Abstract: An object of the invention is to provide a transparent conductive film having good processability and to provide a method for production thereof. The pressure-sensitive adhesive layer-carrying transparent conductive film of the invention comprises: an amorphous transparent conductive laminate comprising a transparent plastic film substrate and an amorphous transparent conductive thin film provided on one side of the transparent plastic film substrate; a pressure-sensitive adhesive layer; and a release film that is provided on another side of the transparent plastic film substrate with the pressure-sensitive adhesive layer interposed therebetween and comprises at least a film substrate, wherein the release film is thicker than the amorphous transparent conductive laminate, and a value obtained by subtracting the thermal shrinkage percentage of the release film in the MD direction from the thermal shrinkage percentage of the amorphous transparent conductive laminate in the MD direction is from ?0.3% to 0.45%.

Abstract: The transparent conductive film of the present invention is a transparent conductive film, comprising: a transparent film substrate; a patterned transparent conductive layer formed on one side of the transparent film substrate; and a colored layer provided on at least one of an opposite side of the transparent conductive layer from the transparent film substrate and an opposite side of the transparent film substrate from the transparent conductive layer, wherein the colored layer has an average absorptance of from 35% to 90% for light in the wavelength range of from 380 nm to 780 nm.

Abstract: The transparent conductive film of the present invention is a transparent conductive film, comprising a transparent film substrate, and a first transparent dielectric layer, a second transparent dielectric layer and a transparent conductive layer that are formed on one or both sides of the transparent film substrate in this order from the transparent film substrate side, wherein the transparent conductive layer is patterned, the relation n2<n3<n1 is satisfied, wherein n1 is the refractive index of the first transparent dielectric layer, n2 is the refractive index of the second transparent dielectric layer, and n3 is the refractive index of the transparent conductive layer, the first transparent dielectric layer has a thickness of from 2 nm to less than 10 nm, the second transparent dielectric layer has a thickness of from 20 nm to 55 nm, and the transparent conductive layer has a thickness of from 15 nm to 30 nm.

Abstract: The transparent conductive film of the present invention is a transparent conductive film, comprising a transparent film substrate, and a first transparent dielectric layer, a second transparent dielectric layer and a patterned transparent conductive layer that are formed on one or both sides of the transparent film substrate in this order from the transparent film substrate side, wherein the transparent conductive layer has a thickness of 31 nm or more, the first transparent dielectric layer has a thickness of from 7 nm to 16 nm, the second transparent dielectric layer has a thickness of from 30 nm to 60 nm, and the relation n2<n3?n1 is satisfied, wherein n1 is the refractive index of the first transparent dielectric layer, n2 is the refractive index of the second transparent dielectric layer, and n3 is the refractive index of the transparent conductive layer.

Abstract: The transparent conductive laminate of the present invention is a transparent conductive laminate, comprising: a transparent film substrate; a transparent conductive thin film provided on one side of the transparent film substrate with a dielectric thin film interposed therebetween; and a transparent substrate bonded to another side of the transparent film substrate with a transparent pressure-sensitive adhesive layer interposed therebetween, wherein the transparent substrate comprises at least two transparent base films laminated with the transparent pressure-sensitive adhesive layer interposed therebetween, and the dielectric thin film comprises a first transparent dielectric thin film consisting of a SiOx (x is from 1.5 to less than 2) film having a relative refractive index of 1.6 to 1.9, and a second transparent dielectric thin film consisting of a SiO2 film. This feature can improve the surface contact pressure durability.

Abstract: A transparent conductive film comprising a transparent film base material, a resin layer having a fine uneven geometrical structure, and a transparent conductive thin film laminated on the film base material through the resin layer, wherein the surface of the transparent conductive thin film has an average centerline roughness (Ra) of 0.11 to 0.18 ?m, the maximum height (Ry) of 0.9 to 1.6 ?m and the average distance between peaks (S) of 0.05 to 0.11 mm. The film can prevent the formation of a Newton's ring and shows satisfactory durability (particularly, pen input durability) and satisfactory display property without buzzing.

