Abstract: A positive resist composition is disclosed, comprising (A) a resin containing at least one repeating unit represented by the following formula (I) and at least one repeating unit represented by formula (VII), which decomposes under the action of an acid to increase the solubility in an alkali developer, and (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation.

Abstract: A positive photosensitive composition comprising (A) a specific acid generator that generates an acid upon irradiation of an actinic ray or radiation, and (B) a resin that has a monocyclic or polycyclic alicyclic hydrocarbon structure and is decomposed by the action of an acid to increase solubility in an alkali developing solution.

Abstract: A positive photoresist composition for exposure to a far ultraviolet ray which comprises (A) a compound which generates an acid upon irradiation with an actinic ray or radiation, (B) a resin which contains a repeating unit corresponding to hydroxystyrene and solubility of which increases in an alkaline developing solution by the action of an acid, and (C) (1) at least one solvent selected from the group consisting of propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether propionate, and (2) at least one solvent selected from the group consisting of propylene glycol monomethyl ether and ethoxyethyl propionate. The positive photoresist composition of the present invention is suitable for exposure to a far ultraviolet ray, particularly a KrF excimer laser beam, is improved in line edge roughness and micro grain, is excellent in uniformity of carting on a substrate and has less particles in its resist solution.

Abstract: A positive photoresist composition comprises: a compound capable of generating an acid upon irradiation with an actinic ray or a radiation, in which the compound contains (A1) a sulfonate compound of a sulfonium, and (A2) a sulfonate compound of an N-hydroxyimide or a disulfonyldiazomethane compound; and a resin capable of decomposing by the action of an acid to increase the solubility in an alkali developing solution, in which the resin contains a repeating unit having a specific lactone structure.

Abstract: The present invention provides a positive electron beam or X-ray resist composition containing (a) a compound which generates an acid by the irradiation with radiation and (b) a compound having a cationic polymerizable function. The positive electron beam or X-ray resist composition is high sensitivity, has high resolution, can provide an excellent rectangular pattern profile, and is excellent in PCD stability and PED stability.

Abstract: A positive resist composition comprises: (A) a resin having an aliphatic cyclic hydrocarbon group and increasing the solubility to an alkali developer by the action of an acid; (B) a compound generating an acid upon irradiation with an actinic ray or radiation; and (C) a nitrogen-containing compound having in the molecule at least one partial structure represented by following formula (I).

Abstract: A positive resist composition comprises (A) a resin capable of decomposing by the action of an acid to increase solubility in an alkali developer, and (B) a compound capable of generating an aromatic sulfonic acid substituted with at least one group containing a fluorine atom upon irradiation with one of an actinic ray and radiation.

Abstract: A positive photosensitive composition is disclosed which comprises a compound generating an acid upon irradiation with actinic rays or a radiation and a resin having groups which decompose by the action of an acid to enhance solubility in an alkaline developing solution, said resin being obtained by reacting an alkali-soluble resin having phenolic hydroxyl groups with at least one specific enol ether compound under acid conditions in a specific organic solvent. The positive photosensitive composition shows improved discrimination between nonimage areas and image areas, has high sensitivity, high resolving power, and high heat resistance, suffers little change in performance with the lapse of time from exposure to light to heat treatment (PED), and is free from defects, e.g., development defects.

Abstract: The present invention provides a positive electron beam or X-ray resist composition containing (a) a compound which generates an acid by the irradiation with radiation and (b) a compound having a cationic polymerizable function. The positive electron beam or X-ray resist composition is high sensitivity, has high resolution, can provide an excellent rectangular pattern profile, and is excellent in PCD stability and PED stability.

Abstract: A positive photoresist composition is disclosed, comprising a resin having a structural unit containing a specific group and capable of decomposing under the action of an acid to increase the solubility in an alkali developer, a resin having a structural unit containing a specific group and capable of decomposing under the action of an acid to increase the solubility in an alkali developer, and a compound capable of generating an acid upon irradiation with actinic rays or radiation.

Abstract: A positive photoresist composition for exposure to a far ultraviolet ray which comprises (A) a compound which generates an acid upon irradiation with an actinic ray or radiation, (B) a resin which contains a repeating unit corresponding to hydroxystyrene and solubility of which increases in an alkaline developing solution by the action of an acid, and (C) (1) at least one solvent selected from the group consisting of propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether propionate, and (2) at least one solvent selected from the group consisting of propylene glycol monomethyl ether and ethoxyethyl propionate. The positive photoresist composition of the present invention is suitable for exposure to a far ultraviolet ray, particularly a KrF excimer laser beam, is improved in line edge roughness and micro grain, is excellent in uniformity of carting on a substrate and has less particles in its resist solution.

Abstract: The present invention provides a positive photosensitive composition comprising a compound having a group represented by the following general formula (Ia) or (Ib) which decomposes by the action of an acid to enhance its solubility in an alkaline developing solution and a compound which generates an acid upon irradiation with actinic rays or radiation: wherein R1a and R2a each represent a hydrogen atom or a C1-4 alkyl group; Wa represents a single bond or a divalent organic group; R3a represents a group which decomposes the action of an acid; R1b and R2b each represent a hydrogen atom or a C1-4 alkyl group; Wb represents a divalent organic group; and R3b represents a C11-20 chain alkyl group which may have substituents, a C11-20 cyclic alkyl group which may have substituents, a C11-30 aryl group which may have substituents or a C12-30 aralkyl group which may have substituents.

