Patents by Inventor Tomokazu Takahashi

Tomokazu Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120065350
    Abstract: The present invention provides a resin material which can be used for a pressure-sensitive adhesive sheet for protecting a semiconductor wafer and the like, does not cause curve (warpage) in the semiconductor wafer when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer in a peeling operation. The resin material shall be a viscoelastic body containing a copolymer of a urethane polymer and an acrylic polymer, which is formed through a monomer having a functional group that can form a urethane bond with a urethane polymer and having an activated carbon double bond that can copolymerize with a (meth)acryloyl group, in one molecule.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 15, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi HABU, Fumiteru ASAI, Tomokazu TAKAHASHI, Eiichi IMOTO, Yuta SHIMAZAKI
  • Publication number: 20120058319
    Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 8, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akiyoshi YAMAMOTO, Takashi HABU, Fumiteru ASAI, Tomokazu TAKAHASHI, Eiichi IMOTO, Yuta SHIMAZAKI
  • Publication number: 20120056338
    Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 8, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi HABU, Fumiteru ASAI, Tomokazu TAKAHASHI, Eiichi IMOTO, Yuta SHIMAZAKI
  • Publication number: 20120003470
    Abstract: Provided is an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray. The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), in which the polymer (P) includes one of a polymer obtained by causing a carboxyl group-containing polymer (P3) and an oxazoline group-containing monomer (m3) to react with each other, and a polymer obtained by causing an oxazoline group-containing polymer (P4) and a carboxyl group-containing monomer (m2) to react with each other.
    Type: Application
    Filed: July 5, 2011
    Publication date: January 5, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Katsuhiko KAMIYA, Tomokazu TAKAHASHI, Chie KITANO, Mika OKADA, Takeshi MATSUMURA, Shuhei MURATA, Hironao OTAKE, Masatsugu KOSO
  • Publication number: 20110254176
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray.
    Type: Application
    Filed: April 18, 2011
    Publication date: October 20, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI, Akiyoshi YAMAMOTO, Tomokazu TAKAHASHI
  • Publication number: 20110220268
    Abstract: The present invention aims to provide a surface protection tape for use in a dicing step, which protects a surface of a material to be cut from staining owing to attachment of dust and the like such as shavings by sticking the surface protection tape on the surface of the material to be cut in the dicing step and cutting the tape together with the material to be cut, and which is easily peeled and removed from individual chips after the dicing step.
    Type: Application
    Filed: November 19, 2009
    Publication date: September 15, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akinori Nishio, Kazuyuki Kiuchi, Tomokazu Takahashi
  • Publication number: 20110076490
    Abstract: A pressure-sensitive adhesive sheet for retaining elements according to an embodiment of the present invention includes abase material layer and a pressure-sensitive adhesive layer provided on the base material layer and capable of being cured by an external stimulus. A crack-generating elongation represented by the following equation in a case where the pressure-sensitive adhesive sheet is elongated in a state where the pressure-sensitive adhesive layer is cured is larger than 115%. Crack-generating elongation (%)=[(a length of the pressure-sensitive adhesive sheet when a crack is generated in a surface of the pressure-sensitive adhesive layer)?(an original length of the pressure-sensitive adhesive sheet)]/(the original length of the pressure-sensitive adhesive sheet)×100.
    Type: Application
    Filed: September 30, 2010
    Publication date: March 31, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yuki HIGASHIBEPPU, Tomokazu TAKAHASHI, Fumiteru ASAI
  • Publication number: 20110008949
    Abstract: An adhesive sheet for dicing a semiconductor wafer having a laminate comprises; a base film, an intermediate layer and an adhesive layer, the intermediate layer is formed by a thermoplastic resin having a melting point of 50 to 100° C.; and the base film has a higher melting point than the intermediate layer as well as a method for dicing a semiconductor wafer comprises the steps of: adhering the adhesive sheet according to the above to a corrugated surface of a semiconductor wafer, and dicing the semiconductor wafer.
