Patents by Inventor Ting Wu

Ting Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11701289
    Abstract: A rehabilitation glove based on a bidirectional driver of a honeycomb imitating structure, including five bidirectional drivers and a cotton glove. The drivers are fixed to a back of the glove through hook and loop fasteners. Each driver includes a hollow buckling air bag in a continuous bent state, a middle guide layer in a continuous bent state and a hollow stretching air bag. The buckling air bag and the middle guide layer are symmetrically arranged, and the stretching air bag in a straightened state is arranged below the middle guide layer. A novel bidirectional driver of a honeycomb imitating structure is provided, which may provide a patient with rehabilitation training in two degrees of freedom: buckling and stretching. A control algorithm of the bidirectional driver is further provided to perform force control output for the driver, which may better help the patient recover hand functions.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: July 18, 2023
    Assignee: SOUTHEAST UNIVERSITY
    Inventors: Aiguo Song, Jianwei Lai, Huijun Li, Hong Zeng, Baoguo Xu, Ting Wu
  • Patent number: 11705898
    Abstract: An off chip driver circuit includes a first power rail, a second power rail, an input/output pad, a pull-up circuit, a pull-down circuit. The pull-up circuit is configured to selectively activate at least one of charging paths between the first power rail and the input/output pad. The pull-up circuit includes a first resistor and PMOS transistors arranged on the charging paths, and the first resistor is coupled between the first power rail and the PMOS transistors. The pull-down circuit is configured to selectively activate at least one of discharging paths between the second power rail and the input/output pad. The pull-down circuit includes a second resistor and NMOS transistors arranged on the discharging paths, and the second resistor is coupled between the second power rail and the NMOS transistors.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: July 18, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Chang-Ting Wu
  • Publication number: 20230222980
    Abstract: In examples, an electronic device comprises a camera and a display having a transparent area aligned with the camera. The display comprises a first line corresponding to a pixel row or column of the display, the first line extending from a first end of the display to the transparent area. The display comprises a second line corresponding to the pixel row or column and extending from a second end of the display to the transparent area, the first and second lines separated by a gap. The electronic device includes a controller coupled to the display, the controller to drive the first and second lines consecutively.
    Type: Application
    Filed: May 15, 2020
    Publication date: July 13, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Super Liao, Kuan-Ting Wu
  • Patent number: 11698541
    Abstract: An optical lens device includes a lens body, an optical filter and an optical absorbance portion. The lens body has a first lens surface and a second lens surface between which to form the optical filter where is to provide the optical absorbance portion. The optical absorbance portion includes a first main absorbance area having a first absorbance peak portion and a second main absorbance area having a second absorbance peak portion. The first main absorbance area has a first wavelength range between 420 nm and 440 nm formed as a high-energy blue UV absorbance area while the second main absorbance area has a second wavelength range between 580 nm and 610 nm.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: July 11, 2023
    Assignee: FORESIGHT OPTICAL LTD.
    Inventors: Tien-Shu Wu, Yen-Ting Wu
  • Patent number: 11697839
    Abstract: The present invention relates to a method of identifying a target genomic nucleic acid sequence including hybridizing a set of probes to the target genomic nucleic acid sequence, wherein the set of probes has a unique associated barcode sequence for identification of the target genomic nucleic acid sequence, wherein each probe of the set includes (1) a complementary sequence complementary to a first strand of the target genomic nucleic acid sequence and (2) the associated barcode sequence or a portion of the associated barcode sequence, sequencing the associated barcode sequence from probes hybridized to the target genomic nucleic acid sequence using a fluorescence-based sequencing method, and identifying the target genomic nucleic acid sequence by the sequenced barcode sequence.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: July 11, 2023
    Assignee: President and Fellows of Harvard College
    Inventors: Evan R. Daugharthy, Son C. Nguyen, Chao-ting Wu, George M. Church
  • Publication number: 20230211375
    Abstract: A coated substrate for an electronic device can include a substrate, a physical vapor deposition layer over the substrate, and an anti-fingerprint layer over the physical vapor deposition layer. The physical vapor deposition layer can include an alloy of gold and platinum. The anti-fingerprint layer can include an ultraviolet radiation-cured polymer mixed with an anti-fingerprint material. The anti-fingerprint material can include a silane, a fluorinated polymer, a hydrophobic polymer, or a combination thereof.
