Abstract: Systems, computer program products, and methods are described herein for the generation of an interface for upload and remote acceptance of a data file. The present invention may be configured to receive a request from a user to transfer resources associated with a document and certain user information from the user device. The document and/or the user may be associated with a supporting document. The present invention may be further configured to generate an interface comprising a triggered prompt for resource information, a triggered prompt for one or more data files containing the document, and a triggered prompt for one or more data files containing the supporting document. The present invention may be further configured to generate a request folder associated with the request. The request folder may contain the resource information, user information, the data files associated containing the document, and the data files containing the supporting document.

Abstract: A method includes attaching an integrated circuit chip module substrate to a printed circuit board (PCB). First region(s) of a bottom surface of the module include electrical contacts to the board, and second region(s) of the bottom surface of the module lack such contacts. Mechanical structures are assembled into the second regions. These structures allow lateral motion of the module relative to the board, and are sized and placed to inhibit bending of the second regions of the module towards the board under application of a vertical force on a top surface of the module. A package for an integrated circuit may be assembled using the method.

Abstract: In an apparatus for coupling integrated circuits to printed circuit boards, a backing plate with manufactured features on the top surface includes a module lid; a planar structure; a device seated in the planar structure, with the module lid in contact with the top surface of the device; and a backing plate that contains manufactured features on one side. The backing plate is in contact with the planar structure, and a plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.

Abstract: A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.

Abstract: In order to reduce the number of instructions that the compiler generates to load the address of a global variable into a register, the compiler uses a technique that analyzes the global variables used in each function in order to estimate which global variables will be located within the same memory page and have a common base address. A base global variable is selected for each function whose address is fully resolved. The address of each subsequent global variable is constructed using an offset relative to the address of the base global variable that is based on the subsequent global variable's position in a global variable order list.

Abstract: An apparatus comprising chips mounted to a substrate, wherein one or more of the chips comprises a first height and one or more of the chips comprises a second height, wherein the first height is taller than the second height. A cold plate located above the plurality of chips, wherein the cold plate includes a bottom wall and a top wall, wherein the cold plate includes a plurality of cooling fins that are attached to the bottom wall of the cold plate, wherein the cold plate accommodates the plurality of chips, wherein the chips includes chips having the first height and the second height.

Abstract: Embodiment of the present invention includes a magnetic structure and a magnetic structure used in a direct current (DC) to DC energy converter. The magnetic structure has an E-core and a plate, with the plate positioned in contact or in near contact with the post surfaces of the E-core. The E-core has a base, a no-winding leg, a transformer leg, and an inductor leg. The no-winding leg, the transformer leg, and the inductor leg are perpendicular and magnetically in contact with the base. The plate is a flat slab with lateral dimensions generally larger than its thickness. The plate has a plate nose that overlaps a top no-winding leg surface of the no-winding leg with a no-winding gap area to form a no-winding gap with a no-winding gap reluctance. The plate also has a plate end that overlaps a top inductor leg surface of the inductor leg with an inductor gap area to form an inductor gap with an inductor gap reluctance. In some embodiments, e.g.

Abstract: An apparatus includes a cabinet; an air-mover attached to the cabinet; a circuit board mounted in the cabinet; and an air-cooled heat sink attached in thermal contact with a heat-generating component on the circuit board. The heat sink includes a heat sink base; primary heat removal fins protruding from the heat sink base in a direction away from the circuit board; and secondary heat removal fins protruding from the heat sink base in a direction toward the circuit board. The air-mover is configured to force air between the primary heat removal fins and between the secondary heat removal fins.

Abstract: Embodiment of the present invention includes a magnetic structure and a magnetic structure used in a direct current (DC) to DC energy converter. The magnetic structure has an E-core and a plate, with the plate positioned in contact or in near contact with the post surfaces of the E-core. The E-core has a base, a no-winding leg, a transformer leg, and an inductor leg. The no-winding leg, the transformer leg, and the inductor leg are perpendicular and magnetically in contact with the base. The plate is a flat slab with lateral dimensions generally larger than its thickness. The plate has a plate nose that overlaps a top no-winding leg surface of the no-winding leg with a no-winding gap area to form a no-winding gap with a no-winding gap reluctance. The plate also has a plate end that overlaps a top inductor leg surface of the inductor leg with an inductor gap area to form an inductor gap with an inductor gap reluctance. In some embodiments, e.g.

Abstract: In order to reduce the number of instructions that the compiler generates to load the address of a global variable into a register, the compiler uses a technique that analyzes the global variables used in each function in order to estimate which global variables will be located within the same memory page and have a common base address. A base global variable is selected for each function whose address is fully resolved. The address of each subsequent global variable is constructed using an offset relative to the address of the base global variable that is based on the subsequent global variable's position in a global variable order list.

