Patents by Inventor Tomokazu Takahashi

Tomokazu Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230019125
    Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring the application of high-output laser light at the time of the peeling of the adherend and being capable of eliminating the need for a step of washing the adherend after the peeling. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber and an active energy ray-curable pressure-sensitive adhesive, wherein the pressure-sensitive adhesive sheet has a transmittance of 50% or less for light having a wavelength of 355 nm. In one embodiment, the pressure-sensitive adhesive layer has a thickness of 20 ?m or less. In one embodiment, the pressure-sensitive adhesive sheet has a visible light transmittance of 50% or more.
    Type: Application
    Filed: December 10, 2020
    Publication date: January 19, 2023
    Applicant: NITTO DENKO CORPORATION
    Inventors: Mizuho NAGATA, Yu TACHIKAWA, Tomokazu TAKAHASHI, Satoshi HONDA
  • Publication number: 20220254136
    Abstract: An image acquisition unit 110 acquires a plurality of images. The plurality of images include an object to be inferred. An image cut-out unit 120 cuts out an object region including the object from each of the plurality of images acquired by the image acquisition unit 110. An importance generation unit 130 generates importance information by processing the object region cut out by the image cut-out unit 120. The importance information indicates the importance of the object region when an object inference model is generated, and is generated for each object region, that is, for each image acquired by the image acquisition unit 110. A learning data generation unit 140 stores a plurality of object regions cut out by the image cut-out unit 120 and a plurality of pieces of importance information generated by the importance generation unit 130 in a learning data storage unit 150 as at least a part of the learning data.
    Type: Application
    Filed: January 28, 2022
    Publication date: August 11, 2022
    Applicant: NEC Corporation
    Inventors: Tomokazu KANEKO, Katsuhiko TAKAHASHI, Makoto TERAO, Soma SHIRAISHI, Takami SATO, Yu NABETO, Ryosuke SAKAI
  • Patent number: 11402295
    Abstract: An optical fiber loss measurement device includes a unit configured to input pump light at a first frequency in a predetermined mode to a measurement target optical fiber in which a plurality of modes propagate from a first end, and input probe light at a second frequency to which a Brillouin frequency shift is applied to a second end, a Brillouin gain acquisition unit configured to measure an intensity of light output from the first end to acquire Brillouin gains in a longitudinal direction of the measurement target optical fiber using a BOTDA method, and a unit configured to measure a loss in the predetermined mode of the measurement target optical fiber, and the probe light is in a mode in which an electric field distribution in a cross section of the measurement target optical fiber is axisymmetric.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: August 2, 2022
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Tomokazu Oda, Hiroshi Takahashi, Kunihiro Toge, Tetsuya Manabe
  • Patent number: 11385128
    Abstract: An optical test system capable of accurately measuring a loss of each mode at each position of an optical fiber which propagates a plurality of modes is provided.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: July 12, 2022
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Hiroshi Takahashi, Kunihiro Toge, Tomokazu Oda, Tetsuya Manabe
  • Patent number: 11385082
    Abstract: An environmental property measurement apparatus includes a unit configured to receive probe light in a desired mode from one end of a measurement optical fiber, a unit configured to receive, from the other end of the measurement optical fiber, a light pulse in the desired mode as a pump light pulse with respect to the probe light, the light pulse having a frequency difference corresponding to a Brillouin frequency shift of the measurement optical fiber relative to the probe light on a high frequency side, and a unit configured to receive second probe light having the frequency difference corresponding to the Brillouin frequency shift of the measurement optical fiber relative to the probe light on a low frequency side from the other end of the measurement optical fiber, the second probe light being probe light with respect to the probe light in another mode different from the desired mode.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: July 12, 2022
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Hiroshi Takahashi, Kunihiro Toge, Tomokazu Oda, Tetsuya Manabe
  • Patent number: 11378489
    Abstract: An object is to provide a propagation property analyzing apparatus that can alleviate the influence of an error caused by crosstalk, and accurately evaluate a few-mode optical fiber that multiplexes a plurality of modes, in a distributional and non-destructive manner.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: July 5, 2022
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Hiroshi Takahashi, Tomokazu Oda, Kunihiro Toge, Tetsuya Manabe
  • Publication number: 20210338261
    Abstract: In order to easily and stably adhere an adhering body by suction to an easily deformable flexible object, the adhering body includes an elastically deformable body that moves back and forth between a closing position at which the elastically deformable body closes a communication port and an opening position at which the elastically deformable body opens the communication port, the elastically deformable body moving, in conjunction with movement of a movable contact part to a retreat position, so as to open the communication port.
    Type: Application
    Filed: August 27, 2019
    Publication date: November 4, 2021
    Inventor: Tomokazu Takahashi
  • Patent number: 9413272
    Abstract: Provided is a power generation device having a dielectric body and an electret, where power is generated by varying the distance between the dielectric body and the electret. A first electrode is connected to the electret on a side not facing the dielectric body. The first electrode is connected to a grounding terminal via a load. A second electrode may be connected to the dielectric body on a side not facing the electret. The second electrode may be directly connected to the grounding terminal.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: August 9, 2016
    Assignees: Rohm Co., Ltd., KANSAI UNIVERSITY
    Inventors: Seiji Aoyagi, Tomokazu Takahashi, Masato Suzuki, Yasuhiro Yoshikawa
  • Publication number: 20160160089
    Abstract: Provided is a pressure-sensitive adhesive sheet capable of maintaining a desired pressure-sensitive adhesive characteristic even in a production method for a semiconductor including, for example, a step of peeling off a support material. The pressure-sensitive adhesive sheet includes a backing layer and a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer has a water contact angle of from 80° to 105°. The pressure-sensitive adhesive sheet is used in a production method for a semiconductor including a step in which the pressure-sensitive adhesive layer is brought into contact with a solvent having a solubility in water at 20° C. of 1 g/100 mL or less.