    Type: Application
    Filed: April 15, 2020
    Publication date: July 6, 2023
    Inventors: CHI HAO CHANG, CHIEN-TING LIN, KUAN-TING WU
  • Publication number: 20230216500
    Abstract: The interface circuit includes a first transistor, a second transistor, a first switch, a first logic circuit and a second logic circuit. The first transistor is controlled by a enable signal. The second transistor is controlled by a first control signal. The first switch is coupled between a second end of the first transistor and the output end of the interface circuit, wherein the first switch is controlled by a second control signal. The first logic circuit generates the first control signal according to the enable signal and at least one indication signal. The second logic circuit generates the second control signal according to the first control signal and the enable signal.
    Type: Application
    Filed: January 4, 2022
    Publication date: July 6, 2023
    Applicant: NANYA TECHNOLOGY CORPORATION
    Inventor: Chang-Ting Wu
  • Patent number: 11694613
    Abstract: A display having an area of non-transparent pixels, an area of transparent pixels, a camera positioned behind the transparent pixels to capture an image when light passes through the transparent pixels, and a display controller for driving the non-transparent pixels at a first brightness and driving the transparent pixels at a second brightness greater than the first brightness during image capture by the camera.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: July 4, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsing-Hung Hsieh, Kuan-Ting Wu, Dehuei Chen
  • Publication number: 20230204423
    Abstract: Systems, apparatuses, and methods for multi-application optical sensing are provided. For example, an optical sensing apparatus can include a photodetector array, a first circuitry, and a second circuitry. The photodetector array includes a plurality of photodetectors, wherein a first subset of the plurality of photodetectors are configured as a first region for detecting a first optical signal, and a second subset of the plurality of photodetectors are configured as a second region for detecting a second optical signal. The first circuitry, coupled to the first region, is configured to perform a first function based on the first optical signal to output a first output result. The second circuitry, coupled to the second region, is configured to perform a second function based on the second optical signal to output a second output result.
    Type: Application
    Filed: March 6, 2023
    Publication date: June 29, 2023
    Inventors: Chih-Wei Yeh, Hung-Chih Chang, Yun-Chung Na, Tsung-Ting Wu, Shu-Lu Chen
  • Patent number: 11688633
    Abstract: An integrated circuit (IC) structure includes a substrate, a transistor, an interconnect structure, a plurality of metal lines, an oxide liner, a passivation layer, and a nitride layer. The transistor is on the substrate. The interconnect structure is over the transistor. The metal lines is on the interconnect structure. The oxide liner is over the plurality of metal lines. The passivation layer is over the oxide liner and is more porous than the passivation layer. The nitride layer is over the passivation layer.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: June 27, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Chiang Chen, Chun-Ting Wu, Ching-Hou Su, Chih-Pin Wang
  • Publication number: 20230183788
    Abstract: Novel methods for making high resolution oligonucleotide paints are provided. Novel, high resolution oligonucleotide paints are also provided.
    Type: Application
    Filed: January 31, 2023
    Publication date: June 15, 2023
    Inventors: Chao-ting Wu, George M. Church, Benjamin Richard Williams
  • Publication number: 20230189465
    Abstract: The present disclosure is drawn to covers for electronic, devices, methods of making the covers, and electronic devices, in one example, described herein Is a cover for an electronic device comprising: a substrate; a micro-arc oxidation layer applied on at least one surface of the substrate; and a dyeing layer on the micro-arc oxidation layer, wherein the dyeing layer comprises: from about 3 to about 10 wt% wafer based dyes based on the total weight of the dyeing layer; and from about 0.3 wt % to about 2 wt% surfactant based on the total weight of the dyeing layer.
    Type: Application
    Filed: May 13, 2020
    Publication date: June 15, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Ya-Ting Yeh, Chi Hao Chang
  • Publication number: 20230184114
    Abstract: Methods and systems for determining a change in condition of a rock bolt. Some methods may comprise, at a first point in time, propagating shear and longitudinal ultrasonic waves along the rock bolt to measure a first time of flight for each of the shear and longitudinal waves, at a second point in time after the first point in time, propagating shear and longitudinal ultrasonic waves along the rock bolt to measure a second time of flight for each of the shear and longitudinal waves, and using the relative changes of the first and second time of flights, determining the change in condition of the rock bolt section.
