Resin-packaged optical communication module

- Rohm Co., Ltd.
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Description

FIG. 1 is a front elevation of a resin-packaged optical communication module showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a rear elevation thereof;

FIG. 5 is a left side elevation thereof;

FIG. 6 is a right side elevation thereof; and,

FIG. 7 is a cross-section thereof taken along line 7—7 in FIG. 2.

Claims

The ornamental design for a resin-packaged optical communication module, as shown and described.

Referenced Cited
U.S. Patent Documents
D234426 March 1975 Gerdom
D242047 October 1976 Sheesely et al.
D242146 November 1976 Sheesely et al.
D291081 July 28, 1987 Mickelson et al.
D322953 January 7, 1992 Brown et al.
D333122 February 9, 1993 Kamakura et al.
D364603 November 28, 1995 Tanaka et al.
D364604 November 28, 1995 Tanaka et al.
D373759 September 17, 1996 Tanaka et al.
D401562 November 24, 1998 Brass et al.
D448344 September 25, 2001 Ishitsuka et al.
D464029 October 8, 2002 Hwang
D464631 October 22, 2002 Billman
D466865 December 10, 2002 Stack et al.
D466866 December 10, 2002 Stack et al.
D468269 January 7, 2003 Hwang
D468270 January 7, 2003 Hwang
D468698 January 14, 2003 Hwang
D475980 June 17, 2003 Chang
D485238 January 13, 2004 Hwang et al.
D485829 January 27, 2004 Lee
D494143 August 10, 2004 Sato
D494930 August 24, 2004 Ishigami et al.
D503382 March 29, 2005 Moriyama et al.
7156562 January 2, 2007 Mazotti et al.
7201520 April 10, 2007 Mizue et al.
Foreign Patent Documents
2092242 May 2000 GB
S-1245050 July 2005 JP
Patent History
Patent number: D563327
Type: Grant
Filed: Feb 7, 2006
Date of Patent: Mar 4, 2008
Assignee: Rohm Co., Ltd. (Kyoto)
Inventor: Tomoharu Horio (Kyoto)
Primary Examiner: Charles A. Rademaker
Attorney: Hamre, Schumann, Mueller & Larson, P.C.
Application Number: 29/253,462