Abstract: A storage device in which file data is divided into multiple blocks for storage on a recording medium. The storage device includes an additional data storing section for storing additional data to be recorded on the recording medium in association with the data to be written, a position determining section for determining recording positions on the recording medium where the blocks should be respectively written, based on the additional data, and a block writing section for writing the respective blocks on the recording positions on the recording medium determined by the recording position determining section. The additional data thus defines a gap length between blocks of recorded data. During a read operation, if the gap length does not comport with the additional data, then an error is assumed.

Abstract: In a tape drive system performing read/write operations on a tape by inserting a tape cartridge into a tape drive, the tape cartridge having a tape on which servo and data tracks are arranged longitudinally and a predetermined servo pattern is recorded on each of the servo tracks, a method and system for re-setting coefficients of a low-pass filter for servo control of the tape drive, each time the tape cartridge is inserted into the tape drive so that a servo system of the tape drive is stabilized. More specifically, the servo pattern is read from the tape in the cartridge inserted into the tape drive, frequency analysis for the read servo pattern is performed, a singularity that exceeds a predetermined spectrum range is detected from frequency components obtained by the frequency analysis, and the coefficients of the low-pass filter are set so as to cancel a power spectrum of the singularity.

Abstract: A method of adjusting a magnetic head of the invention includes the steps of: setting a cleaning cartridge into a drive unit; identifying the set cartridge as the cleaning cartridge by checking a cleaning bit in a non-volatile memory; performing an adjustment-operation after a cleaning operation when the set cartridge is identified as the cleaning cartridge; and reading out a pattern signal from a predetermined segment of the magnetic tape held in the cleaning cartridge.

Abstract: A wrap test for a communication interface unit used for a computer, etc. When a wrap tool 40 is connected to a SCSI device 10, a signal (TEMPWR) is output from an output device 38 to SCSI connectors 22 and 24 through a Y-type cable 14, then wrapped in the wrap tool 40 and returned to a SCSI controller 12 through resistors 28 and 30 as a signal (PSCSIWRAP) to recognize the wrap tool 40. Because the non-grounded end of a resistor 26 is connected to an input terminal of the SCSI controller 12, the resistors 28 and 30 are connected in parallel. The potential of the signal (PSCSIWRAP) is stabilized by the resistors 26, 28 and 30. If a single wrap tool is connected to the SCSI device 10, the potential of the signal (PSCSIWRAP) is stabilized by the resistors 26 and 28 or 30.

Abstract: Provided are melt-spun fibers comprising, as at least one component, a water-soluble polyvinyl alcohol, and a method for producing fibrous structures comprising the fibers. The thermoplastic polyvinyl alcohol fibers comprise, as at least one component, a water-soluble polyvinyl alcohol containing from 0.1 to 25 mol % of C1-4 &agr;-olefin units and/or vinyl ether units, having a molar fraction, based on vinyl alcohol units, of a hydroxyl group of vinyl alcohol unit located at the center of 3 successive vinyl alcohol unit chain in terms of triad expression of being from 70 to 99.9 mol %, having a carboxylic acid and lactone ring content of from 0.02 to 0.15 mol %, and having a melting point falling between 160° C. and 230° C., and contain from 0.0003 to 1 part by weight, relative to 100 parts by weight of the polyvinyl alcohol therein and in terms of sodium ion, of an alkali metal ion.

Abstract: A wrap test for a communication interface unit used for a computer, etc. When a wrap tool 40 is connected to a SCSI device 10, a signal (TEMPWR) is output from an output device 38 to SCSI connectors 22 and 24 through a Y-type cable 14, then wrapped in the wrap tool 40 and returned to a SCSI controller 12 through resistors 28 and 30 as a signal (PSCSIWRAP) so as to recognize the wrap tool 40. Because the other end of a resistor 26 whose one end is grounded is connected to an input terminal of the SCSI controller 12, the resistors 28 and 30 are connected in parallel. The potential of the signal (PSCSIWRAP) is stabilized by the resistors 26, 28, and 30. If a single wrap tool is connected to the SCSI device 10, the potential of the signal (PSCSIWRAP) is stabilized by the resistors 26 and 28 or 30. This can thus be removed.

Abstract: In a tape drive system performing read/write operations on a tape by inserting a tape cartridge into a tape drive, the tape cartridge having a tape on which servo and data tracks are arranged longitudinally and a predetermined servo pattern is recorded on each of the servo tracks, a method and system for re-setting coefficients of a low-pass filter for servo control of the tape drive, each time the tape cartridge is inserted into the tape drive so that a servo system of the tape drive is stabilized. More specifically, the servo pattern is read from the tape in the cartridge inserted into the tape drive, frequency analysis for the read servo pattern is performed, a singularity that exceeds a predetermined spectrum range is detected from frequency components obtained by the frequency analysis, and the coefficients of the low-pass filter are set so as to cancel a power spectrum of the singularity.