Abstract: A transparent crystalline electrically-conductive thin film of the present invention comprises an indium tin oxide as a main component, wherein the indium tin oxide contains 9% by weight or less of tin oxide based on the total amount of indium oxide and tin oxide, wherein the transparent crystalline electrically-conductive thin film contains 0.45 atomic % or less of nitrogen. The transparent crystalline electrically-conductive thin film of the present invention has a high resistance value and good reliability in a high-temperature, high-humidity environment.

Abstract: There is provided a transparent conductive film having a transparent conductor layer with a high level of pen input durability and high-temperature, high-humidity reliability. The transparent conductive film of the present invention is a transparent conductive film, comprising: a transparent film substrate; a transparent conductor layer that is provided on one side of the transparent film substrate and has a thickness d of 15 nm to 35 nm and an average surface roughness Ra of 0.37 nm to 1 nm; and at least a single layer of an undercoat layer interposed between the transparent film substrate and the transparent conductor layer.

Abstract: A transparent conductive laminate of the invention comprises: a transparent film substrate; a transparent conductive thin film provided on one side of the transparent film substrate; and a transparent base substrate bonded to another side of the transparent film substrate with a transparent pressure-sensitive adhesive layer interposed therebetween, wherein the transparent conductive thin film comprises a first transparent conductive thin film made of an indium-tin complex oxide in which SnO2/(SnO2+In2O3) is from 2 to 6% by weight and a second transparent conductive thin film made of an indium-tin complex oxide in which SnO2/(SnO2+In2O3) is more than 6% by weight and not more than 20% by weight, the first and second transparent conductive thin films are formed in this order from the transparent film substrate side, the thickness t1 of the first transparent conductive thin film and the thickness t2 of the second transparent conductive thin film have the following relationships: (1) t1 is from 10 to 30 nm; (2) t

Abstract: A transparent conductive film includes: a transparent film substrate; a transparent conductor layer provided on one or both sides of the transparent film substrate; and at least one undercoat layer interposed between the transparent film substrate and the transparent conductor layer; wherein: the transparent conductor layer is patterned; and a non-patterned portion not having the transparent conductor layer has the at least one undercoat layer.

Abstract: A transparent conductive laminate includes: a first transparent dielectric thin film; a second transparent dielectric thin film; a transparent conductive thin film; a transparent film substrate having a thickness of 2 ?m to 200 ?m, and the first transparent dielectric thin film, the second transparent dielectric thin film, and the transparent conductive thin film formed on one side of the substrate in this order; a transparent pressure-sensitive adhesive layer; and a transparent base substrate bonded to another side of the transparent film substrate with a transparent pressure-sensitive adhesive layer interposed therebetween, wherein the first transparent dielectric thin film is formed by vacuum deposition, sputtering or ion plating and comprises a complex oxide containing 100 parts by weight of indium oxide, 0 to 20 parts by weight of tin oxide and 10 to 40 parts by weight of cerium oxide, a refractive index n1 of the first transparent dielectric thin film, a refractive index n2 of the second transparent die

Abstract: The present invention provides a transparent conductive film having: a transparent base film; a transparent SiOx thin film having a thickness of from 10 to 100 nm, a refractive index of from 1.40 to 1.80 and an average surface roughness Ra of from 0.8 to 3.0 nm, wherein x is from 1.0 to 2.0; and a transparent conductive thin film including an indium-tin complex oxide, which has a thickness of from 20 to 35 nm and a ratio of SnO2/(In2O3+SnO2) of from 3 to 15 wt %, wherein the transparent conductive thin film is disposed on one side of the transparent base film through the transparent SiOx thin film.

Abstract: A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.

Abstract: The present invention provides a transparent conductive film having: a transparent base film; a transparent SiOx thin film having a thickness of from 10 to 100 nm, a refractive index of from 1.40 to 1.80 and an average surface roughness Ra of from 0.8 to 3.0 nm, wherein x is from 1.0 to 2.0; and a transparent conductive thin film including an indium-tin complex oxide, which has a thickness of from 20 to 35 nm and a ratio of SnO2/(In2O3+SnO2) of from 3 to 15 wt %, wherein the transparent conductive thin film is disposed on one side of the transparent base film through the transparent SiOx thin film.