Abstract: The structure includes a semiconductor chip connected to a substrate via one or more solder balls. The semiconductor chip includes one or more on-chip metal winding. The structure includes a first ferromagnetic core. The first ferromagnetic core is located below the semiconductor chip and above the substrate. The structure includes a second ferromagnetic core. The second ferromagnetic core is located above the semiconductor chip. The first ferromagnetic core and the second ferromagnetic core create a magnetic loop.

Abstract: The semiconductor structure includes a semiconductor-on-insulator (SOI) substrate. A group III nitride transistor is formed in a trench in the SOI substrate. The activation of the group III nitride transistor is controlled by a silicon-based transistor. The silicon-based transistor that includes a portion of a silicon layer of the SOI substrate. A group III nitride transistor device is adjacent to the silicon-based transistor.

Abstract: A cold plate apparatus includes a top wall and a bottom wall that enclose a plenum for fluid flow; an inlet and an outlet each formed in one of the top wall or the bottom wall; a first active area within the plenum; a second active area within the plenum; and a partition that extends between the top wall and the bottom wall within the plenum and that separates the first active area from the second active area so that a portion of fluid flowing from the inlet to the outlet through the plenum flows through either the first active area or the second active area but not through both active areas.

Abstract: An approach for reducing unwanted magnetic coupling with conductive elements by keeping the localized magnetic field in a transformer's or inductors magnetic gap far away from any conductive elements is provided. The approach includes the use of spacers to keep the localized magnetic field in a transformer's or inductor's magnetic gap far away from any conductive elements to reduce unwanted magnetic coupling with those conductive elements. The spacers can be made from materials including ferrite, conductors and non-conducting elements.

Abstract: In order to reduce the number of instructions that the compiler generates to load the address of a global variable into a register, the compiler uses a technique that analyzes the global variables used in each function in order to estimate which global variables will be located within the same memory page and having a common base address. A base global variable is selected for each function whose address is fully resolved. The address of each subsequent global variable is constructed using an offset relative to the address of the base global variable that is based on the subsequent global variable's position in a global variable order list.

Abstract: An oval-shaped T-nut that is received within an oval receiver machined into the upholstered panel to be secured to a chair frame is provided. The oval shape of the T-nut prevents the oval-shaped T-nut from rotating when a screw is driven into the T-nut. Further, this eliminates the necessity of stapling the traditional plastic T-nut to the chair panel, thus saving time and money associated with the manufacture of an upholstered metal frame chair. In addition to the oval-shaped T-nut described herein, a novel U-shaped screw catch is also provided which cooperates with a barbed nylon or plastic push rivet to secure the upholstered chair panels to one another. Further, a method for connecting upholstered seat back panels to the tabs positioned on the back frame of a chair, utilizing the T-nut and the screw catch is disclosed.

Abstract: A system and method for accurately estimating engine noise at a virtual microphone location, such as an occupant's ear position, in an acoustic space in order to enhance performance of an Engine Order Cancellation (EOC) system is provided. A set of weights and transfer functions that are dependent on various vehicle parameters, such as frequency, load, and speed, may be employed to estimate noise at a position where there are no physical microphones present. The accurate estimation of engine noise at virtual location, such as an occupant's ear position, may be achieved using a frequency dependent weighted sum of filtered and unfiltered error signals measured at microphones mounted at various locations inside an acoustic space, such as a vehicle cabin, which may not be located near virtual location.

Abstract: A cold plate apparatus includes a top wall and a bottom wall that enclose a plenum for fluid flow; an inlet and an outlet each formed in one of the top wall or the bottom wall; a first active area within the plenum; a second active area within the plenum; and a partition that extends between the top wall and the bottom wall within the plenum and that separates the first active area from the second active area so that a portion of fluid flowing from the inlet to the outlet through the plenum flows through either the first active area or the second active area but not through both active areas.

Abstract: A method for pooling resources in a mobile network includes allocating baseband resources between a plurality of virtual baseband engines supporting the mobile network, determining a change in a usage of the mobile network, and re-allocating, in response to the change in the usage of the mobile network, the baseband resources between the plurality of virtual baseband engines.

Abstract: A power converter with co-packaged secondary field effect transistors (FETs) are described. The power converter can include a first circuit, a transformer connected to an output of the first circuit, and a second circuit connected to an output of the transformer. The second circuit can include an inductor, a first FET coupled between the transformer and the inductor, and a second FET coupled between the first FET and ground. The first FET and the second FET can be co-packaged as a single package.