    Type: Application
    Filed: February 10, 2023
    Publication date: June 15, 2023
    Applicant: National Research Council of Canada
    Inventors: Silvio Elton Kruger, Zhigang Sun, Kuo-Ting Wu, David Rocheleau
  • Patent number: 11677399
    Abstract: The interface circuit includes a first transistor, a second transistor, a first switch, a first logic circuit and a second logic circuit. The first transistor is controlled by a enable signal. The second transistor is controlled by a first control signal. The first switch is coupled between a second end of the first transistor and the output end of the interface circuit, wherein the first switch is controlled by a second control signal. The first logic circuit generates the first control signal according to the enable signal and at least one indication signal. The second logic circuit generates the second control signal according to the first control signal and the enable signal.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: June 13, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Chang-Ting Wu
  • Publication number: 20230176342
    Abstract: A fixed-focus projection lens module used for projecting an image beam provided by a light valve onto a screen is provided. The fixed-focus projection lens module includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens and a light-transmitting element arranged in sequence from a screen side to a display side along an optical axis. The fixed-focus projection lens module satisfies: 1<|OAL/BFL|<2.1, and OAL is a distance from the screen side surface of the first lens to the display side surface of the seventh lens on the optical axis, BFL is a distance from the screen side surface of the light-transmitting element to a display surface of the light valve on the optical axis.
    Type: Application
    Filed: November 1, 2022
    Publication date: June 8, 2023
    Applicant: Coretronic Corporation
    Inventors: Wei-Ting Wu, Cheng-Huan Lyu, Ching-Chuan Wei, Fu-Ming Chuang
  • Patent number: 11667540
    Abstract: The manufacturing method of titanium dioxide solution includes: mixing choline chloride, urea, boric acid, and titanium tetrachloride to form a first solution, wherein a molar concentration ratio of choline chloride to urea is 1:2, a molar concentration of titanium tetrachloride is 0.2 M to 0.4 M, and weight/volume of boric acid is 5 g/300 ml to 15 g/300 ml; and heating the first solute ion to form a second solution, wherein the second solution contains carbon/nitrogen doped titanium dioxide. In the manufacturing method of the present disclosure, the deep eutectic solution formed by choline chloride and urea may be used as a solvent, and may also be used as a carbon source and/or a nitrogen source. Therefore, titanium dioxide may be doped with carbon and/or nitrogen during the formation process.
    Type: Grant
    Filed: November 25, 2021
    Date of Patent: June 6, 2023
    Assignee: Ming Chi University of Technology
    Inventors: Kun-Cheng Peng, Chun-Ying Lee, Kuan-Ting Wu, Chen-Wei Chu, Yan-Chen Lin
  • Patent number: 11670663
    Abstract: The present disclosure, in some embodiments, relates to an image sensing integrated chip. The image sensing integrated chip includes a semiconductor substrate having sidewalls defining one or more trenches on opposing sides of a region of the semiconductor substrate. One or more dielectrics are disposed within the one or more trenches. The semiconductor substrate has a plurality of flat surfaces arranged between the one or more trenches. Adjacent ones of the plurality of flat surfaces define a plurality of triangular shaped protrusions and alternative ones of the plurality of flat surfaces are substantially parallel to one another, as viewed along a cross-sectional view.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: June 6, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tung-Ting Wu, Jhy-Jyi Sze, Yimin Huang
  • Publication number: 20230170696
    Abstract: A control device for controlling a power generation system comprises a reception module, for receiving environmental data from the power generation system; an environment generation module, coupled to the reception module, for generating an environment state of the power generation system according to the environment data and an environment model; a strategy generation module, coupled to the environment generation module, for generating a power of the power generation system according to the environmental state, and for generating a control strategy of the power generation system according to the power; a transmission module, coupled to the strategy generation module, for transmitting the control strategy to the power generation system.
    Type: Application
    Filed: January 10, 2022
    Publication date: June 1, 2023
    Applicant: National Cheng Kung University
    Inventors: Yueh-Heng Li, Yu-Ting Wu, Chao-Wei Huang, Wei-Cheng Lo, Hsun-Chen Hsieh, Po-Hung Lin, Yi-Heng Chen, Ping-Han Huang
  • Publication number: 20230170261
    Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.
    Type: Application
    Filed: February 1, 2023
    Publication date: June 1, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Kai Hsu, Ssu-I Fu, Chun-Ya Chiu, Chi-Ting Wu, Chin-Hung Chen, Yu-Hsiang Lin
  • Publication number: 20230171928
    Abstract: The present disclosure describes thermal modules having solder-free thermal bonds, methods of forming the thermal modules, and electronic devices that include the thermal modules. In one example, a thermal module having a solder-free thermal bond can include an assembly of a heat pipe and a heat sink mechanically connected to the heat pipe at a bonding junction area. The bonding junction area can include a gap between the heat pipe and the heat sink at a portion of the bonding junction area. A ther-mal coating composition can coat the assembly and fill the gap. The thermal coating composition can include a cured resin and thermally conductive particles.
    Type: Application
    Filed: April 10, 2020
    Publication date: June 1, 2023
    Inventors: CHI HAO CHANG, HENDRY HUANG, KUAN-TING WU