Abstract: The invention provides a method of preparing a nucleic acid population suitable for RNA sequencing. The method involves amplifying a double-stranded DNA and a poly T sequence by using the DNA constituted of any additional nucleic acid sequence X, poly T sequence, mRNA sequence isolated from a biological sample, poly A sequence and any additional nucleic acid sequence Y in this order as a template, a first primer containing any additional nucleic acid sequence X having amine added to the 5?-terminal (and a poly T sequence), and a second primer containing any additional nucleic acid sequence Y (and a poly T sequence), followed by fractionalizing the DNA, phosphorylating the DNA, preparing cDNA by using the DNA as a template and a third primer, adding adenine (A) to the cDNA, linking a DNA, and amplifying the DNA by using the DNA as a template, a fourth primer, and a fifth primer.

Abstract: An inspection apparatus includes a tester unit that applies a stimulus signal to a semiconductor apparatus, an MO crystal arranged to face a semiconductor apparatus, a light source that outputs light, an optical scanner that irradiates the MO crystal with light output from light source, a light detector that detects light reflected from the MO crystal arranged to face the semiconductor apparatus D and outputs a detection signal, and a computer that generate phase image data based on a phase difference between a reference signal generated based on a stimulus signal and the detection signal, the phase image data including a phase component indicating the phase difference, and generates an image indicating a path of a current from the phase image data.

Abstract: The recording device includes an adhesive belt extending across a plurality of rotating bodies configured to support and convey a recording medium, a first sensor configured to detect that the recording medium is separated relative to the adhesive belt in a first range, a second sensor configured to detect that the recording medium P is separated relative to the adhesive belt in a second range within the first range, a take-up unit configured to take up the recording medium, and a control unit configured to control the take-up unit so as to take up the recording medium when the first sensor detects that a separation position of the recording medium is within the first range, and control the rotating body to stop movement of the adhesive belt when the second sensor detects that the separation position of the recording medium is within the second range.

Abstract: A first device is installed at a first location in a first space visible to a user. A second device is installed at a second location in a second space not visible to the user. A device control method acquires line-of-sight information indicating a line-of-sight direction of the user from a camera. The line-of-sight direction of the user is determined based on the line-of-sight information. In a case where the line-of-sight direction indicates a third location other than the first location, the second device is identified as an object of control. Sound data indicating speech of the user is acquired from a microphone, a control command corresponding to the sound data is generated, and the control command is transmitted to the object of control.

Abstract: A system and a method capable of identifying a heat source position corresponding to a failure portion are provided. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a semiconductor device, and includes a tester that applies an AC signal to the semiconductor device, an infrared camera that detects light from the semiconductor device according to the AC signal and outputs a detection signal, and a data analysis unit that identifies the heat source position based on the detection signal.

Abstract: A heat source position inside a measurement object is identified with high accuracy by improving time resolution. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a measurement object, and includes a condition setting unit that sets a measurement point for one surface of the measurement object, a tester that applies a stimulation signal to the measurement object, a light source that irradiates the measurement point of the measurement object with light, a photo detector that detects light reflected from a predetermined measurement point on the surface of the measurement object according to the irradiation of light and outputs a detection signal, and an analysis unit that derives a distance from the measurement point to the heat source position based on the detection signal and the stimulation signal and identifies the heat source position.

Abstract: A method for controlling an autonomous device that moves in two dimensions using a controller includes obtaining a first image at a first position, which is a destination of the autonomous device, calculating, from the first image, first feature values indicating certain characteristics of the first image, referring to map information indicating correspondences between coordinate information indicating coordinates of defined positions included in a movement area of the autonomous device and second feature values, which are calculated from second images and indicate certain characteristics of the second images and identifying, by referring to the map information, a second position corresponding to second feature values having at least a predetermined degree of correspondence to the feature values generating a command for moving the autonomous device to the second position on the basis of coordinate information corresponding to the second position, and transmitting the command to the autonomous device.