Abstract: When a testing system is connected to a debug port of a tape drive unit or a SCSI bus, a self-checking test for a fabricating process is executed. When the testing system is not connected, the self-checking test for normal operation is executed. And in a test of a single card, a motor test and an MR head resistance test, which are tests of a mechanical structure portion, are omitted. In addition, in a box assembling process, the test contents are suppressed to a minimum prior to adjustments to the tape head. Furthermore, in a test program, the status of a flag or an indication corresponding to a test executed in a next step is changed.

Abstract: Provided is a system to reduce the force required for inserting a circuit board assembly including a plurality of circuit boards into the card edge connectors. A circuit board assembly includes a first circuit board, a second circuit board and a coupling part. The first circuit board includes printed circuit elements and a connecting part. In the same manner as the first circuit board, the second circuit board includes printed circuit elements and a connecting part. The front edge of the connecting parts are shifted from the front edge of the other connecting part by a distance “d” along the connecting or inserting direction of the circuit boards toward the card edge connectors, so that the distance between the front edge of the connecting part of the first circuit board and the first card edge connector differs from the distance between the front edge of the connecting part of the second circuit board and the second card edge connector.

Abstract: An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.

Abstract: An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.

Abstract: In a lead frame flash removing method and apparatus, a lead frame is molded integrally with a case. After molding, abrasive agent-mixed water is sprayed to a surface of the lead frame where a flash is formed. The lead frame is dipped in an electrolytic solution and applying a DC voltage is applied across the lead frame and an electrode in the electrolytic solution, thereby electrolytically processing the lead frame. After the electrolytic process, an external force is applied to the surface of the lead frame, thereby removing the flash.

Abstract: The present invention is directed to a rough rolling mill for rolling a slab of material into a rough bar through a hot rolling process. The rolling mill reduces material temperature drop thereby preventing a decrease in productivity. The rolling mill train for producing a rough bar from a slab of material has at least two close mill couples at an outlet side thereof. Each close mill couple is composed of two rolling mills arranged in tandem close to one another to roll the material. The at least two close mill couples are arranged so that the material being rolled is not acted upon by adjacent close mill couples at the same time.

Abstract: A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it snd the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.

Abstract: A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.

Abstract: An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.

Abstract: A semiconductor device includes a square pellet, a gate electrode pad, a drain electrode pad, a pair of source electrode pads, and a source electrode path. The pellet has first and second diagonal lines. The gate electrode pad is arranged on one of two corners located on the first diagonal line on the pellet. The drain electrode pad is arranged on the other of the two corners located on the first diagonal line on the pellet. The pair of source electrode pads are arranged on two corners located on the second diagonal line on the pellet. The source electrode path connects the source electrode pads to each other.

Abstract: The apparatus is formed by confronting wide side mold walls and confronting narrow side mold walls, The narrow side mold walls are composed of an electrically conductive refractory material and are directly heated. Each of the narrow side mold walls include an upper squeezed portion and a lower parallel portion, The upper squeezed portion has a surface in contact with the molten metal which converges in width along a casting direction. The lower parallel portion has surface in contact with the molten metal which is substantially uniform in width.

Abstract: The integrated manufacturing system is formed by the combination of a continuous casting apparatus and hot rolling mills. The continuous casting apparatus is formed by confronting wide side mold walls and confronting narrow side mold walls. The narrow side mold walls are composed of an electrically conductive refractory material and are directly heated. Each of the narrow side mold walls include an upper squeezed portion and a lower parallel portion. The upper squeezed portion has a surface in contact with the molten metal which converges in width along a casting direction. The lower parallel portion has a surface in contact with the molten metal which is substantially uniform in width.

Abstract: A coarse position sensor is provided for an optical recording device to generate a substantially linear coarse position signal, indicative of the position of a coarse carriage along the range of its travel, and which also is substantially immune to environmental and device variations. The sensor includes a light source mounted to a drive frame at one end of the range of travel, a position sensitive device fixed to the frame at the opposite end of the range of travel and facing the light source, and a deflecting optical element mounted to the coarse carriage in the path of the light. As the coarse carriage travels along its stroke between the inner and outer diameters of the optical disk, the amount of deflection of the light beam on the position sensitive device from a reference location will change.