Patents by Inventor Ting Fan

Ting Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250081450
    Abstract: A high-speed multi-write read only memory array includes word lines, select lines, bit lines, and sub-memory arrays. There are a first word line, a first select line, a second select line, a first bit line, a second bit line, a third bit line, and a fourth bit line. Each sub-memory array includes a first memory cell coupled to the first word line, the first select line, and the first bit line, a second memory cell coupled to the first word line, the first select line, and the second bit line, a third memory cell coupled to the first word line, the second select line, and the third bit line, and a fourth memory cell coupled to the first word line, the second select line, and the fourth bit line.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 6, 2025
    Inventors: YU-TING HUANG, CHI-PEI WU, YA-TING FAN
  • Publication number: 20240243271
    Abstract: Doped titanium niobate is provided, which has a chemical structure of Ti(1-x)M1xNb2O(7-z)Sz, wherein M1 is Li, Mg, or a combination thereof; 0?x?0.15; and 0.0025?z?0.075. A battery is provided, which includes a negative electrode; a positive electrode; and an electrolyte disposed between the negative electrode and the positive electrode, wherein the negative electrode includes the doped titanium niobate.
    Type: Application
    Filed: March 28, 2024
    Publication date: July 18, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuan-Yu KO, Po-Yang HUNG, Chi-Ju CHENG, Shih-Chieh LIAO, Yung-Ting FAN, Jin-Ming CHEN
  • Publication number: 20230243024
    Abstract: A Mg—Li—Al—Zn alloy is disclosed. The Mg—Li—Al—Zn alloy comprises, in weight percent: 5-15% Li, 1.5-9.0% Al, 0.5-1.5% Zn, 0.4-1.3% Y, 0.18-1.01% Nd, 0.09-0.65% Ce, and the balance Mg and incidental impurities. Experimental data have proved that, this novel Mg—Li—Al—Zn alloy has a flashover temperature in a range between 620° C. and 700° C., such that the flashover temperature of the specifically-designed Mg—Li—Al—Zn alloy is greater than that of commercial LAZ521, LAZ721, LAZ771, LAZ921, and LAZ1491 alloys. Therefore, the Mg—Li—Al—Zn alloy of the present invention can be processed to be a structural article through air melt and casting process.
    Type: Application
    Filed: January 4, 2023
    Publication date: August 3, 2023
    Applicant: AMLI MATERIALS TECHNOLOGY CO., LTD.
    Inventors: CHUN-KAI LIN, JIAN-YI GUO, CHIN-TING FAN
  • Publication number: 20230240062
    Abstract: A memory structure includes a substrate; a first gate structure, a second gate structure and a third gate structure disposed on the substrate, separated from each other along the first direction and respectively extending along the second direction and the third direction; channel bodies separated from each other and passing through the first gate structure, the second gate structure and the third gate structure along the first direction; dielectric films disposed between the first gate structure, the second gate structure, the third gate structure and the channel bodies; and a first side plug electrically connected to the substrate and the channel bodies. The first gate structure, the second gate structure and the third gate structure surround each of the dielectric films and each of the channel bodies, and the dielectric films do not include a charge storage structure.
    Type: Application
    Filed: May 18, 2022
    Publication date: July 27, 2023
    Inventors: Sheng-Ting FAN, Wei-Chen CHEN, Hang-Ting LUE
  • Patent number: 11664218
    Abstract: A transistor based on topological insulators is provided. In an embodiment a topological insulator is used to form both the channel as well as the source/drain regions, wherein the channel has a first thickness such that the topological insulator material has properties of a semiconductor material and the source/drain regions have a second thickness such that the topological insulator has properties of a conductive material.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: May 30, 2023
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Sheng-Ting Fan, Pin-Shiang Chen, Chee Wee Liu, Chi-Wen Liu
  • Patent number: 11656232
    Abstract: The present invention provides novel allergens isolated from grass carp Ctenopharyngodon idella, recombinant or modified polypeptides comprising such allergens, nucleic acids encoding the polypeptides as well as related compositions. Also provided are methods and kits for diagnosing fish allergy.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: May 23, 2023
    Assignee: The Chinese University of Hong Kong
    Inventors: Sze Yin Agnes Leung, Ting Fan Leung, Yat Hin Nicki Leung, Yee Yan Christine Wai
  • Publication number: 20210382070
    Abstract: The present invention provides methods and compositions for improved diagnosis of shrimp allergies.
