Abstract: This invention describes a packaging structure for roll-type (wound-type) aluminum conductive polymer capacitor element. Two protective substrates are applied to sandwich a roll-type capacitor element in between with an insulating material surrounding the capacitor element also in between the protective substrates. The protective substrates comprise electrically separated anodic conductive pad and cathodic conductive pad on their surfaces and through holes that pass through the conductive pads. The capacitor element is oriented with its axis perpendicular to the two substrates. The anodic and cathodic leads of the capacitor element pass through the through holes. An anodic external terminal is plated over the anodic conductive pad and a cathodic external terminal is plated over the cathodic conductive pad so that the anodic external terminal is electrically connected to the anodic lead and the cathodic external terminal is electrically connected to the cathodic lead.

Abstract: A system for providing wireless electrical stimulation to muscles and nerves for the treatment of medical and non-medical conditions. The electrical stimulation is delivered to the stimulated object (individual) by small neuromuscular electrical stimulation devices attached to wearable supports featuring electrically conductive material rendered on the inside and acting as electrodes. The control of the electrical stimulation devices is provided by a dedicated application running on a mobile device by means of a Bluetooth Low Energy interface.

Abstract: An aspect of the disclosure includes a communication system and a communication method using reconfigurable intelligent surface and a reconfigurable intelligent surface device. The communication system includes at least one base station, a reconfigurable intelligent surface device, and a control at one least device. The at least one base station respectively transmits at least one beam. The reconfigurable intelligent surface device is coupled to the at least one base station, and measures the at least one beam of the at least one base station to obtain signal measurement results associated with each of the at least one base station. The control device is coupled to the at least one base station. The control device groups the at least one base station and the reconfigurable intelligent surface device into at least one group according to the signal measurement results associated with each of the at least one base station.

Abstract: A computing task dispatching method, a terminal electronic device and a computing system using the same are provided. The computing task dispatching method includes the following steps. At least one terminal electronic device monitors a terminal hardware resource usage information of a plurality of sub-tasks. According to the terminal hardware resource usage information, a work dispatching decision is determined to dispatch the sub-tasks to the terminal electronic device or an edge server. The work dispatching decision is used to increase or maximize a utilization rate of the terminal electronic device. The work dispatching decisions is executed.

Abstract: A motion synchronized multi-tier pallet rack and a battery formation apparatus are provided. The pallet rack includes a fixation rack, two movable frames, and two actuators. The movable frames are coupled to two corresponding sides of the fixation rack and each includes telescopic arms, a motor, and a drive rod. The actuators are disposed on other the two corresponding sides of the fixation rack to drive the movable frames to move toward or away from each other. The telescopic arms are kinematically connected to the motor through the drive rod to extend from or retract into the movable frame. The battery formation apparatus includes a motion synchronized multi-tier pallet rack, a conveyor module, a formation cabinet, and a controller. The conveyor module carries a battery module. The controller controls the pallet rack to obtain the battery module from the conveyor module and place the battery module in the formation cabinet.

Abstract: A package structure is disclosed. The package structure includes a first substrate, a second substrate, a gap, and a directing structure. The second substrate is disposed under the first substrate. The gap is between the first substrate and the second substrate. The gap includes a first region and a second region. The first region is configured to accommodate a filling material. The directing structure is disposed in a flow path of the filling material and configured to reduce a migration of the filling material from the first region to the second region.

Abstract: A method for prelithiating a soft carbon negative electrode includes the steps of: disposing the soft carbon negative electrode and a lithium metal piece spaced apart from each other with a lithium-containing electrolyte present therebetween; prelithiating the soft carbon negative electrode at a first constant C-rate until a voltage thereof is reduced to a first predetermined voltage not greater than 0.3 V vs. Li/Li+, the first constant C-rate being not greater than 5 C; prelithiating the soft carbon negative electrode at a second constant C-rate until the voltage thereof is reduced to a second predetermined voltage lower than the first predetermined voltage, the second constant C-rate being not greater than 0.2 C and being less than the first constant C-rate; and prelithiating the soft carbon negative electrode at a prelithiation constant voltage which is not greater than the second predetermined voltage, thereby completing prelithiation of the soft carbon negative electrode.

Abstract: An angle sensing device includes a base, a rotation shaft, a detected target, and a proximity sensor. The rotation shaft is rotatably arranged on the base, and includes a side surface and a virtual axis. The detected target is arranged on the side surface, and an outer contour of a cross section of the detected target along a radial direction of the rotation shaft includes a first detected position and a second detected position, where a distance of the first detected position with respect to the virtual axis is different from that of the second detected position. The proximity sensor is fixedly arranged on the base and faces the detected target. When the detected target rotates together with the rotation shaft, the proximity sensor emits light toward the detected target and detects reflected light from the outer contour of the detected target to generate measurement data.

