Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring high-output laser light irradiation at the time of the peeling of the adherend. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber, wherein the pressure-sensitive adhesive layer has a first surface and a second surface opposed to the first surface, and wherein a maximum value S1 of a detection intensity of the UV absorber by time-of-flight secondary ion mass spectrometry (TOF-SIMS) in a range of from the first surface to a depth of 1 ?m in a thickness direction and a detection intensity C of the UV absorber by the TOF-SIMS at a center point in the thickness direction of the pressure-sensitive adhesive layer satisfy a relationship: S1/C?1.1.

Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring high-output laser light irradiation at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and/or a photopolymerization initiator, wherein the pressure-sensitive adhesive sheet has a transmittance of 60% or less for light having a wavelength of 355 nm, and wherein the pressure-sensitive adhesive layer is a layer having an indentation elastic modulus at 23° C. of 25 MPa after irradiation with UV light having an integrated light quantity of 300 mJ/cm2.

Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring the application of high-output laser light at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and an active energy ray-curable pressure-sensitive adhesive, wherein the pressure-sensitive adhesive sheet has a transmittance of 50% or less for light having a wavelength of 355 nm. In one embodiment, the pressure-sensitive adhesive layer has a thickness of 20 ?m or less. In one embodiment, the pressure-sensitive adhesive sheet has a visible light transmittance of 50% or more.

Abstract: In order to easily and stably adhere an adhering body by suction to an easily deformable flexible object, the adhering body includes an elastically deformable body that moves back and forth between a closing position at which the elastically deformable body closes a communication port and an opening position at which the elastically deformable body opens the communication port, the elastically deformable body moving, in conjunction with movement of a movable contact part to a retreat position, so as to open the communication port.

Abstract: Provided is a power generation device having a dielectric body and an electret, where power is generated by varying the distance between the dielectric body and the electret. A first electrode is connected to the electret on a side not facing the dielectric body. The first electrode is connected to a grounding terminal via a load. A second electrode may be connected to the dielectric body on a side not facing the electret. The second electrode may be directly connected to the grounding terminal.

Abstract: Provided is a pressure-sensitive adhesive sheet capable of maintaining a desired pressure-sensitive adhesive characteristic even in a production method for a semiconductor including, for example, a step of peeling off a support material. The pressure-sensitive adhesive sheet includes a backing layer and a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer has a water contact angle of from 80° to 105°. The pressure-sensitive adhesive sheet is used in a production method for a semiconductor including a step in which the pressure-sensitive adhesive layer is brought into contact with a solvent having a solubility in water at 20° C. of 1 g/100 mL or less.

Abstract: A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.

Abstract: The molding die set includes: a first molding die having a first molding chase, a cavity piece, supported by the first molding chase, movably supported by the first molding chase and enclosing the cavity piece; a second molding die having a second molding chase, a work supporting section biased and supported by the second molding chase and on which a work will be mounted, and a center insert located adjacent to the work supporting section; and a pot being provided to one of the first molding die and the second molding die, the pot feeding resin for molding the work. The second molding die has a thickness adjusting mechanism, which makes the work supporting section absorb thickness variation of the work and brings the work into contact with the movable clamper when the work is clamped with the movable clamper of the first molding die.

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.

Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes back-grinding a substrate of an LED wafer including a light emitting element and the substrate, where the back-grinding includes fixing the LED wafer to a table via a double-sided pressure-sensitive adhesive sheet, and then grinding the substrate.

Abstract: A method of manufacturing an LED including: back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.

Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes: forming a reflective layer on an outer side of a substrate of an LED wafer including the substrate and a light emitting element on one surface of the substrate; and attaching, prior to the forming a reflective layer, a heat-resistant pressure-sensitive adhesive sheet onto an outer side of the light emitting element.

Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes: back-grinding a substrate of an LED wafer including the substrate and a light emitting element formed on one surface of the substrate; forming, after the back-grinding, a reflective layer on an outer side of the substrate; and attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet.

Abstract: A radiation-curable adhesive composition having a base polymer including structural units derived from a monomer A having a functional group a; a monomer B formed from a methacrylate monomer having an alkyl group that includes at least 10 and no more than 17 carbon atoms; and a monomer C that has both a functional group c that reacts with the functional group a and a polymerizable carbon-carbon double bond group, and a main chain of the base polymer is configured from the monomer B and the monomer A, the proportion of the monomer B being at least 50 wt % of the total monomers configuring the main chain; and the base polymer includes a polymerizable carbon-carbon double bond group in a side chain as a result of a portion of the functional group a in the monomer A reacting and bonding with the functional group c in the monomer C.

Abstract: Provided is an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray. The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), in which the polymer (P) includes one of a polymer obtained by causing a carboxyl group-containing polymer (P3) and an oxazoline group-containing monomer (m3) to react with each other, and a polymer obtained by causing an oxazoline group-containing polymer (P4) and a carboxyl group-containing monomer (m2) to react with each other.

Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.

Abstract: Provided is a power generation device having a dielectric body and an electret, where power is generated by varying the distance between the dielectric body and the electret. A first electrode is connected to the electret on a side not facing the dielectric body. The first electrode is connected to a grounding terminal via a load. A second electrode may be connected to the dielectric body on a side not facing the electret. The second electrode may be directly connected to the grounding terminal.

Abstract: The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.

Abstract: The molding die set includes: a first molding die having a first molding chase, a cavity piece, supported by the first molding chase, movably supported by the first molding chase and enclosing the cavity piece; a second molding die having a second molding chase, a work supporting section biased and supported by the second molding chase and on which a work will be mounted, and a center insert located adjacent to the work supporting section; and a pot being provided to one of the first molding die and the second molding die, the pot feeding resin for molding the work. The second molding die has a thickness adjusting mechanism, which makes the work supporting section absorb thickness variation of the work and brings the work into contact with the movable clamper when the work is clamped with the movable clamper of the first molding die.

Abstract: A radiation-curable adhesive composition having a base polymer including structural units derived from a monomer A having a functional group a; a monomer B formed from a methacrylate monomer having an alkyl group that includes at least 10 and no more than 17 carbon atoms; and a monomer C that has both a functional group c that reacts with the functional group a and a polymerizable carbon-carbon double bond group, and a main chain of the base polymer is configured from the monomer B and the monomer A, the proportion of the monomer B being at least 50 wt % of the total monomers configuring the main chain; and the base polymer includes a polymerizable carbon-carbon double bond group in a side chain as a result of a portion of the functional group a in the monomer A reacting and bonding with the functional group c in the monomer C.