    Type: Application
    Filed: June 1, 2021
    Publication date: December 9, 2021
    Inventors: Ting Fan LEUNG, Yee Yan Christine Wai, Sze Yin Agnes Leung, Yat Hin Nicki Leung
  • Publication number: 20210296112
    Abstract: A transistor based on topological insulators is provided. In an embodiment a topological insulator is used to form both the channel as well as the source/drain regions, wherein the channel has a first thickness such that the topological insulator material has properties of a semiconductor material and the source/drain regions have a second thickness such that the topological insulator has properties of a conductive material.
    Type: Application
    Filed: June 7, 2021
    Publication date: September 23, 2021
    Inventors: Sheng-Ting Fan, Pin-Shiang Chen, Chee Wee Liu, Chi-Wen Liu
  • Patent number: 11043376
    Abstract: A transistor based on topological insulators is provided. In an embodiment a topological insulator is used to form both the channel as well as the source/drain regions, wherein the channel has a first thickness such that the topological insulator material has properties of a semiconductor material and the source/drain regions have a second thickness such that the topological insulator has properties of a conductive material.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: June 22, 2021
    Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., National Taiwan University
    Inventors: Sheng-Ting Fan, Pin-Shiang Chen, Chee Wee Liu, Chi-Wen Liu
  • Patent number: 11018239
    Abstract: A semiconductor device includes a channel, source/drain structures, and a gate stack. The source/drain structures are on opposite sides of the channel. The gate stack is over the channel, and the gate stack includes a gate dielectric layer, a doped ferroelectric layer, and a gate electrode. The gate dielectric layer is over the channel. The doped ferroelectric layer is over the gate dielectric layer. The gate electrode is over the doped ferroelectric layer. A dopant concentration of the doped ferroelectric layer varies in a direction from the gate electrode toward the channel.
    Type: Grant
    Filed: April 13, 2019
    Date of Patent: May 25, 2021
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Pin-Shiang Chen, Sheng-Ting Fan, Chee-Wee Liu
  • Publication number: 20200328287
    Abstract: A semiconductor device includes a channel, source/drain structures, and a gate stack. The source/drain structures are on opposite sides of the channel. The gate stack is over the channel, and the gate stack includes a gate dielectric layer, a doped ferroelectric layer, and a gate electrode. The gate dielectric layer is over the channel. The doped ferroelectric layer is over the gate dielectric layer. The gate electrode is over the doped ferroelectric layer. A dopant concentration of the doped ferroelectric layer varies in a direction from the gate electrode toward the channel.
    Type: Application
    Filed: April 13, 2019
    Publication date: October 15, 2020
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Pin-Shiang CHEN, Sheng-Ting FAN, Chee-Wee LIU
  • Publication number: 20200243327
    Abstract: A transistor based on topological insulators is provided. In an embodiment a topological insulator is used to form both the channel as well as the source/drain regions, wherein the channel has a first thickness such that the topological insulator material has properties of a semiconductor material and the source/drain regions have a second thickness such that the topological insulator has properties of a conductive material.
    Type: Application
    Filed: April 14, 2020
    Publication date: July 30, 2020
    Inventors: Sheng-Ting Fan, Pin-Shiang Chen, Chee Wee Liu, Chi-Wen Liu
  • Publication number: 20200191797
    Abstract: The present invention provides novel allergens isolated from grass carp Ctenopharyngodon Idella, recombinant or modified polypeptides comprising such allergens, nucleic acids encoding the polypeptides as well as related compositions. Also provided are methods and kits for diagnosing fish allergy.