Abstract: An integrated substation is provided. The integrated substation includes a cabinet and at least one airflow driver. The cabinet has a high pressure room, a low pressure room, and an exchange room located between the high pressure room and the low pressure room. The exchange room and the high pressure room are separated from each other by a first inner wall, and the exchange room and the low pressure room are separated from each other by a second inner wall.

Abstract: An automated beverage preparation apparatus includes: multiple pumps for extracting multiple fluid materials stored in multiple material containers, and pushing the extracted fluid materials to move forward; a fluid output device coupled with the multiple pumps and arranged to operably dispense fluid materials to a beverage container; a user control interface arranged to operably generate a control command; a processing circuit arranged to operably generate a corresponding control signal according to the control command; and a pump control circuit arranged to operably control the multiple pumps according to the control signal. The pump control circuit conducts a layered drink making operation under control of the processing circuit to cause the fluid output device to dispense different fluid materials to the beverage container, so as to automatically form a layered drink/gradient drink having at least two color layers within the beverage container.

Abstract: A vehicle towing hitch including a U-shaped bracket structure and at least one vehicle receiving assembly is provided. The U-shaped bracket structure is mountable to a bicycle and includes a support plate and pair of opposing parallel arm plates. Each of the pair of opposing parallel arm plates have a fixing portion and supporting portion. Each of the fixing portion is configured to be fixed to a back end of the bicycle and each of the supporting portion and the support plate extend in a direction laterally beyond a length of the bicycle. The at least one vehicle receiving assembly is configured for receiving and securing one portion of at least one vehicle thereto. The at least one vehicle receiving assembly is attached to at least the support plate or one of the supporting portion of the pair of opposing parallel arm plates.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A three-dimensional (3D) scanning system includes a projector that generates an emitted light projected on an object, a reflected light being reflected from the object; a sensor that generates image data according to the reflected light; and a depth processor that generates depth data according to the image data and at least one modified factor representing corresponding deviation amount between the image data and an ideal image data due to a circle of confusion caused by the reflected light passing a lens of the sensor and then irradiating a sense plane of the sensor out of focus.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a die structure including a plurality of die regions and a plurality of first seal rings. Each of the plurality of first seal rings surrounds a corresponding die region of the plurality of die regions. The semiconductor device further includes a second seal ring surrounding the plurality of first seal rings and a plurality of connectors bonded to the die structure. Each of the plurality of connectors has an elongated plan-view shape. A long axis of the elongated plan-view shape of each of the plurality of connectors is oriented toward a center of the die structure.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: Gate-all-around integrated circuit structures having pre-spacer-deposition cut gates are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, and a second gate stack is over the second vertical arrangement of horizontal nanowires. An end of the second gate stack is spaced apart from an end of the first gate stack by a gap. The integrated circuit structure also includes a dielectric structure having a first portion forming a gate spacer along sidewalls of the first gate stack, a second portion forming a gate spacer along sidewalls of the second gate stack, and a third portion completely filling the gap, the third portion continuous with the first and second portions.

Abstract: A method for a clean procedure during manufacturing a semiconductor device, includes: providing a patterned sacrificial gate structure including a gate dielectric and a sacrificial layer; wherein the patterned sacrificial gate structure is embedded in a dielectric layer and an upper surface of the sacrificial layer is exposed; performing a first etching process to remove the sacrificial layer; and performing a hydrophilic treatment and a hydrophobic treatment to remove a residue of the sacrificial layer.

Abstract: Video processing methods and apparatuses in a video encoding or decoding system for transforming residuals of transform blocks into final transform coefficients or inverse transforming final transform coefficients into residuals. In order to solve the latency issue, exemplary embodiments check if a width or height of a coding block is larger than a predefined threshold, and disable secondary transform or inverse secondary transform for any transform block within the coding block if the width or height of the coding block is larger than the predefined threshold. Another embodiment checks if there are multiple transform blocks in a coding block, and disables secondary transform or inverse secondary transform if the coding block contains multiple transform blocks.

Abstract: An electronic device includes: a first light modulation assembly, including: a first substrate; a second substrate opposite to the first substrate; a first conductive layer disposed on the first substrate; a second conductive layer disposed on the second substrate; a first insulating layer disposed on the first substrate; and a first light modulation layer disposed between the first conductive layer and the second conductive layer.

Abstract: A package structure including a first die, a second die, an encapsulant, a dam structure, a light-transmitting sheet, a conductive connector, a circuit layer, and a conductive terminal is provided. The first die includes a first active surface. The first active surface has a sensing area. The second die is arranged such that a second back surface thereof faces the first die. The encapsulant covers the second die. The encapsulant has a first encapsulating surface and a second encapsulating surface. The dam structure is located on the first encapsulating surface and exposes the sensing area. The light-transmitting sheet is located on the dam structure. The conductive connector penetrates the encapsulant. The circuit layer is located on the second encapsulating surface. The first die is electrically connected to the second die through the conductive connector and the circuit layer. The conductive terminal is disposed on the circuit layer.