Abstract: A package has its internal space divided into a top compartment and a bottom compartment. The bottom compartment contains the engine. The top compartment is further divided by a partition wall into a first top compartment (e.g., a radiator chamber) and a second top compartment (e.g., a device installation chamber). The partition wall has a spatial connection port. The second top compartment has an external wall panel (e.g., the rear, upper panel) located facing the spatial connection port, the external wall panel having a vent (e.g., a gallery) formed therethrough. There is provided a duct-shaped heatsink to deliver outside air introduced through the vent to the spatial connection port. Electric components, such as an inverter, are disposed directly on an external surface of the heatsink (on the top face).

Abstract: A method for manufacturing a printed wiring board including providing a starting material including an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface of the insulating resin substrate such that a first opening portion having an opening on the first surface is formed, irradiating laser upon the second surface of the insulating resin substrate such that a second opening portion having an opening on the second surface and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming a first conductor on the first surface of the insulating resin substrate, forming a second conductor on the second surface of the insulating resin substrate, and forming a through hole conductor structure in the penetrating-hole to electrically connecting the first conductor and the second conductor.

Abstract: A multilayered printed circuit board including a substrate, a multilayered structure formed on the substrate and including multiple conductor circuits and multiple interlaminar resin insulating layers, and a stack-via structure having multiple via-holes and formed in the multilayered structure such that the via-holes are piled through the interlaminar resin insulating layers in the multilayered structure. The interlaminar resin insulating layers include an outermost interlaminar resin insulating layer forming an outermost layer of the interlaminar resin insulating layers and having a coefficient of linear expansion which is equal to or smaller than coefficients of linear expansion of the interlaminar resin insulating layers other than the outermost interlaminar resin insulating layer.

Abstract: A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.

Abstract: A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material.

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract: A multilayered printed circuit board including a substrate, a multilayered structure formed on the substrate and including multiple conductor circuits and multiple interlaminar resin insulating layers, and a stack-via structure having multiple via-holes and formed in the multilayered structure such that the via-holes are piled through the interlaminar resin insulating layers in the multilayered structure. The interlaminar resin insulating layers include an outermost interlaminar resin insulating layer forming an outermost layer of the interlaminar resin insulating layers and having a coefficient of linear expansion which is equal to or smaller than coefficients of linear expansion of the interlaminar resin insulating layers other than the outermost interlaminar resin insulating layer.

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract: A multilayered printed circuit board including a substrate, a multilayered structure built thereon and having conductor circuits and interlaminar resin insulating layers in an alternate fashion, and one or more stack-via structures including via-holes stacked one another and electrically connected to the conductor circuits through the insulating layers. Each of the via-holes includes a land portion formed on a respective one of the insulating layers and a filled via structure portion filling an opening of the respective one of the insulating layers with a metal layer such that the via-holes are stacked one another immediately above the filled via structure portion of each via-hole, the via-holes include the outermost layer via-hole in the outermost layer of the insulating layers, and one or more via-holes have the land portion having the land diameter which is larger than the land diameter of the land portion of the outermost layer via-hole.

Abstract: A multilayered printed wiring board includes a multilayered core substrate having multiple insulation layers and one or more stacked via structure formed through the multiple insulation layers, and a build-up structure formed over the multilayered core substrate and including multiple interlaminar insulation layers and multiple conductor circuits. The stacked via structure has multiple vias formed in the multiple insulation layers, respectively. Each of the interlaminar insulation layers includes a resin material without a core material. The multiple insulation layers in the multilayered core substrate have three or more insulation layers and each of the insulation layers in the multilayered core substrate includes a core material impregnated with a resin.

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract: A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.

Abstract: A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material.

Abstract: An object of the present invention is to provide a multilayered printed circuit board having a short wiring distance of the conductor circuits, wide option of the design of the conductor circuits and additionally excellent in reliability since cracking scarcely takes place in the interlaminar resin insulating layers in the vicinity of via-holes. The present invention is a multilayered printed circuit board comprising: a conductor circuit and an interlaminar resin insulating layer serially formed on a substrate in alternate fashion and in repetition, wherein a connection of the conductor circuits through the interlaminar resin insulating layers is performed by a via-hole, wherein via-holes in different level layers among the via-holes are formed so as to form a stack-via structure, and wherein at least one of the land diameters of the above-mentioned via-holes in different level layers having the stack via structure is different from the land diameters of other via-holes.

Abstract: A multilayered printed circuit board including a substrate, a multilayered structure built thereon and having conductor circuits and interlaminar resin insulating layers in an alternate fashion, and one or more stack-via structures including via-holes stacked one another and electrically connected to the conductor circuits through the insulating layers. Each of the via-holes includes a land portion formed on a respective one of the insulating layers and a filled via structure portion filling an opening of the respective one of the insulating layers with a metal layer such that the via-holes are stacked one another immediately above the filled via structure portion of each via-hole, the via-holes include the outermost layer via-hole in the outermost layer of the insulating layers, and one or more via-holes have the land portion having the land diameter which is larger than the land diameter of the land portion of the outermost layer via-hole.

Abstract: A multilayer core board 10 includes tapered first via hole conductors 51 extending from the outer surface of a first insulating layer 24 to conductive portions 42a of a power source layer 42, second via hole conductors 52 extending from the outer surface of a second insulating layer 26 to the conductive portions 42a of the power source layer 42, tapered third via hole conductors 53 extending from the outer surface of the second insulating layer 26 to conductive portions 40a of a ground layer 40, and fourth via hole conductors 54 extending from the outer surface of a center insulating layer 22 to the conductive portions 40a of the ground layer 40. The first via hole conductors 51 are tapered, and thus the interval distance to the adjacent first via hole conductor 51 is shorter than straight-shaped first via hole conductors, and thus the pitch of the first via hole conductor 51 at the positive pole side and the fourth via hole conductor 54 at the negative pole side can be sufficiently reduced.

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.