Patents by Inventor Tomoyuki Hirano
Tomoyuki Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10412287Abstract: The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.Type: GrantFiled: January 18, 2019Date of Patent: September 10, 2019Assignee: Sony CorporationInventors: Yoshiaki Masuda, Yuki Miyanami, Hideshi Abe, Tomoyuki Hirano, Masanari Yamaguchi, Yoshiki Ebiko, Kazufumi Watanabe, Tomoharu Ogita
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Patent number: 10332921Abstract: The present disclosure relates to a solid-state image sensing device capable of restricting an occurrence of a dark current and a method for manufacturing the same, and an electronic device. A solid-state image sensing device includes a FD part formed on a P-type semiconductor substrate by implanting an N-type impurity, a high-dielectric insulative film laminated on at least the FD part, and a contact electrode connected to the FD part in a connection structure via the high-dielectric insulative film. For example, the high-dielectric insulative film is formed by use of a material which reduces the schottky barrier height in a connection part between the FD part and the electrode in a single layer or in a plurality of layers. The present technology is applicable to CMOS image sensors, for example.Type: GrantFiled: September 27, 2016Date of Patent: June 25, 2019Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Tsukasa Miura, Shuji Manda, Tomoyuki Hirano, Junpei Yamamoto, Kazunobu Ota
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Patent number: 10326920Abstract: The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.Type: GrantFiled: July 19, 2018Date of Patent: June 18, 2019Assignee: Sony CorporationInventors: Yoshiaki Masuda, Yuki Miyanami, Hideshi Abe, Tomoyuki Hirano, Masanari Yamaguchi, Yoshiki Ebiko, Kazufumi Watanabe, Tomoharu Ogita
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Publication number: 20190174034Abstract: The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.Type: ApplicationFiled: January 18, 2019Publication date: June 6, 2019Applicant: SONY CORPORATIONInventors: Yoshiaki MASUDA, Yuki MIYANAMI, Hideshi ABE, Tomoyuki HIRANO, Masanari YAMAGUCHI, Yoshiki EBIKO, Kazufumi WATANABE, Tomoharu OGITA
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Publication number: 20190174033Abstract: The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.Type: ApplicationFiled: January 18, 2019Publication date: June 6, 2019Applicant: SONY CORPORATIONInventors: Yoshiaki MASUDA, Yuki MIYANAMI, Hideshi ABE, Tomoyuki HIRANO, Masanari YAMAGUCHI, Yoshiki EBIKO, Kazufumi WATANABE, Tomoharu OGITA
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Publication number: 20190057990Abstract: Solid-state imaging devices, methods of producing a solid-state imaging device, and electronic apparatuses are provided. More particularly, a solid-state image device includes a silicon substrate, and at least a first photodiode formed in the silicon substrate. The device also includes an epitaxial layer with a first surface adjacent a surface of the silicon substrate, and a transfer transistor with a gate electrode that extends from the at least a first photodiode to a second surface of the epitaxial layer opposite the first surface. In further embodiments, a solid-state imaging device with a plurality of pixels formed in a second semiconductor substrate wherein the pixels are symmetrical with respect to a center point is provided.Type: ApplicationFiled: October 24, 2018Publication date: February 21, 2019Applicant: SONY CORPORATIONInventors: Yosuke TANAKA, Toshifumi WAKANO, Keiji TATANI, Takashi NAGANO, Hayato IWAMOTO, Keiichi NAKAZAWA, Tomoyuki HIRANO, Shinpei YAMAGUCHI, Shunsuke MARUYAMA
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Publication number: 20190043901Abstract: The present technology relates to a solid-state imaging element configured so that pixels can be more reliably separated, a method for manufacturing the solid-state imaging element, and an electronic apparatus. The solid-state imaging element includes a photoelectric converter, a first separator, and a second separator. The photoelectric converter is configured to perform photoelectric conversion of incident light. The first separator configured to separate the photoelectric converter is formed in a first trench formed from a first surface side. The second separator configured to separate the photoelectric converter is formed in a second trench formed from a second surface side facing a first surface. The present technology is applicable to an individual imaging element mounted on, e.g., a camera and configured to acquire an image of an object.Type: ApplicationFiled: April 11, 2017Publication date: February 7, 2019Inventors: Hideyuki HONDA, Tetsuya UCHIDA, Toshifumi WAKANO, Yusuke TANAKA, Yoshiharu KUDOH, Hirotoshi NOMURA, Tomoyuki HIRANO, Shinichi YOSHIDA, Yoichi UEDA, Kosuke NAKANISHI
