Abstract: A pressure sensor chip according to the present invention includes an annular diaphragm that surrounds a periphery of a low-differential-pressure diaphragm (1) as a high-differential-pressure diaphragm (2). A measurement pressure (Pa) for one surface of the low-differential-pressure diaphragm (1) is transmitted to one surface of the high-differential-pressure diaphragm (2) along a branched path, and a measurement pressure (Pb) for the other surface of the low-differential-pressure diaphragm (1) is transmitted to the other surface of the high-differential-pressure diaphragm (2) along a branched path. Thus, multiple differential-pressure measurement ranges can be provided.

Abstract: A pressure sensor according to the present invention includes a diaphragm (3) including a first principal surface (3A) and a second principal surface (3B) that is opposite thereto, the first principal surface receiving a pressure of a fluid; a semiconductor chip (1) provided with resistors that constitute a strain gauge; and at least three support members (2a, 2b, 2c) made of an insulating material, each support member being fixed to the second principal surface at one end thereof and to the semiconductor chip at the other end thereof and extending perpendicularly to the second principal surface so as to support the semiconductor chip. One of the support members (2a) is provided at a center (30) of the diaphragm in plan view.

Abstract: A pressure sensor chip includes a first layer including a pressure introduction channel opening on a first main surface and a second main surface; a second layer including a diaphragm covering one end of the channel, a first strain gauge, and a second strain gauge, the second layer being on the second main surface; and a third layer including a third main surface and a concaved portion disposed at the third main surface, the third main surface being on the second layer. The concaved portion faces the channel with the diaphragm interposed therebetween, and is on an inner side of the channel when viewed from a direction perpendicular to the first main surface. The first strain gauge is on an outer side of the concaved portion when viewed from the direction. The second strain gauge is on an inner side of the first strain gauge when viewed from the direction.

Abstract: A pressure sensor chip according to the present invention includes an annular diaphragm that surrounds a periphery of a low-differential-pressure diaphragm (1) as a high-differential-pressure diaphragm (2). A measurement pressure (Pa) for one surface of the low-differential-pressure diaphragm (1) is transmitted to one surface of the high-differential-pressure diaphragm (2) along a branched path, and a measurement pressure (Pb) for the other surface of the low-differential-pressure diaphragm (1) is transmitted to the other surface of the high-differential-pressure diaphragm (2) along a branched path. Thus, multiple differential-pressure measurement ranges can be provided.

Abstract: A pressure sensor chip according to the present invention includes two static-pressure diaphragms (2, 3) formed by dividing an annular diaphragm arranged so as to surround a differential-pressure diaphragm (1). A reference pressure is applied to one surface of one static-pressure diaphragm (2), and a measurement pressure (Pa) for one surface of the differential-pressure diaphragm (1) is transmitted to the other surface of the static-pressure diaphragm (2) along a branched path. A reference pressure is applied to one surface of the other static-pressure diaphragm (3), and a measurement pressure (Pb) for the other surface of the differential-pressure diaphragm (1) is transmitted to the other surface of the static-pressure diaphragm (3) along a branched path. Accordingly, multiple differential-pressure measurement ranges can be provided.

Abstract: A pressure sensor chip according to the present invention includes a non-bonding region (SA) that is provided in a stopper member (11-2) and connected to a periphery of a pressure introduction hole (11-2b). A plurality of protrusions (12) are discretely formed on at least one of a first surface (PL1) and a second surface (PL2) that face each other in the non-bonding region (SA). Passages (13) between the protrusions (12) serve as channels between the periphery of the pressure introduction hole (11-2b) and a peripheral edge (14) of the non-bonding region (SA). Accordingly, stress concentration does not occur at a diaphragm edge and the expected withstand pressure can be obtained.

Abstract: A pressure sensor chip is provided with first and second retaining members. The peripheral edge portions of the first and second retaining members are bonded to face one face and another face of a diaphragm, respectively. An inner edge of the peripheral edge portion of the first retaining member is positioned further to the outside than an inner edge of the peripheral edge portion of the second retaining member.

Abstract: A pressure sensor chip includes a sensor diaphragm, and first and second retaining members. The first and second retaining members face and are bonded to peripheral edge portions of a first face and another face of the sensor diaphragm, and have pressure guiding holes that guide measurement pressures to the sensor diaphragm. The first retaining member has, in an interior thereof, a non-bonded region that is continuous with a peripheral portion of the pressure guiding hole. The non-bonded region in the interior of the first retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.

Abstract: A pressure sensor chip includes a sensor diaphragm that outputs a signal in accordance with a pressure differential, and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith. In the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm.

Abstract: A pressure sensor chip includes a sensor diaphragm, and first and second retaining members. The first and second retaining members face and are bonded to peripheral edge portions of a first face and another face of the sensor diaphragm, and have pressure guiding holes that guide measurement pressures to the sensor diaphragm. The first retaining member has, in an interior thereof, a non-bonded region that is continuous with a peripheral portion of the pressure guiding hole. The non-bonded region in the interior of the first retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.

