Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a third light emitting element, a fluorescent material, a film, a first lens, a second lens, and a third lens. The first light emitting element is to emit a first light having a peak wavelength in a range from 440 nm to 485 nm. The second light emitting element is to emit a second light having a peak wavelength in a range from 495 nm to 573 nm. The third light emitting element is configured to emit from a third front surface a third light having a peak wavelength in a range from 440 nm to 485 nm. The fluorescent material is provided on the third front surface and has a fluorescent side surface extending along a front-rear direction. The film is provided to surround the side surface and the fluorescent side surface.

Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.

Abstract: A light emitting device includes: a package forming a recess, having a first lead and a second lead arranged on a bottom surface of the recess and a resin section on a lateral wall of the recess to fix the leads, and being in a substantially rectangular shape surrounded by upper sides of the lateral walls of the recess; a light emitting element arranged on the first lead and being in a parallelogram shape; a second wire electrically connecting the light emitting element to the second lead; and reflective members covering inner surfaces of the lateral walls on a diagonal line at corners in the recess, wherein one side of the light emitting element adjacent to the second lead is substantially in parallel to one side of the first lead or the second lead.

Abstract: A method for manufacturing a package includes the steps of; preparing a lead frame having a frame, a first electrode, a second electrode, a first connecting portion connecting the frame and the first electrode, and a second connecting portion connecting the frame and the second electrode; placing the lead frame in a mold; injecting a first resin into the mold from an inlet of the mold located adjacent to the first electrode to mold a flange portion and a wall portion of the package; and cutting the lead frame and a part of the flange portion located adjacent to the first electrode. In the step of injecting the first resin, the mold and the lead frame together provide a hollow space into which the first resin is injected and in which a part of the flange portion is formed so as to have a thickness different from a thickness of the lead frame.

Abstract: A method for manufacturing a package includes a step of injecting a first resin through an injection port of a dies in which a lead frame has been placed. The method includes a step of cutting out a portion of a border between a first electrode and a first connection portion running through a first through hole, and cutting out a portion of a border between a second electrode and a second connection portion running through a second through hole after molding the first resin. The method includes a step of electroplating the first and second electrodes. The method includes a step of cutting out a remaining portion of the border between the first electrode and the first connection portion, and cutting out a remaining portion of the border between the second electrode and the second connection portion.

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.

Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface.

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c.

Abstract: A package, includes a cup-shaped resin component having a bottom surface and side walls that surround the bottom surface, an opening which is opened at an upper part of the side walls, a pair of leads exposed on part of the bottom surface, and a reflective film, the resin component having a 3-D shape defined by an X axis, a Y axis and a Z axis, the outer surface of the side walls that has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening, and the reflective film being disposed in the recess.

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

Abstract: A light emitting device, comprises: a light source that emits excitation light; a light guide that propagates the excitation light, and in which the refractive index of the center part (core) of a cross section is higher than the refractive index of the peripheral part (cladding); a wavelength conversion member that absorbs the excitation light propagated by the light guide and converts the wavelength thereof, and releases light of a predetermined wavelength band; and a shielding member that blocks the wavelength of at least part of the excitation light and the light emitted from the wavelength conversion member.

Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

Abstract: A light-emitting device includes a light-emitting element on a molded part. The molded part is formed by molding and curing a thermosetting epoxy resin composition comprising (A) the reaction product of a triazine derived epoxy resin with an acid anhydride, (B) an internal parting agent having m.p. 50-90° C., (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst.

Abstract: A light emitting device includes a wavelength converting member for absorbing light emitted by an exciting light source and emitting light of a different wavelength. With a wavelength at which the light from the exciting light source has a maximum energy intensity denoted as a first wavelength, a wavelength at which the light from the wavelength converting member has a maximum energy intensity denoted as a second wavelength, a wavelength lying between the first and second wavelengths at which the light from the light emitting device has a minimum energy intensity denoted as a third wavelength, and 650 nm denoted as a fourth wavelength, then the light emitting device has an emission spectrum such that the proportion of the energy intensity at the first wavelength to the energy intensity at the third wavelength is in a range from 100:15 to 100:150, and the proportion of the energy intensity at the first wavelength to the energy intensity at the fourth wavelength is in a range from 100:45 to 100:200.

Abstract: A red phosphor with excellent luminescent characteristics, and a light emitting device that uses this phosphor are provided. The phosphor is a nitride phosphor that is activated by europium, and absorbs light from the near ultraviolet range to the blue range to emit red light. The nitride phosphor has the following general formula, MwAlxSiyBzN((2/3)w+x+(4/3)y+z):Eu2+ where M is at least one element selected from the group consisting of Mg, Ca, Sr and Ba. In the general formula, w, x, y and z fall within the following ranges. 0.056?w?9, x=1, 0.056?y?18, and 0.0005?z?0.5 In addition, the mean particle diameter of the nitride phosphor is preferably not less than 2 ?m and not more than 15 ?m.