Abstract: A transparent conductive multilayer body of the invention comprises a transparent film substrate with a thickness of 2 to 120 ?m; a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film laminated in this order on one side of the transparent film substrate; and a transparent substrate bonded to the other side of the film substrate through a transparent pressure-sensitive adhesive layer, wherein the second dielectric thin film is made of an inorganic material or a mixture of an organic material and an inorganic material, and the conductive thin film contains a crystalline material in which the content of crystal particles whose maximum particle sizes are at most 300 nm is higher than 50% by area. Such a transparent conductive multilayer body fully satisfies the pen input bending durability for a touch panel.

Abstract: A touch panel of the invention comprises a first panel having a first film base with transparency and a first transparent conductive thin film provided on one surface of the first film base; and a second panel having a second film base with transparency and a second transparent conductive thin film provided on one surface of the second film base, wherein the first panel and the second panel are arranged so as to face each other with a spacer therebetween, in such a manner that the first conductive thin film and the second conductive thin film face each other, wherein the surface of the first conductive thin film has a hardness of 1 GPa or more and a modulus of elasticity of 5 GPa or more, the surface of the second conductive thin film has a center line average roughness (Ra) of 0.3 nm to 1.0 nm, and that of the center line average roughness (Ra) of the surface of the second conductive thin film is smaller than that of the surface of the first conductive thin film. The touch panel has good durability.

Abstract: A transparent conductive multilayer body of the present invention is characterized by having: a transparent film base; an SiOx film (x is no less than 1.5 and less than 2) which is provided on one surface of the above described film base in accordance with a dry process, and has a thickness of 1 nm to 30 nm and a relative index of refraction of 1.6 to 1.9; an SiO2 film which is provided on the above described SiOx film and has a thickness of 10 nm to 50 nm; and a transparent conductive thin film which is provided on the above described SiO2 film and has a thickness of 20 nm to 35 nm.

Abstract: A transparent conductive laminated body comprising: a transparent film substrate having a thickness of 2 to 200 ?m, and a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film that are formed on one side of the substrate in this order from the side of the substrate, wherein the first transparent dielectric thin film is formed by vacuum deposition, sputtering or ion plating and comprises a complex oxide containing 0 to 20 parts by weight of tin oxide and 10 to 40 parts by weight of cerium oxide relative to 100 parts by weight of indium oxide, and the relationship: n2<n3?n1 is satisfied, where n1 is the refractive index of the first transparent dielectric thin film, n2 is the refractive index of the second transparent dielectric thin film, and n3 is the refractive index of the transparent conductive thin film, suppresses coloration of transmitted light and is produced with high productivity.

Abstract: The present invention provides a touch panel having: a first panel board having a first base layer and a first conductive thin film disposed on one side of the first base layer; and a second panel board having a second base layer and a second conductive thin film disposed on one side of the second base layer; wherein the first panel board and the second panel board are arranged thorough a spacer so that the first conductive thin film and the second conductive thin film face each other, wherein the distance between the first conductive thin film and the second conductive thin film is from 20 to 100 ?m, wherein the touch panel has a pushing angle of 3.9° or less at a point distant from an electrode provided at an end portion of the first panel board by 1.5 mm.

Abstract: The present invention provides a touch panel having: a first panel board having a first base layer and a first conductive thin film disposed on one side of the first base layer; and a second panel board having a second base layer and a second conductive thin film disposed on one side of the second base layer; wherein the first panel board and the second panel board are arranged thorough a spacer so that the first conductive thin film and the second conductive thin film face each other, wherein the distance between the first conductive thin film and the second conductive thin film is from 20 to 100 ?m, wherein the touch panel has a pushing angle of 3.9° or less at a point distant from an electrode provided at an end portion of the first panel board by 1.5 mm.