Abstract: The present invention provides an excellent chemically-sensitized positive-working photoresist composition which exhibits a high resolution and a good dimensional stability with time, generates no development residue (scum) and standing waves and is less liable to loss of lone pattern. A novel positive-working photoresist composition is provided comprising at least (a) a copolymer A having at least structural units representedby the following general formulae (I), (II) and (III), (b) a compound which generates an acid when irradiated with actinic rays or radiation and (c) a solvent: ##STR1## wherein R.sub.1 and R.sub.2 each independently represent a hydrogen atom or methyl group; R.sub.3 represents a tertiary alkyl or cycloalkyl group which may be substituted; and X represents a divalent organic residue.

Abstract: A positive working photosensitive composition comprising a resin having repeating units represented by the following formulae (I), (II) and (III), respectively and a compound which generates an acid with irradiation of an active ray or radiation: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents --C(.dbd.O)--O--C(R.sub.6) (R.sub.7) (R.sub.8) or --O--R.sub.5 --C(.dbd.O)--O--(R.sub.6) (R.sub.7) (R.sub.8); R.sub.3 represents --O--C(R.sub.6)(R.sub.7) (R.sub.8), --O--Si(R.sub.6)(R.sub.7)(Rs) or --O--C(R.sub.9)(R.sub.10)--OR.sub.11 ; R.sub.4 represents a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an alkoxy group, an acyl group or an acyloxy group; R.sub.5 represents an alkylene group; R.sub.6, R.sub.7, R.sub.8, R.sub.9 and R.sub.10 each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkenyl group, provided that at least two among R.sub.6, R.sub.7 and R.sub.8 are groups other than a hydrogen atom; R.sub.

Abstract: A positive photoresist composition is disclosed which comprises (a) a resin obtained from an alkali-soluble resin containing phenolic hydroxyl groups by replacing from 10 to 80% of the phenolic hydroxyl groups each with a group having a specific structure, (b) a compound which generates an acid upon irradiation with actinic rays or a radiation, and (c) a solvent. This composition is an excellent, chemically amplified photoresist composition which has high resolution and gives a resist pattern having no depressions in an upper part thereof and having satisfactory adhesion to the substrate.

Abstract: Disclosed is a chemically amplified positive resist composition which comprises (A) a compound which contains at least one group selected among tert-alkyl ester groups and tert-alkyl carbonate groups and is capable of increasing solubility of the compound in an alkali aqueous solution by the action of an acid, (B) a compound which contains at least one group selected among acetal groups and silyl ether groups and is capable of increasing solubility of the compound in an alkali aqueous solution by the action of an acid, (C) a compound which is capable of generating an acid by irradiation with an active ray or radiation, and (D) an organic basic compound. The resist composition has high resolving power and forms a satisfactory pattern free from undergoing sensitivity decrease, T-top formation, and change in line width which are caused from exposure to post exposure bake.

Abstract: A positive chemically amplified resist composition is disclosed, comprising (a) a compound which generates an acid upon irradiation with active light or radiant ray; (b) a resin insoluble in water but soluble in an aqueous alkali solution; and (c) a low molecular acid-decomposable dissolution inhibitor having a molecular weight of 3,000 or less and containing an acid-decomposable alkyl ester group represented by formula (I), and which increases its solubility in an alkali developer by the action of an acid, and having a sodium content and a potassium content each of 30 ppb or less. Also disclosed is a positive chemically amplified resist composition comprising the foregoing compound (a) and (d) a resin having an acid-decomposable alkyl ester group represented by formula (I), and which increases its solubility in an alkali developer by the action of an acid, and having a sodium content and a potassium content each of 30 ppb or less. Still further disclosed are methods for producing the compounds (c) and (d).

Abstract: A silver halide photographic material comprises a silver halide emulsion layer provided on a support. The silver halide emulsion layer contains a heterocyclic selenium or tellurium compound represented by the formula (Ia), (Ib), (Ic) or (Id): ##STR1## in which each of Ch.sup.1, Ch.sup.3, Ch.sup.6 and Ch.sup.12 is Se or Te; and each of Ch.sup.2, Ch.sup.4, Ch.sup.5, Ch.sup.7, Ch.sup.8, Ch.sup.9, Ch.sup.10, Ch.sup.11, Ch.sup.13, Ch.sup.14 and Ch.sup.15 is O, S, Se or Te. Other selenium or tellurium compounds are also disclosed.

Abstract: A silver halide photographic material comprises a silver halide emulsion layer provided on a support. In the photographic material of the present invention, the silver halide emulsion layer contains a tellurium compound represented by the formula (I) or (II): ##STR1## in which each of R.sup.11 and R.sup.12 is --OR.sup.13, --NR.sup.14 R.sup.15, --SR.sup.16 or hydrogen; R.sup.11 and R.sup.12 may be combined with each other to form a heterocyclic ring; each of R.sup.21 and R.sup.22 is an alkyl, alkenyl, alkynyl, aralkyl, aryl or heterocyclic group, --OR.sup.23, --NR.sup.24 R.sup.25, --SR.sup.26 or hydrogen; R.sup.21 and R.sup.22 may be combined with each other to form a heterocyclic ring; each of X.sup.1 and X.sup.2 is oxygen, sulfur or .dbd.NR.sup.17 ; each of X.sup.3 and X.sup.4 is oxygen, sulfur or .dbd.NR.sup.27 ; each of R.sup.13, R.sup.14, R.sup.15, R.sup.16, R.sup.17, R.sup.23, R.sup.24, R.sup.25, R.sup.26 and R.sup.27 is an alkyl, alkenyl, alkynyl, aralkyl, aryl or heterocyclic group or hydrogen; R.sup.

Abstract: Therapeutical treatment of diabetes by oral or parenteral administration of Vitamine E nicotinate which exhibits remarkable effects for treatment of diabetes without accompanying injurious side effect.