Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface. A third lenticular lens sheet is provided on the second lenticular lens sheet such that a third lenticular lens sheet lower surface is opposite to a second lenticular lens sheet upper surface.

Abstract: A light emitting device includes: a package forming a recess, having a first lead and a second lead arranged on a bottom surface of the recess and a resin section on a lateralwall of the recess to fix the leads, and being in a substantially rectangular shape surrounded by upper sides of the lateralwalls of the recess; a light emitting element arranged on the first lead and being in a parallelogram shape; a second wire electrically connecting the light emitting element to the second lead; and reflective members covering inner surfaces of the lateralwalls on a diagonal line at corners in the recess, wherein one side of the light emitting element adjacent to the second lead is substantially in parallel to one side of the first lead or the second lead.

Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface. A third lenticular lens sheet is provided on the second lenticular lens sheet such that a third lenticular lens sheet lower surface is opposite to a second lenticular lens sheet upper surface.

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.

Abstract: A light-emitting device includes: at least one light-emitting element; a first light-transmissive member covering the light-emitting element; a second light-transmissive member covering the first light-transmissive member; and a light-diffusing member in the second light-transmissive member. The light-diffusing member comprises hollow particles. The second light-transmissive member has a bottom surface having irregularities due to presence of the light-diffusing member.

Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface.

Abstract: A light emitting device includes a light emitting element having a light emitting surface from which the light emitting element is configured to emit a first light having a first peak wavelength. A light transform layer is provided on the light emitting surface to transform the first light to a second light having a second peak wavelength longer than the first peak wavelength. A light-transmissive layer is provided on the light transform layer and includes a first surface that has a substantially flat shape and that is opposite to the light emitting surface and a second surface connected to the first surface and having a curved shape to surround the light emitting element. A reflecting film is provided between the light transform layer and the light-transmissive layer to extend along the first surface and the second surface so as to reflect the first light and to transmit the second light.

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.

Abstract: A package includes a first electrode and a second electrode that are located at a bottom portion of a bottomed recess, and a first resin securing the first electrode and the second electrode in place and forming a part of the bottomed recess. The first electrode has a first outer lead having a first indentation at a tip in a plan view. The second electrode has a second outer lead having a second indentation at a tip in a plan view. The first resin has at least a portion between the first electrode and the second electrode located at the bottom portion of the bottomed recess, wall portions structuring lateral walls of the bottomed recess, and flange portions having the same thickness as a thickness of the first outer lead and different outward widths from the wall portions on both sides of the first outer lead in a plan view.

Abstract: A method for manufacturing a package includes molding a precursor of a package including a cup-shaped resin component having a bottom surface and side walls, an opening opened at am upper part of the side walls, and a pair of leads exposed on the bottom surface. The side walls include a side wall that extends along the Y axis and the X axis and that has a first outer surface, and a side wall that extends along the Y axis and the Z axis. A thickness of the side wall extending along Y axis and the X axis is less than a thickness of the side wall extending along axis and the Z axis, The first outer surface has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening. The method further includes forming a reflective film in the recess.

Abstract: A package, includes a cup-shaped resin component having a bottom surface and side walls that surround the bottom surface, an opening which is opened at an upper part of the side walls, a pair of leads exposed on part of the bottom surface, and a reflective film, the resin component having a 3-D shape defined by an X axis, a Y axis and a Z axis, the outer surface of the side walls that has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening, and the reflective film being disposed in the recess.

Abstract: A method for manufacturing a package includes a step of injecting a first resin through an injection port of a dies in which a lead frame has been placed. The method includes a step of cutting out a portion of a border between a first electrode and a first connection portion running through a first through hole, and cutting out a portion of a border between a second electrode and a second connection portion running through a second through hole after molding the first resin. The method includes a step of electroplating the first and second electrodes. The method includes a step of cutting out a remaining portion of the border between the first electrode and the first connection portion, and cutting out a remaining portion of the border between the second electrode and the second connection portion.

Abstract: A package has a bottomed recess with a bottom portion. The package includes: a first electrode having a first outer lead portion and disposed in the bottom portion; a second electrode having a second outer lead portion and disposed in the bottom portion; and a first resin fixing the first electrode and the second electrode and constituting a part of the bottomed recess. The first resin has: a part between the first electrode and the second electrode disposed in the bottom portion; a wall portion constituting side walls of the bottomed recess; and a flange portion having a first part located adjacent to at least one of both sides of the first outer lead portion in plan view. The first part has a thickness different from a thickness of the first outer lead portion. A light emitting has: the package; and a light emitting element mounted on at least one of the first electrode and the second electrode of the package.

Abstract: A light emitting device includes: a package forming a recess, having a first lead and a second lead arranged on a bottom surface of the recess and a resin section on a lateralwall of the recess to fix the leads, and being in a substantially rectangular shape surrounded by upper sides of the lateralwalls of the recess; a light emitting element arranged on the first lead and being in a parallelogram shape; a second wire electrically connecting the light emitting element to the second lead; and reflective members covering inner surfaces of the lateralwalls on a diagonal line at corners in the recess, wherein one side of the light emitting element adjacent to the second lead is substantially in parallel to one side of the first lead or the second lead.

Abstract: A light emitting device includes: a package forming a recess, having a first lead and a second lead arranged on a bottom surface of the recess and a resin section on a lateral wall of the recess to fix the leads, and being in a substantially rectangular shape surrounded by upper sides of the lateral walls of the recess; a light emitting element arranged on the first lead and being in a parallelogram shape; a second wire electrically connecting the light emitting element to the second lead; and reflective members covering inner surfaces of the lateral walls on a diagonal line at corners in the recess, wherein one side of the light emitting element adjacent to the second lead is substantially in parallel to one side of the first lead or the second lead.

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a third light emitting element, a fluorescent material, a film, a first lens, a second lens, and a third lens. The first light emitting element is to emit a first light having a peak wavelength in a range from 440 nm to 485 nm. The second light emitting element is to emit a second light having a peak wavelength in a range from 495 nm to 573 nm. The third light emitting element is configured to emit from a third front surface a third light having a peak wavelength in a range from 440 nm to 485 nm. The fluorescent material is provided on the third front surface and has a fluorescent side surface extending along a front-rear direction. The film is provided to surround the side surface and the fluorescent side surface.

Abstract: A method for manufacturing a package includes the steps of: preparing a lead frame having a frame, a first electrode, a second electrode, a first connecting portion connecting the frame and the first electrode, and a second connecting portion connecting the frame and the second electrode; placing the lead frame in a mold; injecting a first resin into the mold from an inlet of the mold located adjacent to the first electrode to mold a flange portion and a wall portion of the package; and cutting the lead frame and a part of the flange portion located adjacent to the first electrode. In the step of injecting the first resin, the mold and the lead frame together provide a hollow space into which the first resin is injected and in which a part of the flange portion is formed so as to have a thickness different from a thickness of the lead frame.

Abstract: A light emitting device includes a light emitting element having a light emitting surface from which the light emitting element is configured to emit a first light having a first peak wavelength. A light transform layer is provided on the light emitting surface to transform the first light to a second light having a second peak wavelength longer than the first peak wavelength. A light-transmissive layer is provided on the light transform layer and includes a first surface that has a substantially flat shape and that is opposite to the light emitting surface and a second surface connected to the first surface and having a curved shape to surround the light emitting element. A reflecting film is provided between the light transform layer and the light-transmissive layer to extend along the first surface and the second surface so as to reflect the first light and to transmit the second light.

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.