Abstract: An inkjet recording apparatus is provided that comprises a printing section, a belt-type medium conveyance section, a support section, and a gap adjustment section. The printing section has an inkjet head and performs printing on a recording medium. The medium conveyance section conveys the recording medium. The support section supports the medium conveyance section. The gap adjustment section has first and second adjustment sections that are placed across the medium conveyance section, an input section that operates the first adjustment section, and an interlock section that interlocks the first adjustment section and the second adjustment section. The first and second adjustment sections are movable in parallel to an adjustment direction to move the printing section in the adjustment direction and adjust a gap between the inkjet head and the medium conveyance section in the adjustment direction.

Abstract: A hollow seal member integrally molded with an installation base member includes a first hollow wall with a first bent point as a part bendable toward an outside and a second hollow wall with a second bent point as a part bendable toward the outside. A protrusion is formed on an end of a second outer-cabin side wall, which is continuous with an outer surface of the second outer-cabin side wall, protrudes upward with respect to the first hollow wall, and makes elastic contact with a door. An end of a first outer-cabin side wall connects with a position on the second outer-cabin side wall as an inner side of the hollow seal member, from which the protrusion protrudes toward the outer-cabin side. A thick part, which protrudes toward an outer side, is formed on the first outer-cabin side wall as the outer side of the hollow seal member.

Abstract: An observation apparatus includes a laser light source, a scanning optical system irradiating a semiconductor device with laser light output from the laser light source, a bias power supply applying a reverse bias voltage of a predetermined voltage between electrodes of the semiconductor device, a sensor detecting an electrical property occurring in the semiconductor device in response to the laser light, and a control system generating an electrical property image of the semiconductor device based on a detection signal from the sensor. The bias power supply gradually increases a magnitude of the predetermined voltage until the predetermined voltage reaches a voltage at which avalanche amplification occurs in the semiconductor device. When the predetermined voltage is increased, the scanning optical system irradiates with the laser light, the sensor detects the electrical property, and the control system generates the electrical property image.

Abstract: An inspection device includes a light source, an MO crystal disposed to face a semiconductor device (D), an object lens configured to concentrate the light output from the light source onto the MO crystal, a holder configured to hold the MO crystal, a flexible member interposed between the MO crystal and the holder, and an object lens drive unit configured to cause the MO crystal to contact the semiconductor device (D) by causing the holder to be moved in the optical axis direction of the object lens, wherein, when the MO crystal contacts the semiconductor device (D), the flexible member is bent, so that an incident plane is inclined in a range in which an inclination angle of the incident plane of the light in the MO crystal with respect to a plane orthogonal to the optical axis is less than or equal to an aperture angle.

Abstract: A semiconductor device inspection system includes a laser light source for generating light to be irradiated a semiconductor device, an optical sensor for detecting the light reflected by the semiconductor device and outputting the detection signal, a tester unit for applying a operating signal to the semiconductor device, an electricity measurement unit to which the detection signal is input, an electricity measurement unit to which the detection signal and the operating signal are selectively input, and a switching unit having a detection signal terminal and a operating signal terminal. The switching unit inputs the detection signal to the electricity measurement unit by connecting a connection section to the detection signal terminal and inputs the operating signal by connecting the connection section to the operating signal terminal.

Abstract: A heat generation point detection method comprises: step of stabilizing an average temperature of a surface of an integrated circuit S; steps of applying a bias voltage of a low frequency to the integrated circuit S and acquiring a heat generation detection signal detected from the integrated circuit S in response thereto; steps of supplying a bias voltage of a high frequency and acquiring a heat generation detection signal detected in response thereto; steps of detecting a phase shift between the bias voltage of the low frequency and the heat generation detection signal and a phase shift between the bias voltage of the high frequency and the heat generation detection signal; and step of calculating a change rate of the phase shift against a square root of the frequency of the bias voltage, and obtaining depth information of the heat generation point from the change rate.

Abstract: A heat generation point detection method comprises steps S01, S02 of applying a low frequency bias voltage to an integrated circuit S and acquiring a heat generation detection signal detected from the integrated circuit S in response thereto, steps S03, S04 of supplying a high frequency bias voltage to the integrated circuit S and acquiring a heat generation detection signal detected from the integrated circuit S in response thereto, steps S05 to S07 of detecting a phase shift between the low frequency bias voltage and the heat generation detection signal and a phase shift between the high frequency bias voltage and the heat generation detection signal, and a step S08 of calculating a change rate of the phase shift against a square root of the frequency of the bias voltage, based on those phase shits, and acquiring depth information of a heat generation point from the change rate.

