Abstract: A semiconductor device 10 according to the present invention includes an active layer 14 supported on a substrate 11 and having two channel regions 14c1, 14c2, a source region 14s, a drain region 14d, and an intermediate region 14m formed between the two channel regions 14c1, 14c2; a contact layer 16 having a source contact region 16s, a drain contact region 16d, and an intermediate contact region 16m; a source electrode 18s; a drain electrode 18d; an intermediate electrode 18m; and a gate electrode 12 facing the two channel regions and the intermediate region through a gate insulating film 13 interposed therebetween. An entire portion of the intermediate electrode 18m that is located between the first channel region 14c1 and the second channel region 14c2 overlaps the gate electrode 12 through the intermediate region 14m and the gate insulating film 13.

Abstract: An apparatus for manufacturing a display panel includes a pair of pressing jigs respectively having pressing surfaces that overlap each other. A pair of film substrates, each having a display region defined thereon, are molded into a curved shape by holding the pair of film substrates between the respective pressing surfaces of the pair of pressing jigs so that the respective display regions overlap each other with a sealant, which is positioned around the display regions between the pair of film substrates, being interposed therebetween, and at least one pressing jig of the pair of pressing jigs has multiple pressing surfaces, which have different radii of curvature from each other, and are switchable with each other.

Abstract: A liquid crystal display panel manufacturing apparatus for successively bonding a pair of film substrates, each having a plurality of display regions defined at least along a longitudinal direction, along the longitudinal direction through a sealant formed in every display region of one of the film substrates includes: a first processing unit arranged to form a bonded body by bonding the film substrates so that the respective display regions are superimposed on each other; and a second processing unit including a molding roll configured to hold the bonded body formed in the first processing unit onto a peripheral wall thereof, and arranged to mold the bonded body into a curved shape along the peripheral wall of the molding roll by curing the sealant while holding the bonded body on the peripheral wall of the molding roll.

Abstract: An apparatus for manufacturing a display panel includes a pair of pressing jigs respectively having pressing surfaces that overlap each other. A pair of film substrates, each having a display region defined thereon, are molded into a curved shape by holding the pair of film substrates between the respective pressing surfaces of the pair of pressing jigs so that the respective display regions overlap each other with a sealant, which is positioned around the display regions between the pair of film substrates, being interposed therebetween, and at least one pressing jig of the pair of pressing jigs has multiple pressing surfaces, which have different radii of curvature from each other, and are switchable with each other.

Abstract: A baking apparatus includes a baking chamber and a plurality of guide rolls provided inside the baking chamber so that their respective rotation shafts extend parallel or substantially parallel to each other. The baking apparatus bakes a thin film on a film substrate contained in the baking chamber, while sequentially passing the film substrate to the plurality of guide rolls. The plurality of guide rolls are arranged in a spiral manner in the order that the film substrate is passed.

Abstract: In a method for manufacturing a liquid crystal display panel, a sealant having a cut-out formed at least on the other end side of a display region is provided on one film substrate. A liquid crystal material is supplied to one end side of the display region in the one film substrate or the other film substrate. An apparatus for manufacturing a liquid crystal display panel includes a bonding unit arranged to bond the pair of film substrates to each other through the sealant and the liquid crystal material by pressing respective surfaces of the film substrates so that a pressure in a middle of the film substrates becomes higher than that at both ends thereof, and a sealing unit arranged to seal the cut-out of the sealant to the pair of film substrates bonded in the bonding unit.

Abstract: The multilayer wiring board is provided with a lower layer wiring (8), and an upper layer wiring (10) formed on the lower layer wiring (8) through an interlayer insulating layer (9). On the interlayer insulating layer (9), a contact hole (11) is provided for interconnecting the upper layer wiring (8) with the lower layer wiring (10). A region surrounded by an inner wall (13) which forms the contact hole (11) is permitted to have a linewidth region wherein a wide line region (13A) and protruding regions (13B, 13C) as regions having different linewidths are connected. Thus, film thickness distribution of an ink baked product (12) formed at the contact hole (11) rises at the protruding regions (13B, 13C), and highly reliable multilayer interconnection can be performed between the lower layer wiring (8) and the upper layer wiring (10).

Abstract: A display device includes a plurality of spacer rows that are provided outside a display region on one of a pair of substrates, and each of the spacer rows is defined by a plurality of spacers arranged in a row at predetermined intervals along an outer edge of the display region. Each spacer has a substantially elongated shape extending along the outer edge of the display region. A gap between adjacent spacers in each spacer row is defined by a slit portion having a shorter length than a longitudinal length of the spacer, and the plurality of spacer rows are entirely covered by the seal member between the pair of substrates.