape on a desired region on the surface of the substrate. Typically, the anneal regions may be square or rectangular in shape. Generally, the optical system and methods of the present invention are used to preferentially anneal one or more regions found within the anneal regions by delivering enough energy to cause the one or more regions to re-melt and solidify.

Abstract: A method and apparatus for decorrelating coherent light from a light source, such as a pulsed laser, in both time and space in an effort to provide intense and uniform illumination are provided. The techniques and apparatus described herein may be incorporated into any application where intense, uniform illumination is desired, such as pulsed laser annealing, welding, ablating, and wafer stepper illuminating.

Abstract: Methods and devices are provided for profiling a beam of light that includes a wavelength ?. The beam of light is received. Secondary light is generated at a wavelength ?? different from wavelength ? by fluorescing a material with the received beam of light. The secondary light is separated from the received beam of light. The separated secondary light is optically directed to a sensor.

Abstract: In a laser annealing system for workpieces such as semiconductor wafers, a pyrometer wavelength response band is established within a narrow window lying between the laser emission band and a fluorescence emission band from the optical components of the laser system, the pyrometer response band lying in a wavelength region at which the optical absorber layer on the workpiece has an optical absorption coefficient as great as or greater than the underlying workpiece. A multi-layer razor-edge interference filter having a 5-8 nm wavelength cut-off edge transition provides the cut-off of the laser emission at the bottom end of the pyrometer response band.

Abstract: A thermal processing system includes a source of laser radiation emitting at a laser wavelength, beam projection optics disposed between the reflective surface and a substrate support capable of holding a substrate to be processed, a pyrometer responsive to a pyrometer wavelength, and a wavelength responsive optical element having a first optical path for light in a first wavelength range including the laser wavelength, the first optical path being between the source of laser radiation and the beam projection optics, and a second optical path for light in a second wavelength range including the pyrometer wavelength, the second optical path being between the beam projection optics and the pyrometer. The system can further include a pyrometer wavelength blocking filter between the source of laser radiation and the wavelength responsive optical element.

Abstract: Methods and devices are provided for profiling a beam of light that includes a wavelength ?. The beam of light is received. Secondary light is generated at a wavelength ?? different from wavelength ? by fluorescing a material with the received beam of light. The secondary light is separated from the received beam of light. The separated secondary light is optically directed to a sensor.

Abstract: A dynamic surface anneal apparatus for annealing a semiconductor workpiece has a workpiece support for supporting a workpiece, an optical source and scanning apparatus for scanning the optical source and the workpiece support relative to one another along a fast axis. The optical source includes an array of laser emitters arranged generally in successive rows of the emitters, the rows being transverse to the fast axis. Plural collimating lenslets overlie respective ones of the rows of emitters and provide collimation along the fast axis. The selected lenslets have one or a succession of optical deflection angles corresponding to beam deflections along the fast axis for respective rows of emitters. Optics focus light from the array of laser emitters onto a surface of the workpiece to form a succession of line beams transverse to the fast axis spaced along the fast axis in accordance with the succession of deflection angles.

Abstract: Apparatus for dynamic surface annealing of a semiconductor wafer includes a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of each the laser being individual adjustable and optics for focusing the radiation from the array of lasers into a narrow line beam in a workpiece plane corresponding to a workpiece surface, whereby the optics images respective columns of the laser array onto respective sections of the narrow line beam. A pyrometer sensor is provided that is sensitive to a pyrometer wavelength. An optical element in an optical path of the optics is tuned to divert radiation emanating from the workpiece plane to the pyrometry sensor. As a result, the optics images each of the respective section of the narrow line beam onto a corresponding portion of the pyrometer sensor.

Abstract: An illumination system has a light source, an optical train, and a wavelength beam splitter. The optical train focuses light from the light source into a defined geometrical pattern on a surface. The wavelength beam splitter transmits light of a first wavelength and redirects light of a second wavelength. One of these wavelengths is included by the light from the light source, while the other is an emission wavelength generated by thermal excitation of the surface by the focused geometrical pattern.

