Patents by Inventor Ting-Hau Wu

Ting-Hau Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-Step Process for Forming High-Aspect-Ratio Holes for MEMS Devices
    Publication number: 20100120260
    Abstract: A method of forming an integrated circuit structure includes forming an opening in a substrate, with the opening extending from a top surface of the substrate into the substrate. The opening is filled with a filling material until a top surface of the filling material is substantially level with the top surface of the substrate. A device is formed over the top surface of the substrate, wherein the device includes a storage opening adjoining the filling material. A backside of the substrate is grinded until the filling material is exposed. The filling material is removed from the channel until the storage opening of the device is exposed.
    Type: Application
    Filed: December 31, 2008
    Publication date: May 13, 2010
    Inventors: Jiou-Kang Lee, Ting-Hau Wu, Shang-Ying Tsai, Jung-Huei Peng, Chun-Ren Cheng
  • Process for Eliminating Delamination between Amorphous Silicon Layers
    Publication number: 20090294766
    Abstract: A circuit structure includes a substrate; a first amorphous silicon layer over the substrate; a first glue layer over and adjoining the first amorphous silicon layer; and a second amorphous silicon layer over and adjoining the first glue layer.
    Type: Application
    Filed: June 12, 2008
    Publication date: December 3, 2009
    Inventors: Jiou-Kang Lee, Chun-Ren Sean Cheng, Shang-Ying Tsai, Ting-Hau Wu, Hsiang-Fu Benior Chen