    Type: Application
    Filed: July 6, 2010
    Publication date: January 13, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshimasa SUGIMURA, Tomokazu Takahashi, Noriyoshi Kawashima, Fumiteru Asai
  • Publication number: 20100273313
    Abstract: A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.
    Type: Application
    Filed: June 22, 2010
    Publication date: October 28, 2010
    Inventors: Masakatsu Urairi, Atsushi Hino, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto
  • Publication number: 20100230036
    Abstract: The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.
    Type: Application
    Filed: March 10, 2010
    Publication date: September 16, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi HABU, Fumiteru ASAI, Tomokazu TAKAHASHI, Akinori NISHIO, Toshio SHINTANI
  • Publication number: 20100080989
    Abstract: The present invention provides a pressure-sensitive adhesive sheet for laser processing, which includes a base and a pressure-sensitive adhesive layer provided on one surface of the base, the pressure-sensitive adhesive layer having an absorption coefficient at a wavelength of 355 nm of from 50 cm?1 to 900 cm?1, the pressure-sensitive adhesive layer containing a light-absorbing agent in which an absorbance of the light-absorbing agent in a 0.01% by weight acetonitrile solution at a wavelength of 355 nm is from 0.01 to 1.20, and in which the pressure-sensitive adhesive sheet is to be used at the time when a workpiece is laser-processed by a laser light having a wavelength of an ultraviolet region or a laser light enabling light absorption via multiphoton absorption process.
    Type: Application
    Filed: October 1, 2009
    Publication date: April 1, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Fumiteru ASAI, Tomokazu TAKAHASHI, Keiko MAEKAWA, Kazuhiro AOYAGI
  • Publication number: 20100032087
    Abstract: In performing the laser processing of a workpiece with laser light, there are provided a pressure-sensitive adhesive sheet for laser processing and a laser processing method that can perform the laser processing of a workpiece easily with good production efficiency by preventing the fusion of a substrate and an adsorption stage. According to the invention, an pressure-sensitive adhesive sheet for laser processing that is used for laser processing of a workpiece with laser light having a wavelength in an ultraviolet region or with laser light that enables light absorption in an ultraviolet region that has passed a multiphoton absorption process, comprising a substrate and an pressure-sensitive adhesive layer disposed on one surface of the substrate, wherein a melting point of the substrate at another surface is 80° C. or higher, and an etching rate (etching speed/energy fluence) in a case of radiating the laser light onto the other surface is 0.1 [(?m/pulse)/(J/cm2)] or lower.
    Type: Application
    Filed: June 10, 2009
    Publication date: February 11, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tomokazu TAKAHASHI, Fumiteru ASAI, Yuki HIGASHIBEPPU
  • Publication number: 20100028669
    Abstract: A re-releasable adhesive agent comprises a radiation-reactive polymer and a radiation polymerization initiator, the radiation-reactive polymer has a side chain derived from at least one monomer expressed by the formula (1): CH2?CR1COOR2 (1), where R1 is a hydrogen atom or a methyl group, and R2 is a C6 or higher alkyl group, and a side chain having one carbon-carbon double bond, and the monomer of formula (1) is contained in a ratio of less than 50 mol % with respect to the total monomer constituting the main chain of the radiation-reactive polymer.
    Type: Application
    Filed: July 27, 2009
    Publication date: February 4, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi HABU, Tomokazu Takahashi, Fumiteru Asai, Takamasa Hirayama
  • Publication number: 20090311474
    Abstract: An object of the present invention is to provide an adhesive sheet which, through improvement in the permeability of liquids originating in a liquid stream during water jet laser dicing, allows chips, IC components, or the like to be detached, prevents machining precision from being compromised such as by chipping or the scattering of chips and the like, and allows extremely thin semiconductor wafers or materials to be processed. The adhesive sheet for water jet laser dicing of the present invention comprises an adhesive layer laminated on a base film, the base film made of mesh fiber.
