Abstract: A LED device includes multiple LED chips each including opposite first and second surfaces, a side surface, and an electrode assembly disposed on the second surface and including first and second electrodes. The first surface of each of the LED chips is a light exit surface. The LED device further includes an electric circuit layer assembly disposed on the second surfaces of the LED chips and having opposite first and second surfaces and a side surface. The first surface is electrically connected to the first and second electrodes. The LED device further includes an encapsulating layer enclosing the LED chips and the electric circuit layer assembly to expose the second surface of the electric circuit layer assembly.

Abstract: An LED device includes a substrate, a conductive layer, an LED chip, and a discharge element. The substrate has upper and lower surfaces and four edges interconnected to one another and surrounding the upper surface. The conductive layer is formed on the upper surface, and has first and second regions electrically separated by a trench. The trench has a first segment inclined relative to each edge of the substrate by a predetermined angle ranging between 0 and 90 degrees, and a second segment connected to the first segment. The LED chip is disposed across the first segment, and the discharge element is disposed across the second segment, both interconnecting the first and second regions.

Abstract: A method for use in a processing system includes receiving information regarding a work, where the information does not include a valid unified numbering system identifier that identifies a particular work of a plurality of works, and where the information includes one or more received attributes associated with the work. The method further includes obtaining a plurality of sets of attributes from one or more databases, which include a set of attributes associated with each work of the plurality of works. The method further includes determining whether a threshold number for a set of attributes of the plurality of sets of attributes matches corresponding ones of the one or more received attributes. When the threshold number does not match, the method further includes assigning a new unified numbering system identifier associated with the work and storing the new unified numbering system identifier in a database of the processing system.

Abstract: A method for promoting growth of a probiotic microorganism includes cultivating the probiotic microorganism in a growth medium containing a fermented culture of lactic acid bacterial strains that include Lactobacillus salivarius subsp. salicinius AP-32 deposited at the China Center for Type Culture Collection (CCTCC) under CCTCC M 2011127, Lactobacillus plantarum LPL28 deposited at the China General Microbiological Culture Collection Center (CGMCC) under CGMCC 17954, Lactobacillus acidophilus TYCA06 deposited at the CGMCC under CGMCC 15210, and Bifidobacterium longum subsp. infantis BLI-02 deposited at the CGMCC under CGMCC 15212.

Abstract: A power semiconductor device includes an epitaxial layer of a first conductivity type, a first doped region of a second conductivity type, a second doped region of the first conductivity type, a contact metal layer, a device electrode, a first termination electrode, and a second termination electrode. The epitaxial layer includes an active region and a termination region. The device electrode is located in a device trench in the active region, and is electrically isolated from the epitaxial layer and the contact metal layer. The first termination electrode is located in a first termination trench in the termination region and is electrically isolated from the epitaxial layer. The second termination electrode is located at a bottom of the first termination trench and is electrically isolated from the first termination electrode and the epitaxial layer. Both the first termination electrode and the second termination electrode are capable of being selectively floating.

Abstract: A lithography system includes an extreme ultraviolet (EUV) light source, a reticle stage, a reflection layer, and a plurality of light permeable protrusions. The EUV light source is configured for generating an EUV light beam. The reticle stage is configured for holding a reticle with a front surface of the reticle facing in a downward direction. The reflection layer is below the reticle stage. The light permeable protrusions are formed on the reflection layer. Each of the light permeable protrusions includes a bouncing surface facing in a direction that forms an acute angle with the downward direction. A first portion of the EUV light beam from the EUV light source passes through the bouncing surface of each of the light permeable protrusions to the reflection layer and is reflected to the reticle by the reflection layer.

Abstract: A foldable device may include a foldable layer and a hinge mechanism. The hinge mechanism may include a plurality of hinge segments, arranged in a plurality of rows, and with adjacent hinge segments being movably coupled so as to guide a folding and an unfolding motion of the foldable layer.

Abstract: A package includes first and second redistribution structures, a die, a permalloy structure, a molding material and a plurality of through vias. The first redistribution structure includes a first metal pattern. The die is disposed over the first redistribution structure. The molding material is disposed over the first redistribution structure and surrounds the die and the permalloy structure. The second redistribution structure is disposed over the die, the permalloy structure and the molding material, and includes a second metal pattern. The through vias penetrate the molding material and connects the first metal pattern to the second metal pattern. The permalloy structure includes a first member and a second member isolated from the first member, the first member and the second member are surrounded by the plurality of through vias and sandwiched between the first metal pattern and the second metal pattern. A method for forming a package is also provided.

