Abstract: A technique provides an amphibious, submersible vehicle, which includes an electric drive and is capable of operating both on land and in water. The vehicle includes a water-tight compartment that houses batteries and a set of electric motors for propelling the vehicle using tracks on land and on a subsea floor. The vehicle is further capable of propelling itself through water, using the tracks and/or a set of thrusters powered by the batteries.

Abstract: An absorbent article includes a first waist region, a second waist region, and a crotch region disposed between the first and second waist regions; and a chassis having a topsheet, a backsheet, and an absorbent core positioned between the topsheet and the backsheet. The article also includes a side panel having an ultrasonically bonded, gathered laminate. The laminate has an elastomeric layer and a substrate and is joined to the chassis at a chassis attachment bond and positioned in one of the first or second waist regions. The ultrasonically bonded, gathered laminate also includes an ear structural feature comprising a surface modification to the substrate and comprising at least one of the following: embossing, apertures, perforations, slits, melted material or coatings, compressed material, secondary bonds that are disposed apart from a chassis attachment bond, plastic deformation, and folds.

Abstract: A method and a non-transitory computer readable medium having instructions stored thereon to cause one or more processors to perform a method are provided. Responsive to receiving a call to a predefined emergency number from a user device, an emergency state of the user device is forced. The forcing of the emergency state includes causing the user device to enable all radios in the user device, including any of cellular technology, Wi-Fi technology, and Bluetooth technology, to determine a location of the user device by use of remote radios and antennas at known locations in an RF distributions platform. First information associated with the user device is obtained, wherein the first information includes location information corresponding to the location of the user device. The first information is pushed to a public safety answering point.

Abstract: Systems for improvising sensorimotor function of a patient, wherein the various systems can include at least one force and/or pressure sensor associated with at least one lower limb or prosthesis of the patient, at least one motion and/or angle sensor associated with at least one lower limb or prosthesis of the patient, a processor configured to receive force and/or pressure signals and motion and/or angle signals and generate an estimated center of pressure and a center of gravity, and generate balance stimulation signals based on the estimated center of pressure and the center of gravity, and at least one sensory stimulation unit disposed on at least one lower limb or prosthesis of the patient, wherein the at least one sensory stimulation unit comprises at least two stimulators that are actuable to provide stimulation to the patient based on the balance stimulation signals.

Abstract: A broadband switch includes multi-stage electromechanical ganged stage relays. The ganged stage relays provide at least 65 dB of electrical isolation from active broadband input or active broadband output to all non-active broadband inputs. In a further aspect, the ganged stage relays provide at least 100 dB of electrical isolation from 1 kHz to 100 MHz from broadband inputs and broadband output to power inputs.

Abstract: A method for pooling resources in a mobile network includes allocating baseband resources between a plurality of virtual baseband engines supporting the mobile network, determining a change in a usage of the mobile network, and re-allocating, in response to the change in the usage of the mobile network, the baseband resources between the plurality of virtual baseband engines.

Abstract: A circuit board including: a first board material layer having a first planar surface and a first sidewall surface perpendicular to the first planar surface; a first conductive layer on the first planar surface; a second board material layer stacked on the first board material layer and having a second planar surface and a second sidewall surface perpendicular to the second planar surface; a second conductive layer on the second planar surface; and a plating on the first sidewall surface and the second sidewall surface and electrically connecting the first conductive layer and the second conductive layer.

Abstract: A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.

Abstract: A power converter with co-packaged secondary field effect transistors (FETs) are described. The power converter can include a first circuit, a transformer connected to an output of the first circuit, and a second circuit connected to an output of the transformer. The second circuit can include an inductor, a first FET coupled between the transformer and the inductor, and a second FET coupled between the first FET and ground. The first FET and the second FET can be co-packaged as a single package.

Abstract: A server drawer comprising a plurality of Printed Circuit Boards (PCBs) respectively containing heat-generating electronic devices. The server drawer further comprises a plurality of fans configured to convectively dissipate heat from the heat-generating electronic devices. The server drawer further comprises internal partitions isolating airflow between respective PCBs of the plurality of PCBs.

Abstract: An apparatus comprising chips mounted to a substrate, wherein one or more of the chips comprises a first height and one or more of the chips comprises a second height, wherein the first height is taller than the second height. A cold plate located above the plurality of chips, wherein the cold plate includes a bottom wall and a top wall, wherein the cold plate includes a plurality of cooling fins that are attached to the bottom wall of the cold plate, wherein the cold plate accommodates the plurality of chips, wherein the chips includes chips having the first height and the second height.

