Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.

Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.

Abstract: An ameliorated compound carrier board structure of Flip-Chip Chip-Scale Package has the insulating layer between the carrier board and the substrate in the prior art replaced by an anisotropic conductive film or materials with similar structure. The anisotropic conductive film has conductive particles therein to replace the conductive openings on the insulating layer in the prior art. When compressing the substrate onto the carrier board, the bottom surface of the second electrode pads are compressing the corresponding conductive particles on the second electrical contact pads, causing which to burst, therefore forming high-density compressed areas that conduct the second electrode pads and the second electrical contact pads; the conductive particles outside the high-density compressed area are not burst, forming an insulating film between the substrate and the carrier board; in other words, the anisotropic conductive film provides conduction in a Z direction.

Abstract: A landless multilayer circuit board includes a first substrate, a first circuit, at least one connecting pillar, a second substrate, and a second circuit. The second substrate is on the surface of the first substrate, covering the first circuit, and exposing at least one top of the at least one connecting pillar exposed out of a surface of the second substrate, wherein an area of a portion of the at least one connecting pillar that is exposed out of the surface of the second substrate is greater than an area of a portion of the at least one connecting pillar that is connected to the first circuit. The second circuit is on the surface of the second substrate and the at least one connecting pillar, and connected to the portion of the at least one connecting pillar that is exposed out of the surface of the second substrate.

Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.

Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. The EMI shielding device is adopted to be mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.

Abstract: Provided is a landless multilayer circuit board and a manufacturing method thereof. The manufacturing method includes steps of forming a first circuit on a first substrate, patterning a photoresist layer to form at least one via between the first circuit and a second circuit, forming at least one connecting pillar in the at least one via, removing the photoresist layer, forming a second substrate to cover the at least one connect pillar, and forming the second circuit on the second substrate. The second circuit is connected to the first circuit through the at least one connecting pillar. When the second circuit is formed, the at least one via does not need to be filled, thereby making the second circuit flat.

Abstract: A multilayer printed circuit board includes a first circuit board, a second circuit board and bonding films. The first circuit board includes a first dielectric layer, a first wiring pattern layer, a plurality of conductive blocks and a plurality of solder balls. The first wiring pattern layer is formed on a first surface of the first dielectric layer and the conductive blocks are formed on a second surface of the first dielectric layer. The solder balls are formed on a surface of the first wiring pattern layer. The second circuit board includes a second dielectric layer, a second wiring pattern layer, second conductive blocks and conductive pillars. The second wiring pattern layer is formed on a third surface of the second dielectric layer and the second conductive blocks are formed on a fourth surface thereof. The conductive pillars are formed on the second wiring pattern layer.

Abstract: A manufacturing method of a double layer circuit board comprises forming at least one connecting pillar on a first circuit, wherein the at least one connecting pillar comprises a first end, connected to the first circuit, and a second end, opposite to the first end; forming a substrate on the first circuit and the at least one connecting pillar; drilling the substrate to expose a portion of the second end of the at least one connecting pillar, wherein the other portion of the second end of the at least one connecting pillar is covered by the substrate; and forming a second circuit on the substrate and the portion of the second end of the at least one connecting pillar, wherein an area of the first end connected to the first circuit layer is greater than an area of the portion of the second end connected to the second circuit layer.

Abstract: A multi-layer circuit board includes a first circuit board, conducting blocks, a second circuit board, and conducting recesses. The first circuit board has a first conductor layer mounted on the first circuit board. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the second circuit board, electrically connected to the second conductor layer, and corresponding to the respective conducting blocks. The insulating layer is mounted between the first conductor layer and the second conductor layer. The second circuit board is on the first circuit board, the conducting blocks are respectively mounted in the conducting recesses to electrically connect the first conductor layer and the second conductor layer.

Abstract: A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.

Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.

Abstract: An EMI shielding device is provided. A first shielding layer is formed on a first surface of a first substrate, and a first through hole is formed through the first substrate. A second substrate is mounted in an opening of the first through hole, and a second shielding layer is formed on a surface of the second substrate. A conductive paste is mounted between the first substrate and the at least one second substrate to electrically connected the first shielding layer and the second shielding layer. A protective layer, an antirust layer, and a shielding layer are sequentially mounted on the conductive paste. The EMI shielding device is mounted on a printed circuit board (PCB) by Surface Mount Technology. Therefore, the EMI shielding device may be firmly mounted on the PCB, and there is not any narrow gap that may leak electromagnetic radiation.

Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.

Abstract: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with an opening bonded to a carrier board in order to form a compound carrier board structure. A die is placed in the opening and bonded to the carrier board. A sealant is filled in a gap between surrounding walls of the opening and the die at a height lower than the die to fixedly place the die within the opening and to leave a non-active surface of the die exposed.

Abstract: A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with an opening bonded to a carrier board in order to form a compound carrier board structure. A die is placed in the opening and bonded to the carrier board. A sealant is filled in a gap between surrounding walls of the opening and the die at a height lower than the die to fixedly place the die within the opening and to leave a non-active surface of the die exposed.

Abstract: A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.

Abstract: Provided is a double layer circuit board and a manufacturing method thereof. The double layer circuit board comprises a substrate, a first circuit layer formed on a first surface of the substrate, a second circuit layer formed on a second surface of the substrate, and at least one connecting pillar formed in and covered by the substrate. Each one of the at least one connecting pillar includes a first end connected to the first circuit layer and a second end connected to the second circuit layer. A terminal area of the second end is greater than a terminal area of the first end. Therefore, the second circuit layer is firmly connected to the first circuit layer through the at least one connecting pillar. A yield rate of the double layer circuit board may be increased.

Abstract: Provided is a landless multilayer circuit board and a manufacturing method thereof. The manufacturing method includes steps of forming a first circuit on a first substrate, patterning a photoresist layer to form at least one via between the first circuit and a second circuit, forming at least one connecting pillar in the at least one via, removing the photoresist layer, forming a second substrate to cover the at least one connect pillar, and forming the second circuit on the second substrate. The second circuit is connected to the first circuit through the at least one connecting pillar. When the second circuit is formed, the at least one via does not need to be filled, thereby making the second circuit flat.

Abstract: A printed circuit board (PCB) test fixture includes a substrate, a first insulation layer formed on the substrate, a conductor layer formed on the first insulation layer and electrically connected to the upper electrodes through at least one first connection member, a second insulation layer formed on the first insulation layer, and multiple conductive cones arranged on the second insulation layer in a matrix form. A part of the conductive cones is electrically connected to the conductor layer through at least one second connection member. The circuit layout of the conductor layer, the at least one first connection member and the at least one second connection member is employed to supply testing power to a part of the conductive cones and an adjustable arrangement of the conductive cones to enhance density of test probes upon electrical testing.