Abstract: Methods and devices are provided herein for enhancing robustness of a bipolar electrostatic discharge (ESD) device. The robustness of a bipolar ESD device includes providing an emitter region and a collector region adjacent to the emitter region. An isolation structure is provided between the emitter region and the collector region. A ballasting characteristic at the isolation structure is modified by inserting at least one partition structure therein. Each partition structure extends substantially abreast at least one of the emitter and the collector regions.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive, while the UE is in an active session using a first radio access technology (RAT) associated with a first subscription of the UE, a call request via the first RAT, wherein the call request is associated with a second subscription of the UE. The UE may determine that the call request is received from a serving cell that is associated with fallback from the first RAT to a second RAT for calls. The UE may reject the call request or transition the second subscription to a third RAT based at least in part on the determination that the call request is received via the serving cell that is associated with fallback from the first RAT to the second RAT for calls. Numerous other aspects are described.

Abstract: A motor detection method includes the following steps. An excitation current command is provided to a motor device, and the motor device is driven to rotate at the first angle. The first feedback angle of the motor device in the first resting position is detected and obtained. The motor device is driven to rotate at the second angle according to the excitation current command. The second feedback angle of the motor device in the second resting position is detected and obtained. The magnetic pole offset angle of the motor device is calculated according to the first feedback angle and the second feedback angle.

Abstract: An automatic module switching system of a combined processing apparatus includes a chassis, a moving mechanism, a holding device, and multiple processing modules. The moving mechanism is driven to drive the holding device to move along a first moving direction and the holding device is driven to move along a second moving direction on the moving mechanism. The processing modules are detachably mounted onto the positioning sets of the hanging wall of the chassis and the holding device. The holding device drives the processing module thereon to move along a third moving direction. The combined processing apparatus can be scheduled to switch the processing modules automatically according user's needs, such that the combined processing apparatus can process in a manner that meets the user's needs. Cost for purchasing the plurality of processing machines can be saved and the problem of occupying much room can be also avoided.

Abstract: A circuit for preventing current backflow includes: a signal connection terminal, a power input terminal, an internal power supply terminal, an electrostatic protection circuit, a first switch element and a cut-off control circuit. The electrostatic protection circuit is coupled to the signal connection terminal and the internal power supply terminal. The first switch element is coupled between the power input terminal and the internal power supply terminal. The cut-off control circuit is coupled to the signal connection terminal, the power input terminal and the first switch element. The cut-off control circuit controls the switching of the first switch element according to a voltage of the signal connection terminal and a voltage of the power input terminal.

Abstract: An integrated circuit includes a photodetector. The photodetector includes one or more dielectric structures positioned in a trench in a semiconductor substrate. The photodetector includes a photosensitive material positioned in the trench and covering the one or more dielectric structures. A dielectric layer covers the photosensitive material. The photosensitive material has an index of refraction that is greater than the indices of refraction of the dielectric structures and the dielectric layer.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A hinge is connectable with two housing shells for permitting relative opening and closing of the housing shells, and includes a fixed seat, at least two rotating units, two lateral support plates and a center support plate. The rotating units are disposed at two sides of a centerline of the fixed seat and are connectable with the housing shells. The rotating units are shiftable between an open state and a closed state. Each rotating unit includes a linking member arcuately slidable on the fixed seat. The lateral support plates are mounted on the linking members, and have central notches. The center support plate is movably disposed on the fixed seat and is moved with the rotating units. In the open state, the center support plate is disposed in the central notches. In the closed state, the center support plate abuts against the fixed seat.

Abstract: The present application provides a display panel and a manufacturing method thereof. The display panel includes: a driving substrate, a plurality of chips, a dielectric layer, and a plurality of encapsulating colloids. Each of the plurality of chips and each of the plurality of encapsulating colloids are correspondingly arranged, and the encapsulating colloid covers the chip. The dielectric layer is disposed on outer peripheries of the encapsulating colloids. The encapsulating colloid includes a substrate and a curved lens connected to each other, the substrate covers the chip, and the curved lens is disposed on a side of the substrate away from the chip.

Abstract: A power apparatus includes a substrate, a first power circuit, and a second power circuit. The substrate includes a first metallization region, a second metallization region, and a third metallization region which are separated from each other. The first power circuit is electrically connected to the first metallization region and the third metallization region, and is arranged across the second metallization region and fails to be in contact with the second metallization region. The second power circuit is electrically connected to the second metallization region and the third metallization region, and fails to be in contact with the first metallization region.

Abstract: A method includes: training a machine learning model with a plurality of electronic circuit placement layouts; predicting, by the machine learning model, fix rates of design rule check (DRC) violations of a new electronic circuit placement layout; identifying hard-to-fix (HTF) DRC violations among the DRC violations based on the fix rates of the DRC violations of the new electronic circuit placement layout; and fixing, by an engineering change order (ECO) tool, the DRC violations.