    Type: Application
    Filed: November 25, 2015
    Publication date: June 9, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shunpei TANAKA, Tomokazu TAKAHASHI, Jun AKIYAMA
  • Patent number: 8778118
    Abstract: A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: July 15, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Masakatsu Urairi, Atsushi Hino, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto
  • Patent number: 8727757
    Abstract: The molding die set includes: a first molding die having a first molding chase, a cavity piece, supported by the first molding chase, movably supported by the first molding chase and enclosing the cavity piece; a second molding die having a second molding chase, a work supporting section biased and supported by the second molding chase and on which a work will be mounted, and a center insert located adjacent to the work supporting section; and a pot being provided to one of the first molding die and the second molding die, the pot feeding resin for molding the work. The second molding die has a thickness adjusting mechanism, which makes the work supporting section absorb thickness variation of the work and brings the work into contact with the movable clamper when the work is clamped with the movable clamper of the first molding die.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 20, 2014
    Assignee: Apic Yamada Corporation
    Inventors: Masanori Maekawa, Tomokazu Takahashi
  • Patent number: 8643194
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: February 4, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai, Akiyoshi Yamamoto, Tomokazu Takahashi
  • Publication number: 20140000793
    Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes back-grinding a substrate of an LED wafer including a light emitting element and the substrate, where the back-grinding includes fixing the LED wafer to a table via a double-sided pressure-sensitive adhesive sheet, and then grinding the substrate.
    Type: Application
    Filed: June 10, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
  • Publication number: 20140004636
    Abstract: A method of manufacturing an LED including: back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.
    Type: Application
    Filed: June 13, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
  • Publication number: 20140004635
    Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes: forming a reflective layer on an outer side of a substrate of an LED wafer including the substrate and a light emitting element on one surface of the substrate; and attaching, prior to the forming a reflective layer, a heat-resistant pressure-sensitive adhesive sheet onto an outer side of the light emitting element.
    Type: Application
    Filed: June 12, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
  • Publication number: 20140004637
    Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes: back-grinding a substrate of an LED wafer including the substrate and a light emitting element formed on one surface of the substrate; forming, after the back-grinding, a reflective layer on an outer side of the substrate; and attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet.
    Type: Application
    Filed: June 13, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu Takahashi, Shinya Akizuki, Toshimasa Sugimura, Takeshi Matsumura, Daisuke Uenda
  • Patent number: 8603630
    Abstract: A radiation-curable adhesive composition having a base polymer including structural units derived from a monomer A having a functional group a; a monomer B formed from a methacrylate monomer having an alkyl group that includes at least 10 and no more than 17 carbon atoms; and a monomer C that has both a functional group c that reacts with the functional group a and a polymerizable carbon-carbon double bond group, and a main chain of the base polymer is configured from the monomer B and the monomer A, the proportion of the monomer B being at least 50 wt % of the total monomers configuring the main chain; and the base polymer includes a polymerizable carbon-carbon double bond group in a side chain as a result of a portion of the functional group a in the monomer A reacting and bonding with the functional group c in the monomer C.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: December 10, 2013
    Assignee: Nitto Denko Corporation
    Inventor: Tomokazu Takahashi
  • Publication number: 20130273361
    Abstract: Provided is an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray. The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), in which the polymer (P) includes one of a polymer obtained by causing a carboxyl group-containing polymer (P3) and an oxazoline group-containing monomer (m3) to react with each other, and a polymer obtained by causing an oxazoline group-containing polymer (P4) and a carboxyl group-containing monomer (m2) to react with each other.
    Type: Application
    Filed: June 11, 2013
    Publication date: October 17, 2013
    Inventors: Katsuhiko KAMIYA, Tomokazu Takahashi, Chie Kitano, Mika Okada, Takeshi Matsumura, Shuhei Murata, Hironao Otake, Masatsugu Koso
  • Patent number: 8546958
    Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: October 1, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Takashi Habu, Fumiteru Asai, Tomokazu Takahashi, Eiichi Imoto, Yuta Shimazaki
  • Publication number: 20130057110
    Abstract: Provided is a power generation device having a dielectric body and an electret, where power is generated by varying the distance between the dielectric body and the electret. A first electrode is connected to the electret on a side not facing the dielectric body. The first electrode is connected to a grounding terminal via a load. A second electrode may be connected to the dielectric body on a side not facing the electret. The second electrode may be directly connected to the grounding terminal.
    Type: Application
    Filed: August 30, 2012
    Publication date: March 7, 2013
    Applicants: KANSAI UNIVERSITY, ROHM CO., LTD.
    Inventors: Seiji AOYAGI, Tomokazu TAKAHASHI, Masato SUZUKI, Yasuhiro YOSHIKAWA