Abstract: A pressure sensor chip includes a sensor diaphragm and first and second retaining members. In a peripheral edge portion of the first retaining member, of a region facing one face of the sensor diaphragm, a region on an outer peripheral side is a bonded region bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a non-bonded region not bonded to the one face of the sensor diaphragm. In the peripheral edge portion of the first retaining member, a ring-shaped groove is formed protruding in a direction of a wall thickness of the first retaining member, continuous with the non-bonded region of the peripheral edge portion. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.

Abstract: A pressure sensor chip is provided with first and second retaining members. The peripheral edge portions of the first and second retaining members are bonded to face one face and another face of a diaphragm, respectively. An inner edge of the peripheral edge portion of the first retaining member is positioned further to the outside than an inner edge of the peripheral edge portion of the second retaining member.

Abstract: A pressure sensor comprising: a sensor chip; a differential pressure diaphragm provided in the center portion of the sensor chip; a differential pressure gauge provided in the differential pressure diaphragm; a static pressure diaphragm provided at the outer peripheral portion of the differential pressure diaphragm; a first static pressure gauge formed at an edge portion of the static pressure diaphragm; and a second static pressure gauge formed at a center portion of the static pressure diaphragm.

Abstract: A pressure sensor chip includes a sensor diaphragm that outputs a signal in accordance with a pressure differential, and first and second holding members that face, on peripheral edge portions thereof, one face and another face of a sensor diaphragm, and are in contact therewith. In the peripheral edge portion of the first holding member, in a region that faces the one face of the sensor diaphragm, a region on an outer peripheral side is a region that is bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a region that is not bonded to the one face of the sensor diaphragm.

Abstract: A pressure sensor including a sensor chip; a differential pressure diaphragm provided in the center portion of the sensor chip; a first differential pressure gauge formed along a radial direction relative to the center of the differential pressure diaphragm, provided on a first edge of the differential pressure diaphragm; a second differential pressure gauge formed along a circumferential direction, which is perpendicular to the radial direction, provided in the vicinity of the first differential pressure gauge on the first edge of the differential pressure diaphragm; and a static pressure diaphragm disposed between an edge portion of the sensor chip and one of the edges, other than the first edge, of the differential pressure diaphragm, provided to the outside of the differential pressure diaphragm.

Abstract: The pressure sensor according to the present invention has a sensor chip having a first semiconductor layer that has an opening portion, and a second semiconductor layer, formed on the first semiconductor layer, having a recessed portion that forms a diaphragm and a base, having a pressure guiding hole that is connected to the opening portion, bonded to the sensor chip. The recessed portion in the second semiconductor layer is larger than the opening portion of the first semiconductor layer. The opening portion of the first semiconductor layer has an opening diameter on the second semiconductor layer side that is larger than the opening diameter on the base side.

Abstract: A pressure sensor according to the present invention comprises: a differential pressure diaphragm; a static pressure diaphragm, which is provided to an outer perimeter part of the differential pressure diaphragm; a first static pressure gauge pair that is formed in the end part of the static pressure diaphragm and comprises two static pressure gauges, which are disposed such that they sandwich the differential pressure diaphragm; and a second static pressure gauge pair that is formed in the center part of the static pressure diaphragm and comprises two static pressure gauges which are disposed such that they sandwich the differential pressure diaphragm.

Abstract: To provide a gas sensor chip, and a gas sensor provided therewith, capable of producing stable output characteristics over an extended period of time even when installed in a harsh environment such as a boiler smokestack carrying exhaust gasses. There is a backside structure wherein a catalyst carrier that contacts a gas to be measured is disposed on one side of a thermal conductor, a temperature sensing portion is disposed in a location that does not contact the gas to be measured, on the other side of the thermal conductor, and the temperature sensing portion measures the temperature corresponding to the temperature of the catalyst carrier through the thermal conductor, to enable the sensing of the amount of flow over an extended period of time without the temperature sensing portion being negatively affected by the gas to be measured.

Abstract: Provision of a pressure measuring device having a flexible membrane that receives the pressure; a pedestal, provided with a raised portion having a bottom face that is circular that supports the flexible membrane; and a supporting member that is bonded to the circular bottom face of the raised portion. The flexible membrane is made out of, for example, silicon, and has the (100) face as the primary face. Moreover, the flexible membrane is provided held between a silicon substrate, which is provided with a recessed portion, and a silicon substrate, which is provided with a recessed portion. Because of this, the flexible membrane is held on the pedestal with the silicon substrate interposed therebetween.

Abstract: A pressure sensor according to the present invention comprises: a differential pressure diaphragm, which is provided to a center part of a sensor chip; a differential pressure gauge, which is provided to a perimeter edge part of the differential pressure diaphragm and is formed in radial directions; a differential pressure gauge, which is disposed at a position at which it opposes the differential pressure gauge and, together with the first differential pressure gauge, sandwiches the differential pressure diaphragm and is formed in perimeter directions, which are perpendicular to the radial directions; a differential pressure gauge, which is provided in the vicinity of the differential pressure gauge and is provided in the perimeter directions; a differential pressure gauge, which is disposed at a position at which it opposes the differential pressure gauge and, together with the differential pressure gauge, sandwiches the differential pressure diaphragm and is formed in the radial directions; a static pressu