Abstract: The present invention generally describes one ore more apparatuses and various methods that are used to perform an annealing process on desired regions of a substrate. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially melt certain desired regions of the substrate to remove unwanted damage created from prior processing steps (e.g., crystal damage from implant processes), more evenly distribute dopants in various regions of the substrate, and/or activate various regions of the substrate. The preferential melting processes will allow more uniform distribution of the dopants in the melted region, due to the increased diffusion rate and solubility of the dopant atoms in the molten region of the substrate. The creation of a melted region thus allows: 1) the dopant atoms to redistribute more uniformly, 2) defects created in prior processing steps to be removed, and 3) regions that have hyper-abrupt dopant concentrations to be formed.

Abstract: The present invention generally describes one ore more methods that are used to perform an annealing process on desired regions of a substrate. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially melt certain desired regions of the substrate to remove unwanted damage created from prior processing steps (e.g., crystal damage from implant processes), more evenly distribute dopants in various regions of the substrate, and/or activate various regions of the substrate. The preferential melting processes will allow more uniform distribution of the dopants in the melted region, due to the increased diffusion rate and solubility of the dopant atoms in the molten region of the substrate. The creation of a melted region thus allows: 1) the dopant atoms to redistribute more uniformly, 2) defects created in prior processing steps to be removed, and 3) regions that have hyper-abrupt dopant concentrations to be formed.

Abstract: A preferred embodiment of an accumulating conveyor system has at least one shoe slideably connected to an endless chain. Each shoe includes a pair of opposing rollers, one of which is engageable with the endless chain when the shoe is positioned adjacent an upper support member, and the other is engageable with the endless chain when the shoe is positioned adjacent a lower support member. The shoe further includes a transverse roller attached to a body of the shoe and engageable with the upper and lower support members. In another aspect of the present invention, a workpiece support may be detachably connected to two shoes positioned on opposite sides of the conveyor system to form a pallet. In yet another aspect of the present invention, two or more pallets may be connected together using an anti back-flex chain to form a pallet assembly.

Abstract: A preferred embodiment of a cam for an accumulating conveyor system has a primary cam and a secondary cam that operably rotate about a common axis at substantially the same speed. The primary and secondary cam each have an outer circumferential surface that defines a receiving portion and a cam surface. The receiving portion of the cam is engageable with a cam follower of a shoe for moving the shoe between an upper and lower horizontal run of the conveyor. In another aspect of the present invention, the conveyor system has two sets of primary and secondary cams. One set of primary/secondary cams is positioned at a beginning of the conveyor system, while the other set is positioned at the end of the conveyor system. The primary cams are positioned at opposite corners of the conveyor system. Each cam is configured differently than the other three cams.

Abstract: A preferred embodiment of a cam for an accumulating conveyor system has a primary cam and a secondary cam that operably rotate about a common axis at substantially the same speed. The primary and secondary cam each have an outer circumferential surface that defines a receiving portion and a cam surface. The receiving portion of the cam is engageable with a cam follower of a shoe for moving the shoe between an upper and lower horizontal run of the conveyor. In another aspect of the present invention, the conveyor system has two sets of primary and secondary cams. One set of primary/secondary cams is positioned at a beginning of the conveyor system, while the other set is positioned at the end of the conveyor system. The primary cams are positioned at opposite corners of the conveyor system. Each cam is configured differently than the other three cams.

Abstract: A preferred embodiment of an accumulating conveyor system has at least one shoe slideably connected to a endless chain. Each shoe includes a pair of opposing, one of which is engageable with the endless chain when the shoe is positioned adjacent an upper support member, and the other is engageable with the endless chain when the shoe is positioned adjacent a lower support member. The shoe further includes a transverse roller attached to a body of the shoe and engageable with the upper and lower support members. In another aspect of the present invention, a workpiece support may be detachably connected to two shoes positioned on opposite sides of the conveyor system to form a pallet. In yet another aspect of the present invention, two or more pallets may be connected together using an anti back-flex chain to form a pallet assembly.