Abstract: A semiconductor device inspection system (1) includes a laser beam source (2), for emitting light, an optical sensor (12) for detecting the light reflected by the semiconductor device (10) from the light and outputting a detection signal, a frequency band setting unit (16) for setting a measurement frequency band and a reference frequency band with respect to the detection signal, a spectrum analyzer (15) for generating a measurement signal and a reference signal from the detection signals in the measurement frequency band and the reference frequency band, and a signal acquisition unit (17) for calculating a difference between the measurement signal and the reference signal to acquire an analysis signal. The frequency band setting unit (16) sets the reference frequency band to a frequency domain in which a level of the detection signal is lower than a level obtained by adding 3 decibels to a white noise level serving as a reference.

Abstract: The recording device includes an adhesive belt extending across a plurality of rotating bodies configured to support and convey a recording medium, a first sensor configured to detect that the recording medium is separated relative to the adhesive belt in a first range, a second sensor configured to detect that the recording medium P is separated relative to the adhesive belt in a second range within the first range, a take-up unit configured to take up the recording medium, and a control unit configured to control the take-up unit so as to take up the recording medium when the first sensor detects that a separation position of the recording medium is within the first range, and control the rotating body to stop movement of the adhesive belt when the second sensor detects that the separation position of the recording medium is within the second range.

Abstract: A semiconductor device measurement apparatus 1A includes a tester 2 that generates an operational pulse signal to be input to a semiconductor device 3, a light source 5 that generates light, a light branch optical system 6 that irradiates the semiconductor device with the light, a light detector 7 that detects reflected light obtained by the semiconductor device 3 reflecting the light, and outputs a detection signal, an analog signal amplifier 8 that amplifies the detection signal and outputs an amplified signal, and an analysis apparatus 10 that analyzes an operation of the semiconductor device 3 based on the amplified signal and a predetermined correction value, wherein the predetermined correction value is obtained based on a signal obtained by the analog signal amplifier 8 amplifying a signal corresponding to a harmonic of a fundamental frequency of the operational pulse signal.

Abstract: A semiconductor device inspection system includes a laser light source for generating light to be irradiated a semiconductor device, an optical sensor for detecting the light reflected by the semiconductor device and outputting the detection signal, a tester unit for applying a operating signal to the semiconductor device, an electricity measurement unit to which the detection signal is input, an electricity measurement unit to which the detection signal and the operating signal are selectively input, and a switching unit having a detection signal terminal and a operating signal terminal. The switching unit inputs the detection signal to the electricity measurement unit by connecting a connection section to the detection signal terminal and inputs the operating signal by connecting the connection section to the operating signal terminal.

Abstract: A semiconductor device testing apparatus 1A includes a tester unit 16 that generates an operational pulse signal, an optical sensor 10 that outputs a detection signal as a response to the operational pulse signal, a pulse generator 17 that generates a reference signal containing a plurality of harmonics for the operational pulse signal in synchronization with the operational pulse signal, a spectrum analyzer 13 that receives the detection signal and acquires a phase and amplitude of the detection signal at a detection frequency, a spectrum analyzer 14 that receives the reference signal and acquires a phase of the reference signal at a detection frequency, and an analysis control unit 18 that acquires a time waveform of the detection signal based on the phase and the amplitude of the detection signal acquired by the spectrum analyzer 13 and the phase of the reference signal acquired by the spectrum analyzer 14.

Abstract: A method for a device connected to a first control device and a second control device, including: transmitting a command for causing a first device to execute a predetermined operation, the first device being controlled by the first control device; transmitting a command for causing the first device to transmit first information indicating a state of the first device after the predetermined operation is executed; transmitting a third command for causing a second device to transmit second information indicating a state of the second device; receiving the first information and the second information; comparing the first information and the second information; and storing, in a memory, third information indicating the first device is controlled by the first control device and the second control device when the first device is determined to be the second device based on the first information and the second information.