Patents by Inventor Tomokazu Takahashi

Tomokazu Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9413272
    Abstract: Provided is a power generation device having a dielectric body and an electret, where power is generated by varying the distance between the dielectric body and the electret. A first electrode is connected to the electret on a side not facing the dielectric body. The first electrode is connected to a grounding terminal via a load. A second electrode may be connected to the dielectric body on a side not facing the electret. The second electrode may be directly connected to the grounding terminal.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: August 9, 2016
    Assignees: Rohm Co., Ltd., KANSAI UNIVERSITY
    Inventors: Seiji Aoyagi, Tomokazu Takahashi, Masato Suzuki, Yasuhiro Yoshikawa
  • Publication number: 20160160089
    Abstract: Provided is a pressure-sensitive adhesive sheet capable of maintaining a desired pressure-sensitive adhesive characteristic even in a production method for a semiconductor including, for example, a step of peeling off a support material. The pressure-sensitive adhesive sheet includes a backing layer and a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer has a water contact angle of from 80° to 105°. The pressure-sensitive adhesive sheet is used in a production method for a semiconductor including a step in which the pressure-sensitive adhesive layer is brought into contact with a solvent having a solubility in water at 20° C. of 1 g/100 mL or less.
    Type: Application
    Filed: November 25, 2015
    Publication date: June 9, 2016
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shunpei TANAKA, Tomokazu TAKAHASHI, Jun AKIYAMA
  • Patent number: 8778118
    Abstract: A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: July 15, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Masakatsu Urairi, Atsushi Hino, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto
  • Patent number: 8727757
    Abstract: The molding die set includes: a first molding die having a first molding chase, a cavity piece, supported by the first molding chase, movably supported by the first molding chase and enclosing the cavity piece; a second molding die having a second molding chase, a work supporting section biased and supported by the second molding chase and on which a work will be mounted, and a center insert located adjacent to the work supporting section; and a pot being provided to one of the first molding die and the second molding die, the pot feeding resin for molding the work. The second molding die has a thickness adjusting mechanism, which makes the work supporting section absorb thickness variation of the work and brings the work into contact with the movable clamper when the work is clamped with the movable clamper of the first molding die.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 20, 2014
    Assignee: Apic Yamada Corporation
    Inventors: Masanori Maekawa, Tomokazu Takahashi
  • Patent number: 8643194
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: February 4, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai, Akiyoshi Yamamoto, Tomokazu Takahashi
  • Publication number: 20140004635
    Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes: forming a reflective layer on an outer side of a substrate of an LED wafer including the substrate and a light emitting element on one surface of the substrate; and attaching, prior to the forming a reflective layer, a heat-resistant pressure-sensitive adhesive sheet onto an outer side of the light emitting element.
    Type: Application
    Filed: June 12, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
  • Publication number: 20140000793
    Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes back-grinding a substrate of an LED wafer including a light emitting element and the substrate, where the back-grinding includes fixing the LED wafer to a table via a double-sided pressure-sensitive adhesive sheet, and then grinding the substrate.
    Type: Application
    Filed: June 10, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
  • Publication number: 20140004636
    Abstract: A method of manufacturing an LED including: back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.
    Type: Application
    Filed: June 13, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
  • Publication number: 20140004637
    Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes: back-grinding a substrate of an LED wafer including the substrate and a light emitting element formed on one surface of the substrate; forming, after the back-grinding, a reflective layer on an outer side of the substrate; and attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet.
    Type: Application
    Filed: June 13, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu Takahashi, Shinya Akizuki, Toshimasa Sugimura, Takeshi Matsumura, Daisuke Uenda
  • Patent number: 8603630
    Abstract: A radiation-curable adhesive composition having a base polymer including structural units derived from a monomer A having a functional group a; a monomer B formed from a methacrylate monomer having an alkyl group that includes at least 10 and no more than 17 carbon atoms; and a monomer C that has both a functional group c that reacts with the functional group a and a polymerizable carbon-carbon double bond group, and a main chain of the base polymer is configured from the monomer B and the monomer A, the proportion of the monomer B being at least 50 wt % of the total monomers configuring the main chain; and the base polymer includes a polymerizable carbon-carbon double bond group in a side chain as a result of a portion of the functional group a in the monomer A reacting and bonding with the functional group c in the monomer C.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: December 10, 2013
    Assignee: Nitto Denko Corporation
    Inventor: Tomokazu Takahashi
  • Publication number: 20130273361
    Abstract: Provided is an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray. The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), in which the polymer (P) includes one of a polymer obtained by causing a carboxyl group-containing polymer (P3) and an oxazoline group-containing monomer (m3) to react with each other, and a polymer obtained by causing an oxazoline group-containing polymer (P4) and a carboxyl group-containing monomer (m2) to react with each other.
    Type: Application
    Filed: June 11, 2013
    Publication date: October 17, 2013
    Inventors: Katsuhiko KAMIYA, Tomokazu Takahashi, Chie Kitano, Mika Okada, Takeshi Matsumura, Shuhei Murata, Hironao Otake, Masatsugu Koso
  • Patent number: 8546958
    Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: October 1, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Takashi Habu, Fumiteru Asai, Tomokazu Takahashi, Eiichi Imoto, Yuta Shimazaki
  • Publication number: 20130057110
    Abstract: Provided is a power generation device having a dielectric body and an electret, where power is generated by varying the distance between the dielectric body and the electret. A first electrode is connected to the electret on a side not facing the dielectric body. The first electrode is connected to a grounding terminal via a load. A second electrode may be connected to the dielectric body on a side not facing the electret. The second electrode may be directly connected to the grounding terminal.