    Type: Application
    Filed: April 15, 2008
    Publication date: December 17, 2009
    Inventors: Tomokazu Takahashi, Fumiteru Asai, Toshio Shintani, Takatoshi Sasaki, Akiyoshi Yamamoto, Tsubasa Miki
  • Patent number: 7586060
    Abstract: A laser processing protection sheet (2) capable of effectively preventing contamination on the surface of an article to be processed by decomposition products when the article to be processed (1) is processed by the UV absorption ablation of a laser beam (7). A production method for a laser processed article (10) using the laser processing protection sheet (2). The laser processing protection sheet (2) is provided on the laser beam incident surface side of the article to be processed (1) when the article (1) is processed by the UV absorption ablation of the laser beam (7).
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: September 8, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Masakatsu Urairi, Atsushi Hino, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto
  • Patent number: 7514143
    Abstract: The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive layer, the intermediate layer having a storage elastic modulus (G?) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G?) of 1.0×103 to 8.0×104 Pa at 200° C.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: April 7, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Takeshi Matsumura, Kouji Akazawa, Kazuyuki Kiuchi, Tomokazu Takahashi
  • Publication number: 20090065133
    Abstract: The present invention relates to a pressure-sensitive adhesive sheet for dicing comprising a substrate layer and an active energy ray-curable pressure-sensitive adhesive layer provided on the substrate layer, in which the active energy ray-curable pressure-sensitive adhesive layer has a gel fraction before irradiation with an active energy ray of 50% or more. Furthermore, the invention also provides a method for dicing an adherend, which comprises attaching the pressure-sensitive adhesive sheet for dicing to an adherend, followed by cutting the adherend using a round blade. The pressure-sensitive adhesive sheet for dicing of the invention is free from leaving any adhesive residue on chips, from peeling of the pressure-sensitive adhesive sheet from the ring for fixing it, as well as from leaving any paste residue on the ring.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 12, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventor: Tomokazu TAKAHASHI
  • Publication number: 20080193728
    Abstract: Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
    Type: Application
    Filed: March 19, 2008
    Publication date: August 14, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshinori YOSHIDA, Yohei Maeno, Kouji Akazawa, Takeshi Matsumura, Tomokazu Takahashi
  • Publication number: 20080182095
    Abstract: The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film, wherein the base film is composed of mesh formed by a fiber. According to the adhesive sheet for water jet laser dicing in the present invention, a film composed of mesh is used as the base film to ensure that the perforation size and opening area are relatively larger than in nonwoven fabric and perforated sheets, thus making it possible to maintain stable permeability to liquids originating in the liquid stream during water jet laser dicing and to provide an adhesive sheet that allows extremely thin semiconductor wafers or materials to be processed while preventing die fly-off or defects such as cracking and chipping in IC components, chips, or the like.
    Type: Application
    Filed: October 31, 2007
    Publication date: July 31, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Fumiteru Asai, Takatoshi Sasaki, Tsubasa Miki, Tomokazu Takahashi, Toshio Shintani, Akiyoshi Yamamoto
  • Publication number: 20080138618
    Abstract: The present invention relates to a removable pressure-sensitive adhesive composition containing an acrylic polymer, a photopolymerization initiator and a crosslinking agent, in which the acrylic polymer and the photopolymerization initiator each are chemically bonded to the crosslinking agent. The present invention also relates to a removable pressure-sensitive adhesive composition containing an acrylic polymer and a photopolymerization initiator, the composition further containing a crosslinking agent having a reactive functional group which is capable of reacting with a reactive functional group of the acrylic polymer and a reactive functional group of the photopolymerization initiator.
    Type: Application
    Filed: December 6, 2007
    Publication date: June 12, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takatoshi Sasaki, Fumiteru Asai, Toshio Shintani, Tomokazu Takahashi