Abstract: A first equalizer generates a vibration-component signal indicating the amount of movement of an image pickup apparatus according to an output signal of a vibration detecting element for detecting the vibration of the image pickup apparatus. The second equalizer generates a drive signal used to control a driver element to correct the position of lens and image pickup devices, based on the output signal of a position detecting element for detecting the position of the lens to be driven or the image pickup devices to be driven and the vibration-component signal. A verifying-signal input circuit inputs a signal used for verification, to the first equalizer. A control unit verifies the operations of the driver element, the position detecting element and the first equalizer.

Abstract: The accuracy of servo control of a corrective lens in an image stabilization control circuit is prevented from decreasing due to non-linear characteristics of a position-detecting element. A signal representing a component of vibration of an image pickup apparatus is generated based on an angular velocity signal from a vibration-detecting element. A microcomputer corrects the vibration component signal according to a predetermined correction function and generates a target position signal representing a target position of the lens. A position-detection signal based on an output from the position-detecting element is compared with the target position signal, and the position of the lens is servo-controlled. The correction function is set so that the characteristics of variation of the target position signal relative to the target position will be the same as the characteristics of variation of the position-detection signal relative to the actual position of the lens.

Abstract: An efficient logic chip operating power supply having digital circuits in a multi-chip package is provided. A multi-chip package semiconductor device fabricated in common with a driver chip having analog circuits and a logic chip having digital circuits, a logic chip power supply circuit is provided in which a driver chip creates a logic chip power supply dedicated for the logic chip. The logic chip has internal logic circuitry operating by receiving a power supply from the logic chip power supply circuit via power input terminals.

Abstract: In a vibration correction control circuit mounted on an image pickup apparatus including an image pickup unit, provided with lenses, image pickup devices and vibration detecting element, and a driver element for adjusting the position of the image pickup unit, the equalizer generates a drive signal used to move the image pickup unit in a direction along which to reduce the vibration applied to the image pickup unit, based on the output signal of the vibration detecting element. A verifying-signal input circuit supplies a dummy vibration-component signal to the equalizer.

Abstract: A stepping motor includes two coils and has supply currents to the two coils with different phases so that a rotor is rotated by the two coils. During a period where one coil is in a high impedance state, an induced voltage generated at that coil is detected. An output control circuit controls the magnitude of motor drive current supplied to the two coils in accordance with the detected induced voltage state. Then, prior to entering the high impedance state from the drive state, a short-circuit period is provided for short circuiting both terminals of the coil.

Abstract: A first equalizer generates a vibration-component signal indicating the amount of movement of an image pickup apparatus according to an output signal of a vibration detecting element for detecting the vibration of the image pickup apparatus. The second equalizer generates a drive signal used to control a driver element to correct the position of lens and image pickup devices, based on the output signal of a position detecting element for detecting the position of the lens to be driven or the image pickup devices to be driven and the vibration-component signal. A verifying-signal input circuit inputs a signal used for verification, to the first equalizer. A control unit verifies the operations of the driver element, the position detecting element and the first equalizer.

Abstract: A first equalizer generates a vibration-component signal indicating the amount of movement of an image pickup apparatus according to an output signal of a vibration detecting element for detecting the vibration of the image pickup apparatus. The second equalizer generates a drive signal used to control a driver element to correct the position of a lens or image pickup devices, based on the output signal of a position detecting element for detecting the position of the lens to be driven or the image pickup devices to be driven and the vibration-component signal. A control unit verifies the operations of the driver element, the position detecting element, the vibration detecting element and the first equalizer, based on the output signal of the position detecting element and the vibration-component signal.

Abstract: A vibration control equalizer for generating a vibration signal for determining a driving amount for an optical component on the basis of an output signal of a vibration detector for detecting vibration of an imaging apparatus, a position control equalizer for calculating a position signal for determining a driving amount for the optical component on the basis of an output signal of a position detector for detecting position of the optical component, and an internal CPU for controlling the vibration control equalizer and the position control equalizer are provided, and compensation for the output signal of the position detector is performed by the internal CPU.

Abstract: An optical shake correction unit corrects an optical axis in response to an output signal of an vibration detecting element. An electronic shake correction unit adaptively varies an effective region in image signals of an image pickup region formed by image pickup devices. A control unit performs control such that either the optical shake correction unit or the electronic shake correction unit is enabled by switching between a first image pickup mode and a second image pickup mode.

Abstract: An internal CPU, a vibration control equalizer for processing an output signal of a vibration detector for detecting vibration of an imaging apparatus and calculating a vibration signal for determining a driving amount for an optical component on the basis of vibration of the imaging apparatus, a position control equalizer for calculating a position signal for determining a driving amount for the optical component on the basis of position of the optical component, and a control switching section for switching between the internal CPU and an external control circuit for the imaging apparatus for control of the vibration control equalizer and the position control equalizer.

Abstract: A semiconductor device with an anti-shake function includes a logic chip having a digital circuit which obtains a value for vibration of an apparatus based on a vibration detection signal supplied from a vibration detection element to generate a correction signal. The logic chip includes a correction signal processing unit which generates the correction signal, and a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component in accordance with vibration.