Abstract: A structure is provided for a structure for providing electrical connections across a connection interface is provided. The structure may include one or more signal connections, a plurality of reference connections, and one or more high-pass filters. One or more of the reference connections is configured to connect a first reference voltage in a first region on a first side of the interface with a second reference voltage in a second region on a second side of the interface. One or more of the reference connections in a first class of reference connections is coupled one or more of the reference voltages through the one or more high-pass filters, and low-bandwidth information is communicated across the one or more reference connections in the first class of reference connection.

Abstract: A passive circuit element is disclosed. The passive circuit element includes an array of conductive pads arranged on a substrate such that a gap is formed between each of the conductive pads. The passive circuit element further includes a first wire electrically connected to a first conductive pad of the array of conductive pads such that the first wire passes through a first gap formed between a second conductive pad and a third conductive pad. The passive circuit element further includes a second wire electrically connected to a fourth conductive pad of the array of conductive pads such that the second wire passes through the first gap. At least one of the second and third conductive pads has a substantially planar side facing toward the first gap.

Abstract: A server drawer comprising a plurality of Printed Circuit Boards (PCBs) respectively containing heat-generating electronic devices. The server drawer further comprises a plurality of fans configured to convectively dissipate heat from the heat-generating electronic devices. The server drawer further comprises internal partitions isolating airflow between respective PCBs of the plurality of PCBs.

Abstract: A structure is provided for a structure for providing electrical connections across a connection interface is provided. The structure may include one or more signal connections, a plurality of reference connections, and one or more high-pass filters. One or more of the reference connections is configured to connect a first reference voltage in a first region on a first side of the interface with a second reference voltage in a second region on a second side of the interface. One or more of the reference connections in a first class of reference connections is coupled one or more of the reference voltages through the one or more high-pass filters, and low-bandwidth information is communicated across the one or more reference connections in the first class of reference connection.

Abstract: An integrated circuit package provides a high bandwidth interconnect between wafers using a very high density interconnect using a silicon bridge or a multi-layer flex between wafers. In some embodiments, more than one wafer may be mounted and connected with a rigid silicon bridge onto a common substrate. This common substrate can be matched, with respect to their coefficients of thermal expansion (CTE), to the silicon wafer. The CTE matched substrate can reduce the thermal mechanical stress on the wafers and the rigid silicon bridge interconnect. In some embodiments, a thinned silicon bridge is utilized to interconnect wafers which are mounted on separate glass substrates. The thinned bridge would allow for mechanical compliance between the wafers. In some embodiments, the wafers can be mounted onto separate glass substrates and attached with a fine pitch multi-layer flex structure which provides compliance between the wafers.

Abstract: A system and method for supporting an interconnection of processor cores, each core with functional state monitors for monitoring operations of each processor core, the processor cores interconnected using a resistive network connected between two-terminal regions being embedded in the resistive network such that each terminal of a region may be connected by controllable resistors to one or both fixed rails or by controllable resistors to one or more intermediate nodes. The resistor values are configurable to provide indirect control of the voltages across each two-terminal region, allowing full dynamic control of voltages of the two-terminal regions in a range up to the full voltage between the two voltage rails, and where a management unit accesses the functional state monitors and controls the resistor values. Feedback from functional state monitors allow the operating frequency to extend down to arbitrarily low values and up to the limits imposed by the technology.

Abstract: A semiconductor package provides a low profile connection to a bottom side of the semi-conductor package. The semi-conductor package includes a computer processor die and a substrate. The computer processor die is mounted on to a top surface of the substrate. The substrate is mounted on to a printed circuit board. A voltage regulator is coupled to the printed circuit board. A top surface of the voltage regulator is coupled to a bottom surface of the substrate. The package also includes a connector device. The connector device includes a cable configured to conduct power from an upstream source, and a low-profile connector module attached to an end of the cable. The connector module is configured to interface to a bottom surface of the voltage regulator.

Abstract: Systems, computer program products, and methods are described herein for the generation of an interface for upload and remote acceptance of a data file. The present invention may be configured to receive a request from a user to transfer resources associated with a document and certain user information from the user device. The document and/or the user may be associated with a supporting document. The present invention may be further configured to generate an interface comprising a triggered prompt for resource information, a triggered prompt for one or more data files containing the document, and a triggered prompt for one or more data files containing the supporting document. The present invention may be further configured to generate a request folder associated with the request. The request folder may contain the resource information, user information, the data files associated containing the document, and the data files containing the supporting document.

Abstract: A method includes attaching an integrated circuit chip module substrate to a printed circuit board (PCB). First region(s) of a bottom surface of the module include electrical contacts to the board, and second region(s) of the bottom surface of the module lack such contacts. Mechanical structures are assembled into the second regions. These structures allow lateral motion of the module relative to the board, and are sized and placed to inhibit bending of the second regions of the module towards the board under application of a vertical force on a top surface of the module. A package for an integrated circuit may be assembled using the method.