    Type: Application
    Filed: September 30, 2019
    Publication date: June 18, 2020
    Inventors: Sze Yin Agnes Leung, Ting Fan Leung, Yat Hin Nicki Leung, Yee Yan Christine Wai
  • Patent number: 10686072
    Abstract: A semiconductor device includes a source and a drain and a channel disposed between the source and the drain, a first gate dielectric layer disposed on the channel, a first gate electrode disposed on the first gate dielectric layer, a second gate dielectric layer disposed on the first gate electrode, and a second gate electrode disposed on the second gate dielectric layer. The second gate dielectric layer is made of a ferroelectric material. A first area of a bottom surface of the first gate electrode which is in contact with the first gate dielectric layer where the is greater than a second area of a bottom surface of the second gate dielectric layer which is in contact with the first gate electrode.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: June 16, 2020
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Yu-Hung Liao, Samuel C. Pan, Sheng-Ting Fan, Min-Hung Lee, Chee-Wee Liu
  • Publication number: 20200140339
    Abstract: Doped titanium niobate is provided, which has a chemical structure of Ti(1-x)M1xNb(2-y)M2yO(7-z)Qz or Ti(2-x?)M1x?Nb(10-y?)M2y?O(29-z?)Qz?, wherein M1 is Li, Mg, or a combination thereof; M2 is Fe, Mn, V, Ni, Cr, or a combination thereof; Q is F, Cl, Br, I, S, or a combination thereof; 0?x?0.15; 0?y?0.15; 0.01?z?2; 0?x??0.3; 0?y??0.9; and 0.01?z??8.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 7, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuan-Yu KO, Po-Yang HUNG, Chi-Ju CHENG, Shih-Chieh LIAO, Yung-Ting FAN, Jin-Ming CHEN
  • Patent number: 10636651
    Abstract: A transistor based on topological insulators is provided. In an embodiment a topological insulator is used to form both the channel as well as the source/drain regions, wherein the channel has a first thickness such that the topological insulator material has properties of a semiconductor material and the source/drain regions have a second thickness such that the topological insulator has properties of a conductive material.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: April 28, 2020
    Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., National Taiwan University
    Inventors: Sheng-Ting Fan, Pin-Shiang Chen, Chee Wee Liu, Chi-Wen Liu
  • Patent number: 10290708
    Abstract: Semiconductor devices and methods of forming the same are provided. A first gate electrode layer is formed over a substrate. A first gate dielectric layer is formed over the first gate electrode layer. A first channel layer is formed over the first gate dielectric layer. An isolation layer is formed over the first channel layer. A second channel layer is formed over the isolation layer. A second gate dielectric layer is formed over the second channel layer. The second gate dielectric layer, the second channel layer, the isolation layer and the first channel layer are patterned to form a first opening, the first opening extending through the first gate dielectric layer, the second channel layer and the isolation layer, and into the first channel layer. A first source/drain region is formed in the first opening.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: May 14, 2019
    Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., National Taiwan University
    Inventors: Pin-Shiang Chen, Samuel C. Pan, Chee-Wee Liu, Sheng-Ting Fan
  • Publication number: 20180337032
    Abstract: A transistor based on topological insulators is provided. In an embodiment a topological insulator is used to form both the channel as well as the source/drain regions, wherein the channel has a first thickness such that the topological insulator material has properties of a semiconductor material and the source/drain regions have a second thickness such that the topological insulator has properties of a conductive material.
    Type: Application
    Filed: July 31, 2018
    Publication date: November 22, 2018
    Inventors: Sheng-Ting Fan, Pin-Shiang Chen, Chee Wee Liu, Chi-Wen Liu
  • Patent number: 10109477
    Abstract: A transistor based on topological insulators is provided. In an embodiment a topological insulator is used to form both the channel as well as the source/drain regions, wherein the channel has a first thickness such that the topological insulator material has properties of a semiconductor material and the source/drain regions have a second thickness such that the topological insulator has properties of a conductive material.
    Type: Grant
    Filed: May 10, 2016
    Date of Patent: October 23, 2018
    Assignees: Taiwan Semiconductor Manufacturing Company, Ltd., National Taiwan University
    Inventors: Sheng-Ting Fan, Pin-Shiang Chen, Chee Wee Liu, Chi-Wen Liu
  • Patent number: D951446
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: May 10, 2022
    Assignee: BIOGEND THERAPEUTICS CO., LTD.
    Inventors: Ting-Fan Yang, Chun Nan Chen, Po-Wei Lee