Abstract: A semiconductor device with an “anti-shake” function includes a logic chip having a digital circuit which obtains a value indicating the amount of vibration of device such as an imaging apparatus based on a vibration detection signal supplied from a vibration detection element to generate a correction signal. The logic chip includes a correction signal processing unit which generates the correction signal, and a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component. The control signal output unit includes a plurality of types of signal output sections and outputs a vibration control signal corresponding to a driving unit from one signal output section selected from among the plurality of types of signal output sections.

Abstract: A MCP semiconductor device with an “anti-shake” function includes a driver chip and a logic chip. The logic chip includes a correction signal processing unit which obtains a value for vibration of apparatus based on a vibration detection signal to generate a correction signal and a control signal output unit having a plurality of types of signal output sections which output a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component. The logic chip further includes a driver output terminal which outputs the vibration control signal to the driver chip, an external output terminal which outputs the control signal to an external circuit other than the driver chip, and also an output switch unit which connects one of the plurality of signal output sections with the driver output terminal or the external output terminal.

Abstract: A semiconductor module including multiple semiconductor devices prevents a signal that flows through a bonding wire connected to one semiconductor device from acting as noise which affects the other semiconductor devices, thereby improving the operation reliability of the semiconductor module. A second semiconductor device layered on a first semiconductor device includes a current output electrode via which large current is output. The current output electrode is electrically connected to a substrate electrode provided to a first wiring layer via a bonding wire. The bonding wire is provided across the side E1 of the second semiconductor device. A bonding wire connected to the first semiconductor device is provided across a side of the first semiconductor device other than the side F1 that corresponds to the side E1 of the second semiconductor device, i.e., across the side F2, F3, or F4 of the first semiconductor device.

Abstract: An efficient logic chip operating power supply having digital circuits in a multi-chip package is provided. A multi-chip package semiconductor device fabricated in common with a driver chip having analog circuits and a logic chip having digital circuits, a logic chip power supply circuit is provided in which a driver chip creates a logic chip power supply dedicated for the logic chip. The logic chip has internal logic circuitry operating by receiving a power supply from the logic chip power supply circuit via power input terminals.

Abstract: In a semiconductor module including multiple semiconductor devices, a signal that flows through a bonding wire connected to one semiconductor device is prevented from acting as noise which affects another semiconductor device, thereby improving the operation reliability of the semiconductor module. A second semiconductor device provided alongside a first semiconductor device includes a current output electrode via which large current is output. The current output electrode is electrically connected to a substrate electrode provided to a first wiring layer via a bonding wire such as a gold wire or the like. The bonding wire is provided across the side E2 which differs from the side E1 that faces the side face F1 of the first semiconductor device. Furthermore, the current output electrode is provided along the side E2.

Abstract: In a semiconductor module including multiple semiconductor devices, a signal that flows through a bonding wire connected to one semiconductor device is prevented from acting as noise which affects another semiconductor device, thereby improving the operation reliability of the semiconductor module. A second semiconductor device provided alongside a first semiconductor device includes a current output electrode via which large current is output. The current output electrode is electrically connected to a substrate electrode provided to a first wiring layer via a bonding wire such as a gold wire. The bonding wire is provided across the side E2 of the second semiconductor device. The bonding wire connected to the first semiconductor device is provided across a side of the first semiconductor device that corresponds to the side El of the second semiconductor device, i.e., the side F2, F3, or F4 of the first semiconductor device.

Abstract: An image stabilization control circuit controls an optical element driving element configured to move an optical element provided in an imaging apparatus based on an output signal of a vibration detection element provided in the imaging apparatus. The image stabilization control circuit includes an analog-digital conversion circuit configured to receive an analog signal from a position detection element that detects the position of the optical element and convert the input analog signal into a digital signal, and a servo circuit configured to generate a correction signal for correcting the position of the optical element based on an output signal of the analog-digital conversion circuit and output the generated correction signal to the optical element driving element. The servo circuit includes a digital filter circuit and a register. The digital filter circuit performs filter processing based on a filter coefficient stored in the register.

Abstract: A data processor that reduces the chip area of a semiconductor substrate. The data processor includes a detection circuit for generating an error detection code with digital data. A correction circuit generates an error correction code with the digital data that includes the error detection code. A control circuit controls the detection processing circuit and the correction processing circuit in accordance with a control program. The data processor further includes a first external memory and a serial/parallel conversion circuit. The first external memory stores a control program. The serial/parallel conversion circuit receives data of the control program in a serial state from the first external memory and provides a second external memory with the control program data in a parallel state when the data processor is activated.

Abstract: A packaged semiconductor device that enables testing of semiconductor chips incorporated therein in a simplified and efficient manner. The semiconductor device includes a packaged logic chip for processing data and a packaged memory chip for storing data that is processed by or that is to be processed by the logic circuit. The semiconductor device has an automatic rewrite circuit and a selector. The automatic rewrite circuit automatically writes test data to the memory circuit in accordance with a command signal from a tester. The selector selectively switches between accessing of the memory circuit by the automatic rewrite circuit and accessing of the memory circuit by the logic circuit. The tester provides the automatic rewrite circuit with a test start command signal to start testing the logic circuit.