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Publication number: 20190019824Abstract: Solid-state imaging devices, methods of producing a solid-state imaging device, and electronic apparatuses are provided. More particularly, a solid-state image device includes a silicon substrate, and at least a first photodiode formed in the silicon substrate. The device also includes an epitaxial layer with a first surface adjacent a surface of the silicon substrate, and a transfer transistor with a gate electrode that extends from the at least a first photodiode to a second surface of the epitaxial layer opposite the first surface. In further embodiments, a solid-state imaging device with a plurality of pixels formed in a second semiconductor substrate wherein the pixels are symmetrical with respect to a center point is provided.Type: ApplicationFiled: September 4, 2018Publication date: January 17, 2019Applicant: SONY CORPORATIONInventors: Yosuke TANAKA, Toshifumi WAKANO, Keiji TATANI, Takashi NAGANO, Hayato IWAMOTO, Keiichi NAKAZAWA, Tomoyuki HIRANO, Shinpei YAMAGUCHI, Shunsuke MARUYAMA
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Publication number: 20180350854Abstract: The present disclosure relates to a solid-state image sensing device capable of restricting an occurrence of a dark current and a method for manufacturing the same, and an electronic device. A solid-state image sensing device includes a FD part formed on a P-type semiconductor substrate by implanting an N-type impurity, a high-dielectric insulative film laminated on at least the FD part, and a contact electrode connected to the FD part in a connection structure via the high-dielectric insulative film. For example, the high-dielectric insulative film is formed by use of a material which reduces the schottky barrier height in a connection part between the FD part and the electrode in a single layer or in a plurality of layers. The present technology is applicable to CMOS image sensors, for example.Type: ApplicationFiled: September 27, 2016Publication date: December 6, 2018Inventors: TSUKASA MIURA, SHUJI MANDA, TOMOYUKI HIRANO, JUNPEI YAMAMOTO, KAZUNOBU OTA
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Publication number: 20180324339Abstract: The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.Type: ApplicationFiled: July 19, 2018Publication date: November 8, 2018Applicant: SONY CORPORATIONInventors: Yoshiaki MASUDA, Yuki MIYANAMI, Hideshi ABE, Tomoyuki HIRANO, Masanari YAMAGUCHI, Yoshiki EBIKO, Kazufumi WATANABE, Tomoharu OGITA
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Publication number: 20180284606Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including: a base component which exhibits changed solubility in a developing solution under action of acid and a fluorine additive component which exhibits decomposability to an alkali developing solution, the fluorine additive component including a fluorine resist component having a structural unit derived from a compound represented by general formula (f1-1) in which W represents a polymerizable group-containing group; Rf1 and Rf2 each independently represents a hydrogen atom or an electron-withdrawing group; and Rf3 represents a hydrocarbon groupType: ApplicationFiled: March 22, 2018Publication date: October 4, 2018Inventors: Tomoyuki HIRANO, Takaaki KAIHO
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Patent number: 10044918Abstract: The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.Type: GrantFiled: September 29, 2017Date of Patent: August 7, 2018Assignee: Sony CorporationInventors: Yoshiaki Masuda, Yuki Miyanami, Hideshi Abe, Tomoyuki Hirano, Masanari Yamaguchi, Yoshiki Ebiko, Kazufumi Watanabe, Tomoharu Ogita
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Patent number: 9890233Abstract: A polymeric compound including a structural unit (a0) represented by general formula (a0-1) shown below and a polycyclic group-containing structural unit (a2m) other than the structural unit (a0), the structural unit (a2m) containing a lactone-containing polycyclic group, a —SO2-containing polycyclic group or a carbonate-containing polycyclic group, and a resist composition including the same: wherein R0 represents a hydrocarbon group of 1 to 6 carbon atoms which may have a substituent, or a hydrogen atom; Ya0 represents a single bond or a divalent linking group; L represents an ester bond; and Ra0 represents a polycyclic group having a bridged ring polycyclic skeleton or a condensed ring polycyclic skeleton, which has in its skeleton —C(?O)O— or —SO2—, and at least one of an alkyl group, an alkoxy group, a halogen atom and a halogenated alkyl group.Type: GrantFiled: January 14, 2015Date of Patent: February 13, 2018Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Miki Shinomiya, Tomoyuki Hirano, Kotaro Endo, Yuta Iwasawa
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Publication number: 20180027157Abstract: The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.Type: ApplicationFiled: September 29, 2017Publication date: January 25, 2018Inventors: Yoshiaki MASUDA, Yuki MIYANAMI, Hideshi ABE, Tomoyuki HIRANO, Masanari YAMAGUCHI, Yoshiki EBIKO, Kazufumi WATANABE, Tomoharu OGITA
