Abstract: A wider window margin in an eye diagram for an optical transmission signal is provided for both threshold and phase (timing).

Abstract: A method is disclosed for monitoring and controlling the bit error rate (BER) in an optical communication network where an optical receiver in the optical transmission network is a monolithic photonic integrated circuit (RxPIC) chip. The method includes the steps of decombining on-chip a combined channel signal received from the network and then monitoring a real time bit error rate (BER) of a decombined channel signal. The determined BER is then communicated, such as through an optical service channel (OSC) to an optical transmitter source that is the source of origin of the channel signal. Based upon the determined BER, the chirp of a channel signal modulator at the optical transmitter source that generated the monitored channel signal is adjusted by, for example, adjusting its bias. The same channel signal received at the RxPIC chip can be monitored again to determine if an acceptable level for the BER has been achieved by the previous chirp adjustment.

Abstract: An optical transmitter photonic integrated circuit (TxPIC) comprises a semiconductor monolithic chip with a plurality of optical signal channels where each channel comprises a modulated signal source. The output from the modulated signal sources are coupled to an input of an integrated optical combiner to form a WDM output signal for transmission off the TxPIC chip to an optical transmission link. An optical service channel (OSC) is also integrated on the TxPIC chip to receive a service signal from the optical receiver source which is also coupled the optical transmission link.

Abstract: A transmission line is provided with added shunt resistance, RSH, distributed along the length of the micro transmission line permitting the extension of constant characteristic impedance to the transmission line to lower signal frequencies. The loss in gain to the signal propagating the transmission line due to the added resistance can be compensated for by amplification provided at the output of the transmission line or at output taps provided along the length of the transmission line such as in cases where the line is utilized as a circuit delay line. An exemplified application disclosed is an analog delay line formed as a metal microstrip in an IC chip circuit provided, for example, in a feed forward equalizer (FFE).

Abstract: A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.

Abstract: A C- and/or L-band booster optical amplifier is utilized in an optical communication system at the output of one or more semiconductor transmitter photonic integrated circuit (TxPIC) chips or the optical combined outputs of multiple semiconductor transmitter photonic integrated circuit (TxPIC) chips employed in an optical communication module, the deployment of integrated semiconductor optical amplifiers (SOAs) on the TxPIC chips can be eliminated. This would reduce both the complexity in designing and fabricating these chips as well as reducing the power consumption of the TxPIC chips. The deployment of such a Tx booster optical amplifier would also take into consideration the nonlinear effects of difficult high loss single mode fiber (SMF) or other fiber type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted solely on the TxPIC chip.

Abstract: A method of deploying a passive optical combiner that is a broad bandwidth spectral wavelength combiner for combining the outputs from multiples transmitter photonic integrated circuit (TxPIC) chips and, thereafter, the amplification of the combined channel signals with a booster optical amplifier couple between the passive optical combiner and the fiber transmission link. The booster optical amplifier may be a rear earth fiber amplifier, such as an erbium doped fiber amplifier (EDFA), or one or more semiconductor optical amplifiers (SOAs) on one or more semiconductor chips.

Abstract: An optical transmission network is inherently asynchronous due to the utilization of a variable overhead ratio (V-OHR). The network architecture makes extensive use of OEO regeneration, i.e., deals with any electronic reconditioning to correct for transmission impairments, such as, for example, FEC encoding, decoding and re-encoding, signal reshaping, retiming as well as signal regeneration. The optical transmission network includes a plesiochronous clocking system with intermediate nodes designed to operate asynchronously with a single local frequency clock without complicated network synchronization schemes employing high cost clocking devices such as phase locked loop (PLL) control with crystal oscillators and other expensive system components.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: An optical modulator drive circuit provides a different approach to driving an optical modulator than presently employed, resulting in a reduction in power dissipation of the drive circuit by as much as 80%. Therefore, this invention dissipates as little as 20% of power of the present drive circuits known in the art. The optical modulator may be a semiconductor electro-absorption modulator but the principle of the invention can be applied any other type of electro-optic modulator that relies on a voltage to modulate an optical signal.

Abstract: A photonic integrated circuits (PICs), also referred to as opto-electronic integrated circuits (OEICs), and more particularly to a PIC in the form of an optical receiver PIC or RxPIC for use in an optical transport networks. Also, an optical transmitter PIC (TxPIC) is also disclosed in conjunction with an RxPIC in an optical transport network. The chip is cast from an InP wafer and is made from Group III-V elemental materials in the InGaAsP/InP regime with fabrication accomplished through selective metalorganic vapor phase epitaxy (MOVPE) or also known as metalorganic chemical vapor deposition (MOCVD). Integrated on the chip, starting at the input end which is coupled to receive multiplexed optical data signals from an optical transport network is an optical amplifier, an optical demultiplexer, and a plurality of on-chip photodiodes (PDs) each to receive a demultiplexed data signal from the AWG DEMUX for optical-to-electrical signal conversion.

Abstract: An optical modulator drive circuit provides a different approach to driving an optical modulator than presently employed, resulting in a reduction in power dissipation of the drive circuit by as much as about 80%. Therefore, this invention dissipates as little as 20% of power of the present drive circuits known in the art. The optical modulator may be a semiconductor electro-absorption modulator but the principle of the invention can be applied any other type of electro-optic modulator that relies on a voltage to modulate an optical signal.

Abstract: A C- and/or L-band booster optical amplifier is utilized at the output of a semiconductor transmitter photonic integrated circuit (TxPIC) chip or the optical combined outputs of multiple semiconductor transmitter photonic integrated circuit (TxPIC) chips employed in an optical communication module, the deployment of integrated semiconductor optical amplifiers (SOAs) on th TxPIC chips can be eliminated. This would reduce both the complexity in designing and fabricating these chips as well as reducing the power consumption of the TxPIC chips. The deployment of such a Tx booster optical amplifier would also take into consideration the nonlinear effects of difficult high loss single mode fiber (SMF) or other fiber type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted solely on the TxPIC chip.