    Type: Application
    Filed: August 30, 2012
    Publication date: March 7, 2013
    Applicants: KANSAI UNIVERSITY, ROHM CO., LTD.
    Inventors: Seiji AOYAGI, Tomokazu TAKAHASHI, Masato SUZUKI, Yasuhiro YOSHIKAWA
  • Patent number: 8388786
    Abstract: The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: March 5, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Takashi Habu, Fumiteru Asai, Tomokazu Takahashi, Akinori Nishio, Toshio Shintani
  • Publication number: 20130028998
    Abstract: The molding die set includes: a first molding die having a first molding chase, a cavity piece, supported by the first molding chase, movably supported by the first molding chase and enclosing the cavity piece; a second molding die having a second molding chase, a work supporting section biased and supported by the second molding chase and on which a work will be mounted, and a center insert located adjacent to the work supporting section; and a pot being provided to one of the first molding die and the second molding die, the pot feeding resin for molding the work. The second molding die has a thickness adjusting mechanism, which makes the work supporting section absorb thickness variation of the work and brings the work into contact with the movable clamper when the work is clamped with the movable clamper of the first molding die.
    Type: Application
    Filed: January 30, 2012
    Publication date: January 31, 2013
    Inventors: Masanori Maekawa, Tomokazu Takahashi
  • Publication number: 20120165489
    Abstract: A radiation-curable adhesive composition having a base polymer including structural units derived from a monomer A having a functional group a; a monomer B formed from a methacrylate monomer having an alkyl group that includes at least 10 and no more than 17 carbon atoms; and a monomer C that has both a functional group c that reacts with the functional group a and a polymerizable carbon-carbon double bond group, and a main chain of the base polymer is configured from the monomer B and the monomer A, the proportion of the monomer B being at least 50 wt % of the total monomers configuring the main chain; and the base polymer includes a polymerizable carbon-carbon double bond group in a side chain as a result of a portion of the functional group a in the monomer A reacting and bonding with the functional group c in the monomer C.
    Type: Application
    Filed: December 27, 2011
    Publication date: June 28, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventor: Tomokazu TAKAHASHI
  • Publication number: 20120165471
    Abstract: The present invention provides a radiation-curable adhesive composition comprising a base polymer that includes structural units derived from at least one monomer that has a polymerizable carbon-carbon double bond group selected from the group consisting of an acryloyl group and a methacryloyl group, the composition further comprises a group that contributes to the irradiation curing, the a group that contributes to the irradiation curing is the same as the polymerizable carbon-carbon double bond group, that enables simple performance of a peel operation from an adherend when using a lower irradiation amount and that minimizes the peel transfer contamination amount to the adherend.
    Type: Application
    Filed: December 27, 2011
    Publication date: June 28, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventor: Tomokazu TAKAHASHI
  • Publication number: 20120070661
    Abstract: A pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a pressure-sensitive adhesive layer; and a base layer, wherein: the pressure-sensitive adhesive layer contains an amorphous propylene- (1-butene) copolymer polymerized by using a metallocene catalyst, the amorphous propylene-(1-butene) copolymer having a weight-average molecular weight (Mw) of 200,000 or more and a molecular weight distribution (Mw/Mn) of 2 or less; and the base layer contains an ethylene-vinyl acetate copolymer.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 22, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinsuke IKISHIMA, Takashi HABU, Fumiteru ASAI, Kooki OOYAMA, Tadao TORII, Katsutoshi KAMEI, Yuuki KATOU, Tomokazu TAKAHASHI
  • Publication number: 20120070658
    Abstract: A pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a heat-resistant layer; a base layer; and a pressure-sensitive adhesive layer in this order, wherein: the pressure-sensitive adhesive tape has an elastic modulus, i.e., Young's modulus at 25° C. of 150 MPa or less; and the heat-resistant layer contains a polypropylene-based resin polymerized by using a metallocene catalyst, the polypropylene-based resin having a melting point of 110° C. to 200° C. and a molecular weight distribution “Mw/Mn” of 3 or less.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 22, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinsuke IKISHIMA, Takashi HABU, Fumiteru ASAI, Kooki OOYAMA, Tadao TORII, Katsutoshi KAMEI, Yuuki KATOU, Tomokazu TAKAHASHI
  • Publication number: 20120065350
    Abstract: The present invention provides a resin material which can be used for a pressure-sensitive adhesive sheet for protecting a semiconductor wafer and the like, does not cause curve (warpage) in the semiconductor wafer when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer in a peeling operation. The resin material shall be a viscoelastic body containing a copolymer of a urethane polymer and an acrylic polymer, which is formed through a monomer having a functional group that can form a urethane bond with a urethane polymer and having an activated carbon double bond that can copolymerize with a (meth)acryloyl group, in one molecule.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 15, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi HABU, Fumiteru ASAI, Tomokazu TAKAHASHI, Eiichi IMOTO, Yuta SHIMAZAKI