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Patent number: 9862695Abstract: Disclosed is a monomer containing an N-acylcarbamoyl group and a lactone skeleton. The monomer is exemplified by Formula (1): where Ra is selected typically from hydrogen and C1-C6 alkyl; R1 is, independently in each occurrence, selected typically from halogen and optionally halogenated C1-C6 alkyl; “A” is selected from C1-C6 alkylene, oxygen, sulfur, and non-bond; m represents an integer of 0 to 8; X represents, independently in each occurrence, specific N-acylcarbamoyl; n represents an integer of 1 to 9; and Y represents a C1-C6 divalent organic group.Type: GrantFiled: August 25, 2015Date of Patent: January 9, 2018Assignees: DAICEL CORPORATION, TOKYO OHKA KOGYO CO., LTD.Inventors: Hiroshi Koyama, Masamichi Nishimura, Naoki Yamashita, Yoshitaka Komuro, Tomoyuki Hirano, Yoshiyuki Utsumi
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Patent number: 9846364Abstract: A method of forming a resist pattern including forming a first resist pattern on a substrate; applying a cross-linking composition so as to cover the first resist pattern; heating the covered first resist pattern and crosslinking an isocyanate group in the cross-linking composition with the first resist pattern; and developing the covered first resist pattern, wherein the cross-linking composition includes a blocked isocyanate compound having a protected isocyanate group.Type: GrantFiled: May 19, 2016Date of Patent: December 19, 2017Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Tomoyuki Hirano, Junichi Tsuchiya, Takayoshi Mori
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Patent number: 9819846Abstract: The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.Type: GrantFiled: June 20, 2014Date of Patent: November 14, 2017Assignee: Sony CorporationInventors: Yoshiaki Masuda, Yuki Miyanami, Hideshi Abe, Tomoyuki Hirano, Masanari Yamaguchi, Yoshiki Ebiko, Kazufumi Watanabe, Tomoharu Ogita
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Patent number: 9794457Abstract: The present disclosure relates to a solid-state imaging device, a method for manufacturing the same, and an electronic apparatus capable of improving sensitivity while suppressing degradation of color mixture. The solid-state imaging device includes an anti-reflection portion having a moth-eye structure provided on a boundary surface on a light-receiving surface side of a photoelectric conversion region of each pixel arranged two-dimensionally, and an inter-pixel light-blocking portion provided below the boundary surface of the anti-reflection portion to block incident light. In addition, the photoelectric conversion region is a semiconductor region, and the inter-pixel light-blocking portion has a trench structure obtained by digging the semiconductor region in a depth direction at a pixel boundary. The techniques according to the present disclosure can be applied to, for example, a solid-state imaging device of a rear surface irradiation type.Type: GrantFiled: June 20, 2014Date of Patent: October 17, 2017Assignee: Sony CorporationInventors: Yoshiaki Masuda, Yuki Miyanami, Hideshi Abe, Tomoyuki Hirano, Masanari Yamaguchi, Yoshiki Ebiko, Kazufumi Watanabe, Tomoharu Ogita
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Patent number: 9696625Abstract: A method of forming a resist pattern, including: step A in which a first resist pattern is formed on a substrate, step B in which a basic composition is applied to cover the first resist pattern, step C in which a base contained in the basic composition and the first resist pattern are neutralized to form a developing solution insoluble region on a surface of the first resist pattern, and step D in which the covered first resist pattern is developed, the basic composition containing a basic component, and the basic component containing a polymeric compound having a structural unit (x0) represented by general formula (x0-1) (R is H, C1˜5 alkyl group, C1˜5 halogenated alkyl group; Vx01 is divalent hydrocarbon group having ether bond or amide bond or divalent aromatic hydrocarbon group; Yx01 is single bond or divalent linking group; Rx1 is substituent having nitrogen atom).Type: GrantFiled: October 15, 2015Date of Patent: July 4, 2017Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Tomoyuki Hirano, Junichi Tsuchiya, Rikita Tsunoda, Tomonari Sunamichi, Takayoshi Mori
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Publication number: 20160349617Abstract: A method of forming a resist pattern including forming a first resist pattern on a substrate; applying a cross-linking composition so as to cover the first resist pattern; heating the covered first resist pattern and crosslinking an isocyanate group in the cross-linking composition with the first resist pattern; and developing the covered first resist pattern, wherein the cross-linking composition includes a blocked isocyanate compound having a protected isocyanate group.Type: ApplicationFiled: May 19, 2016Publication date: December 1, 2016Inventors: Tomoyuki HIRANO, Junichi TSUCHIYA, Takayoshi MORI